SK hynix Indiana fab breaks ground as new hub for US AI innovation
...(fourth), HBM3E (fifth), and HBM4 (sixth).
* Advanced Packaging: An advanced semiconductor back-end process techno...
August 28, 2026
'HBM3E' Results
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SK hynix Presents a Full Lineup of Memory Solutions Optimized for AI Infrastructure at DTF 2026... lineup — HBM3E, HBM4, and HBM4E — along with the 192GB SOCAMM2*, which improves power and space efficiency with it...August 26, 2026 -
[Tech Note] Hybrid Bonding: Evolving into a Foundational Technology for Improving Semiconductor Performance...2E, HBM3, HBM3E, and HBM4. Bump-less Chip Connections Enable High Efficiency and Bandwidth, Drawing Partic...August 25, 2026 -
The Next-Generation Memory Architecture in the AI Era? SK hynix Charts the Direction at ‘FMS 2026’... → HBM3 → HBM3E → HBM4 → HBM4E. * CXL (Compute Express Link): An interface technology that efficiently connects me...August 7, 2026 -
From HBM to eSSD: How SK hynix is charting the future of full-stack memory...ntered on HBM3E and HBM4 at major global technology events. HBM4 is a next-generation product designed to address t...July 8, 2026 -
[Expert POV] From AI semiconductors to AI services: How the ecosystem is evolving...2E, HBM3, HBM3E, and HBM4. AI is no longer a competition defined solely by software or models. To deliver AI servi...July 6, 2026 -
Why advanced memory matters in the AI infrastructure era...2E, HBM3, HBM3E and HBM4. * SOCAMM (Small Outline Compression Attached Memory Module): An AI server-optimized memo...July 3, 2026 -
SK hynix Showcases Tech Leadership as ‘Full Stack AI Memory Creator’ at HPED 2026, Reaffirming Strong Partnership with HPE... → HBM3 → HBM3E → HBM4. * CXL (Compute Express Link): A next-generation interface that efficiently connects CPUs, ...June 19, 2026 -
[SOD’s Review] COMPUTEX 2026: SK hynix beyond memory – how the AI factory era is reshaping the company’s identity... deployed HBM3E delivers approximately 1.2 TB/s (terabytes per second) of bandwidth per stack. HBM4, which SK hynix...June 11, 2026 -
Memory Solutions Grab the AI Wave — SK hynix Makes Its Mark at COMPUTEX 2026...2E, HBM3, HBM3E, and HBM4. Memory Technology in Action within Real AI Solutions ▲ The AI Factor...June 2, 2026 -
SK Group Chairman Chey Tae-won Attends GTC Taipei 2026 Keynote, Reinforcing Vision as ‘An Innovative Partner to Build the Next-Gen AI Architecture Together’... → HBM3 → HBM3E → HBM4. A Partnership Forged Through Meeting After Meeting – Reaffirmed in Taipei T...June 1, 2026 -
What Brought Dell and SK hynix Together in Las Vegas? From HBM to cSSD, Reaffirming the Limitless Scalability of AI Memory...neration (HBM3E), and 6th generation (HBM4) SK hynix Expands Its Influence Across the AI Infrastruct...May 20, 2026