{"id":10317,"date":"2026-06-18T05:55:25","date_gmt":"2026-06-18T05:55:25","guid":{"rendered":"http:\/\/skhynix-prd-alb-526071671.us-east-1.elb.amazonaws.com\/?p=10317"},"modified":"2026-06-18T10:50:53","modified_gmt":"2026-06-18T10:50:53","slug":"sk-hynix-ships-samples-of-12-layer-next-gen-hbm4e-2","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/sk-hynix-ships-samples-of-12-layer-next-gen-hbm4e-2\/","title":{"rendered":"SK hynix Ships Samples of 12-Layer Next-Gen \u2018HBM4E\u2019"},"content":{"rendered":"<p><strong>News Highlights<\/strong><\/p>\n<div class=\"post-intro\"><strong>\u00b7 Delivers 12-high HBM4E samples to major customers<\/strong><br \/>\n<strong>\u00b7 Achieves a maximum speed of 16Gbps per pin with improvements in both performance and efficiency<\/strong><br \/>\n<strong>\u00b7 Utilizes Advanced MR-MUF, reducing heat resistance by 17% while improving stability<\/strong><br \/>\n<strong>\u00b7 \u201cSK hynix strengthens its AI leadership with HBM4E based on its market-leading technological capabilities and manufacturing expertise\u2026 delivering the value needed in the market\u201d<\/strong><\/div>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-10321\" src=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/18055319\/HBM4E_01-1024x768-1.jpg\" alt=\"\" width=\"1024\" height=\"768\" srcset=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/18055319\/HBM4E_01-1024x768-1.jpg 1024w, https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/18055319\/HBM4E_01-1024x768-1-300x225.jpg 300w, https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/18055319\/HBM4E_01-1024x768-1-768x576.jpg 768w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<p>\u00a0<\/p>\n<p><strong>Seoul, June 18, 2026<\/strong> \u2013 SK hynix Inc. (or \u201cthe company\u201d, www.skhynix.com) announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers.<\/p>\n<p>\u201cThe company was able to deliver samples of the 12-stack HBM4E on schedule thanks to its advanced HBM development and production expertise for HBM,\u201d said SK hynix, adding that \u201cWe will work closely with partners for mass production in a timely manner.\u201d<\/p>\n<p>The 12-layer HBM4E shows improvements in both performance and power efficiency. The product features a maximum data processing speed of 16Gbps per pin and power efficiency that is up more than 20 percent from previous models. These enhancements improve data processing capabilities for AI training and inference.<\/p>\n<p>The HBM4E reduces data transfer latency through its latest interface and design optimization while maintaining stable operation in high-bandwidth environments. This enables customers to increase efficiency in processing data for AI datacenters and large-scale computing systems.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-10324\" src=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/18055349\/SK%ED%95%98%EC%9D%B4%EB%8B%89%EC%8A%A4_HBM4E_%EC%9D%B8%ED%8F%AC%EA%B7%B8%EB%9E%98%ED%94%BD_en_v02-1.png\" alt=\"\" width=\"1000\" height=\"560\" srcset=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/18055349\/SK%ED%95%98%EC%9D%B4%EB%8B%89%EC%8A%A4_HBM4E_%EC%9D%B8%ED%8F%AC%EA%B7%B8%EB%9E%98%ED%94%BD_en_v02-1.png 1000w, https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/18055349\/SK%ED%95%98%EC%9D%B4%EB%8B%89%EC%8A%A4_HBM4E_%EC%9D%B8%ED%8F%AC%EA%B7%B8%EB%9E%98%ED%94%BD_en_v02-1-300x168.png 300w, https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/18055349\/SK%ED%95%98%EC%9D%B4%EB%8B%89%EC%8A%A4_HBM4E_%EC%9D%B8%ED%8F%AC%EA%B7%B8%EB%9E%98%ED%94%BD_en_v02-1-768x430.png 768w\" sizes=\"auto, (max-width: 1000px) 100vw, 1000px\" \/><\/p>\n<p>SK hynix utilizes Advanced MR-MUF1 technology for HBM4E products to achieve a 48GB capacity in a 12-layer stack while ensuring structural stability. In particular, the company has also improved heat resistance by 17 percent, compared to the preceding HBM4, enabling stable operation of memory chips in high-performance computing environments.<\/p>\n<p>1MR-MUF (Mass Reflow Molded Underfill): A process used for stacking semiconductors by injecting liquid protective materials between chips to protect circuits.<\/p>\n<p>SK hynix has successfully supplied optimized memory solutions to customers based on its expertise in the mass production and supply of HBM3, HBM3E, and HBM4. Leveraging its market-proven product reliability and supply capabilities, the company will support the development of next-generation infrastructure while helping address AI system bottlenecks.<\/p>\n<p>\u201cSK hynix has laid the foundation to strengthen its AI leadership with HBM4E based on its market-leading technological capabilities and manufacturing expertise,\u201d said Ahn Hyun, President and Chief Development Officer, adding, \u201cThrough close collaboration with our partners, we will deliver the value needed in the market while reinforcing our technology leadership as a full-stack AI memory creator.\u201d<\/p>\n<p>\u00a0<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-10325\" src=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/18055417\/HBM4E_02-1024x768-1.jpg\" alt=\"\" width=\"1024\" height=\"768\" srcset=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/18055417\/HBM4E_02-1024x768-1.jpg 1024w, https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/18055417\/HBM4E_02-1024x768-1-300x225.jpg 300w, https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/18055417\/HBM4E_02-1024x768-1-768x576.jpg 768w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<div>\n<p><iframe loading=\"lazy\" title=\"SK hynix Ships Samples of 12-Layer Next-Gen \u2018HBM4E\u2019\" width=\"580\" height=\"326\" src=\"https:\/\/www.youtube.com\/embed\/RhwAEMl1hWc?feature=oembed\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" referrerpolicy=\"strict-origin-when-cross-origin\" allowfullscreen><\/iframe><\/p>\n<\/div>\n<p>\u00a0<\/p>\n<p><strong>About SK hynix Inc.<\/strong><\/p>\n<p>SK hynix Inc., headquartered in Korea, is the world\u2019s top-tier semiconductor supplier offering Dynamic Random Access Memory chips (\u201cDRAM\u201d) and flash memory chips (\u201cNAND\u00a0flash\u201d)\u00a0for a wide range of distinguished customers globally. The Company\u2019s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at\u00a0www.skhynix.com,\u00a0news.skhynix.com.<\/p>\n<p>\u00a0<\/p>\n<p><strong>Media Contact<\/strong><\/p>\n<p>SK hynix Inc.<br \/>\nGlobal Public Relations<\/p>\n<p>Technical Leader<br \/>\nYoungwon Kim<br \/>\nE-Mail:\u00a0global_pr@skhynix.com<\/p>\n","protected":false},"excerpt":{"rendered":"<p>News Highlights \u00b7 Delivers 12-high HBM4E samples to major customers \u00b7 Achieves a maximum speed of 16Gbps per pin with improvements in both performance and efficiency \u00b7 Utilizes Advanced MR-MUF, reducing heat resistance by 17% while improving stability \u00b7 \u201cSK<\/p>\n","protected":false},"author":23,"featured_media":10334,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":0,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[4],"tags":[12,14,13,1571,17],"class_list":["post-10317","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press","tag-ai","tag-ai-memory","tag-hbm","tag-hbm4e","tag-mr-muf","series-global-ai-company-hbm","series-global-ai-company"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/10317","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/23"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=10317"}],"version-history":[{"count":2,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/10317\/revisions"}],"predecessor-version":[{"id":10341,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/10317\/revisions\/10341"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/10334"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=10317"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=10317"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=10317"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}