{"id":1111,"date":"2025-09-02T23:30:00","date_gmt":"2025-09-02T23:30:00","guid":{"rendered":"http:\/\/localhost:8080\/sk-hynix-introduces-industrys-first-commercial-high-na-euv\/"},"modified":"2026-06-15T06:44:21","modified_gmt":"2026-06-15T06:44:21","slug":"sk-hynix-introduces-industrys-first-commercial-high-na-euv","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/sk-hynix-introduces-industrys-first-commercial-high-na-euv\/","title":{"rendered":"SK hynix Introduces Industry\u2019s First Commercial High NA EUV"},"content":{"rendered":"<p><strong>News Highlights<\/strong><\/p>\n<div class=\"post-intro\" style=\"text-align: justify;\"><strong>\u00b7 Brings ASML\u2019s EXE:5200B, critical system for next-generation chips, to M16 fab<\/strong><br \/>\n<strong>\u00b7 Improved precision, density by 1.7x and 2.9x to help competitive production<\/strong><br \/>\n<strong>\u00b7 Company to lead AI memory with cutting-edge tech required by key industries<\/strong><\/div>\n<p><strong>Seoul, September 3, 2025<\/strong><\/p>\n<p>SK hynix Inc. (or \u201cthe company\u201d, <a title=\"\" href=\"https:\/\/www.skhynix.com\/eng\/main.do\" target=\"_blank\" rel=\"noopener\">www.skhynix.com<\/a>) announced today that it has assembled the industry\u2019s first High NA<span style=\"color: #ff0000;\">*<\/span> EUV<span style=\"color: #ff0000;\">*<\/span> lithography system for mass production at the M16 fabrication plant in Icheon, South Korea.<\/p>\n<p class=\"footnote\"><span style=\"color: #ff0000;\">*<\/span> NA (Numerical Aperture): A measure of an optical system\u2019s ability to collect light. A higher NA enables a more precise pattern<br \/>\n<span style=\"color: #ff0000;\">*<\/span> High NA EUV (High Numerical Aperture Extreme Ultraviolet Lithography): A next-generation lithography system that delivers much better resolution by applying a larger NA, compared with an earlier EUV system. By enabling the world\u2019s finest patterns, it is expected to help shrink the pattern and improve density.<\/p>\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-20211\" src=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/05\/27132820\/SK-hynix_Introduces-Industrys-First-High-NA-EUV-for-Production_Image-01.jpg\" sizes=\"auto, (max-width: 1000px) 100vw, 1000px\" alt=\"\" width=\"1000\" height=\"564\" \/><\/p>\n<p class=\"caption\">\u25b2 Attendees gathered at the event to commemorate the industry-first introduction of the High NA EUV system at the M16 fab<\/p>\n<\/figure>\n<p>At an event to commemorate the assembly of the system, SK hynix\u2019s Head of R&amp;D Cha Seon Yong, Head of Manufacturing Technology Lee Byoungki and ASML\u2019s Head of Customer Team SK hynix-Japan Kim Byeong-Chan celebrated the introduction of the equipment to produce next-generation DRAM.<\/p>\n<p>The move lays the foundation for a swift development and supply of the cutting-edge products that meet customer demand amid intense competition of the global semiconductor industry. SK hynix aims to enhance credibility and stability of the global supply chain through close collaboration with business partners.<\/p>\n<p>A sophisticated process technology to scale memory cells is critical to advance productivity and product performance. A more sophisticated pattern leads to an increase in the number of chips produced from a wafer and an improvement in power efficiency and performance.<\/p>\n<p>SK hynix has been expanding the scope of EUV adoption for production of the most advanced DRAM since the first introduction of the technology in 2021 for the 1anm, the fourth generation of the 10nm tech. The assembly of the next-generation technology system that outperforms the existing EUV equipment comes amid the company\u2019s efforts to prepare for the industry\u2019s requirement for extreme scaling and high density.<\/p>\n<p>The TWINSCAN EXE:5200B, the first model for volume production of ASML\u2019s High NA EUV product line, enables printing of transistors 1.7 times smaller and achievement of transistor densities 2.9 times higher, compared with the existing EUV system, with a 40% improvement in the NA to 0.55 from 0.33.<\/p>\n<p>With the adoption of the new system, SK hynix plans to simplify the existing EUV process and accelerate the development of the next-generation memory to advance product performance and cost competitiveness. The company also aims to enhance its position in the high-value memory product market and make its technological leadership stronger.<\/p>\n<p>\u201cHigh NA EUV is a critical technology that opens the next chapter of the semiconductor industry,\u201d said Kim at ASML. \u201cASML will closely collaborate with SK hynix to bring forward the innovation of the next-generation memory.\u201d<\/p>\n<p>\u201cWe expect the addition of the critical infrastructure to bring our technological vision we have been pursuing into reality,\u201d said Cha at SK hynix. \u201cWe aim to enhance our leadership in the AI memory space with the cutting-edge technology required by the fast-growing AI and next-generation computing markets.\u201d<\/p>\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-20220\" style=\"object-fit: cover;\" src=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/05\/27132825\/SK-hynix_Introduces-Industrys-First-High-NA-EUV-for-Production_Image-02-2.jpg\" sizes=\"auto, (max-width: 1000px) 100vw, 1000px\" alt=\"\" width=\"1000\" height=\"1327\" \/><\/p>\n<p class=\"caption\">\u25b2 SK hynix\u2019s Head of R&amp;D Cha Seon Yong speaking at the event<\/p>\n<\/figure>\n<p><strong>About SK hynix Inc.<\/strong><\/p>\n<p>SK hynix Inc., headquartered in Korea, is the world\u2019s top tier semiconductor supplier offering Dynamic Random Access Memory chips (\u201cDRAM\u201d) and flash memory chips (\u201cNAND flash\u201d) for a wide range of distinguished customers globally. The Company\u2019s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at <a title=\"\" href=\"https:\/\/www.skhynix.com\/eng\/main.do\" target=\"_blank\" rel=\"noopener\">www.skhynix.com<\/a>, <a title=\"\" href=\"https:\/\/news.skhynix.com\/\" target=\"_blank\" rel=\"noopener\">news.skhynix.com<\/a>.<\/p>\n<p><strong>Media Contact<\/strong><\/p>\n<p>SK hynix Inc.<br \/>\nGlobal Public Relations<\/p>\n<p><em>Technical Leaders<\/em><br \/>\nKanga Kong, Minseok Jang, Sooyeon Lee<br \/>\nE-Mail: <a title=\"\" href=\"mailto:global_pr@skhynix.com\" target=\"_blank\" rel=\"noopener\">global_pr@skhynix.com<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>News Highlights Brings ASML\u2019s EXE:5200B, critical system for next-generation chips, to M16 fab Improved precision, density by 1.7x and 2.9x to help competitive production Company to lead AI memory with cutting-edge tech required by key industries Seoul, September 3, 2025 SK hynix Inc. (or \u201cthe company\u201d, www.skhynix.com) announced today that it has assembled the industry\u2019s [\u2026]<\/p>\n","protected":false},"author":23,"featured_media":1108,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":20023,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[4],"tags":[14,86,51,81,85],"class_list":["post-1111","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press","tag-ai-memory","tag-asml","tag-dram","tag-euv","tag-high-na-euv"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/1111","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/23"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=1111"}],"version-history":[{"count":3,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/1111\/revisions"}],"predecessor-version":[{"id":9311,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/1111\/revisions\/9311"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/1108"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=1111"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=1111"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=1111"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}