{"id":1039,"date":"2025-10-26T23:30:00","date_gmt":"2025-10-26T23:30:00","guid":{"rendered":"http:\/\/localhost:8080\/sk-hynix-presents-next-generation-nand-storage-product-strategy-at-ocp-2025\/"},"modified":"2026-06-15T06:42:24","modified_gmt":"2026-06-15T06:42:24","slug":"sk-hynix-presents-next-generation-nand-storage-product-strategy-at-ocp-2025","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/sk-hynix-presents-next-generation-nand-storage-product-strategy-at-ocp-2025\/","title":{"rendered":"SK hynix Presents Next Generation NAND Storage Product Strategy at OCP 2025"},"content":{"rendered":"<p><strong>News Highlights<\/strong><\/p>\n<div class=\"post-intro\" style=\"text-align: justify;\"><strong>\u00b7 The company presented the \u2018AIN Family\u2019 which consists of NAND solution products optimized for performance(P), bandwidth(B), and density(D) respectively for AI<\/strong><br \/>\n<strong>\u00b7 SK hynix held \u2018HBF Night\u2019 to expand the \u2018AIN B\u2019(HBF product) ecosystem with a number of global big tech officials in attendance<\/strong><br \/>\n<strong>\u00b7 Company will collaborate closely with customers and partners to become a key player in the next generation NAND storage market<\/strong><\/div>\n<p><strong>Seoul, October 27, 2025<\/strong><\/p>\n<p>SK hynix Inc. (or \u201cthe company\u201d, <a href=\"https:\/\/www.skhynix.com\/eng\/main.do\" target=\"_blank\" rel=\"noreferrer noopener\">www.skhynix.com<\/a>) announced today that it presented its next-generation NAND storage product strategy at the \u20182025 OCP (Open Compute Project) Global Summit\u2019, held in San Jose, California, from October 13 to 16.<\/p>\n<p>SK hynix said that, with the rapid growth of the AI inference market, the demand for NAND storage products capable of process large volume data quickly and efficiently is increasing dramatically. The company will fulfill customer needs by establishing the \u2018AIN (AI-NAND) Family\u2019 lineup of solution products, optimized for the AI era.<\/p>\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-20361\" src=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/05\/27131335\/SK-hynix-Presents-Next-Generation-NAND-Storage-Product-Strategy-at-OCP-2025_02.jpg\" sizes=\"auto, (max-width: 1000px) 100vw, 1000px\" alt=\"\" width=\"1000\" height=\"563\" \/><\/p>\n<p class=\"caption\">\u25b2 Chunsung Kim, Head of eSSD Product Development, presenting on the AIN lineup<\/p>\n<\/figure>\n<p>Chun Sung Kim, Head of eSSD Product Development at SK hynix, presented the AIN Family during the Executive Session on the second day of the event.<\/p>\n<p>The AIN Family consists of NAND solution products optimized for performance, bandwidth, and density respectively which is designed to enhanced data processing speed and storage capacity.<\/p>\n<p>AIN P (Performance) is a solution to efficiently process large volume data generated under large-scale AI inference workloads. The product significantly boosts processing speed and energy efficiency by minimizing the bottleneck between storage and AI operations. SK hynix is designing NAND and controllers with new structures and plans to release samples by the end of 2026.<\/p>\n<p>AIN D (Density) is a high density solution designed to store large amount of data with low power consumption and cost suitable for storing AI data. The company targets to increase density to petabyte (PB) level from terabyte (TB) of current QLC<span style=\"color: #ff0000;\">*<\/span>-based SSDs, and to aim for mid-end storage solution which implements both the speed of SSD and the cost efficiency of HDD.<\/p>\n<p class=\"footnote\"><span style=\"color: #ff0000;\">*<\/span> QLC: NAND flash is categorized as single-level cell (SLC), multi-level cell (MLC), triple-level cell (TLC), QLC, and penta-level cell (PLC) depending on how many data bits can be stored in one cell. As the amount of information storage increases, more data can be stored in the same volume.<\/p>\n<p>AIN B (Bandwidth) is SK hynix\u2019s solution leveraging HBF<sup>TM2<\/sup> technology. This product expands bandwidth by vertically stacking multiple NANDs.<\/p>\n<p class=\"footnote\"><span style=\"color: #ff0000;\">*<\/span> HBF (High Bandwidth Flash): Similar to HBM which stacks DRAM dies, HBF is a product which is made by vertically stacking multiple NAND flash.<\/p>\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-20362\" src=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/05\/27131339\/SK-hynix-Presents-Next-Generation-NAND-Storage-Product-Strategy-at-OCP-2025_01.jpg\" sizes=\"auto, (max-width: 1000px) 100vw, 1000px\" alt=\"\" width=\"1000\" height=\"563\" \/><\/p>\n<p class=\"caption\">\u25b2 SK hynix delivering presentations at the OCP Global Summit 2025<\/p>\n<\/figure>\n<p>With global top level HBM development and production capabilities, SK hynix has been conducting researches on AIN B from early stage to address the memory capacity gap driven by the expansion of AI inference and scaling up of LLMs<span style=\"color: #ff0000;\">*<\/span>. The key is to combine HBM\u2019s stacking structure with high density and cost efficient NAND flash. The company is taking various strategies for AIN B into consideration, such as placing together with HBM to enhance overall system capacity.<\/p>\n<p class=\"footnote\"><span style=\"color: #ff0000;\">*<\/span> LLM (Large Language Model): An AI model trained on massive datasets that understands and generates natural language processing tasks.<\/p>\n<p>SK hynix jointly hosted \u2018HBF Night\u2019 with Sandisk, after both parties entered an MOU for HBF standardization in August, to expand the technology ecosystem. The event was held at The Tech Interactive, near the OCP Global Summit venue, on the 14<sup>th<\/sup>.<\/p>\n<p>At the event, a panel discussion featuring Korean and foreign faculty members was held, with the participation of numerous industry architects<span style=\"color: #ff0000;\">*<\/span> and engineers participated. During the event, a collaborative effort across the industry was proposed to accelerate innovation in NAND storage products.<\/p>\n<p class=\"footnote\"><span style=\"color: #ff0000;\">*<\/span> Architect: Semiconductor, system design experts<\/p>\n<p>\u201cThrough OCP Global Summit and HBF Night, we were able to showcase SK hynix\u2019s present and future as a global AI memory solution provider, thriving in a rapidly evolving AI market,\u201d Ahn Hyun, President and Chief Development Officer said. \u201cIn the next generation NAND storage market, SK hynix will collaborate closely with customers and partners to become a key player.\u201d<\/p>\n<p><strong>About SK hynix Inc.<\/strong><\/p>\n<p>SK hynix Inc., headquartered in Korea, is the world\u2019s top tier semiconductor supplier offering Dynamic Random Access Memory chips (\u201cDRAM\u201d) and flash memory chips (\u201cNAND flash\u201d) for a wide range of distinguished customers globally. The Company\u2019s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at <a href=\"https:\/\/www.skhynix.com\/eng\/main.do\" target=\"_blank\" rel=\"noreferrer noopener\">www.skhynix.com<\/a>, <a href=\"https:\/\/news.skhynix.com\/\" target=\"_blank\" rel=\"noreferrer noopener\">news.skhynix.com<\/a>.<\/p>\n<p><strong>Media Contact<\/strong><\/p>\n<p>SK hynix Inc.<br \/>\nGlobal Public Relations<\/p>\n<p>Technical Leaders<br \/>\nMinseok Jang, Sooyeon Lee, Kanga Kong<br \/>\nE-Mail: <a href=\"mailto:global_pr@skhynix.com\" target=\"_blank\" rel=\"noreferrer noopener\">global_pr@skhynix.com<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>News Highlights The company presented the \u2018AIN Family\u2019 which consists of NAND solution products optimized for performance(P), bandwidth(B), and density(D) respectively for AI SK hynix held \u2018HBF Night\u2019 to expand the \u2018AIN B\u2019(HBF product) ecosystem with a number of global big tech officials in attendance Company will collaborate closely with customers and partners to become [\u2026]<\/p>\n","protected":false},"author":23,"featured_media":1036,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":20359,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[4],"tags":[14,78,19,76,77],"class_list":["post-1039","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press","tag-ai-memory","tag-ain","tag-nand","tag-ocp-global-summit","tag-ocp-global-summit-2025"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/1039","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/23"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=1039"}],"version-history":[{"count":3,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/1039\/revisions"}],"predecessor-version":[{"id":9307,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/1039\/revisions\/9307"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/1036"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=1039"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=1039"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=1039"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}