{"id":1493,"date":"2025-02-19T06:00:48","date_gmt":"2025-02-19T06:00:48","guid":{"rendered":"http:\/\/localhost:8080\/sk-hynix-kangwook-lee-becomes-industry-first-packaging-executive-to-win-dawon-kahng-award\/"},"modified":"2026-07-17T03:51:06","modified_gmt":"2026-07-17T03:51:06","slug":"sk-hynix-kangwook-lee-becomes-industry-first-packaging-executive-to-win-dawon-kahng-award","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/sk-hynix-kangwook-lee-becomes-industry-first-packaging-executive-to-win-dawon-kahng-award\/","title":{"rendered":"SK hynix\u2019s Kangwook Lee Becomes Industry\u2019s First Packaging Executive to Win Dawon Kahng Award"},"content":{"rendered":"

\"\"<\/p>\n

\u25b2 Kangwook Lee proudly holds the Dawon Kahng Award<\/p>\n

Kangwook Lee, head of Package Development at SK hynix, received the 8th Dawon Kahng Award*<\/span> in the Device and Process category at the 32nd Korean Conference on Semiconductors (KCS), held on February 13 in Gangwon-do Province, South Korea.<\/p>\n

*<\/span> Dawon Kahng Award: Presented by KCS, this award recognizes one individual in the Device\/Process category and another in the Circuit\/System category for their contributions to the semiconductor industry.<\/p>\n

Established in recognition of the esteemed Dr. Dawon Kahng, who developed the MOSFET*<\/span> and floating gate*<\/span>, this award has traditionally been given to renowned professors specializing in the front-end process such as the semiconductor device and process fields. However, the 2025 award is garnering significant attention as, for the first time, the winner of the Device and Process category is a business leader in the back-end process field, specifically in semiconductor packaging.<\/p>\n

*<\/span> Metal-oxide-semiconductor field-effect transistor (MOSFET): A transistor that utilizes the effect of an electric field through a metal-oxide-semiconductor (MOS) structure.
\n*<\/span> Floating gate: A structure in flash memory that retains electronic values even without power.<\/p>\n

To learn more about this monumental achievement, the SK hynix Newsroom spoke with Lee about his win and his contributions to semiconductor packaging.<\/p>\n

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A Prestigious Award Recognizing SK hynix\u2019s Status & Prowess<\/h3>\n
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Lee, a leading expert in semiconductor packaging technology, brings over 27 years of research and development experience in the fields of 3D packaging*<\/span> and integrated circuits having worked in global academia and industry roles. Earning his Ph.D. from Tohoku University in Japan in 2000, he first worked at Rensselaer Polytechnic Institute in the U.S. as a postdoctoral researcher and later as a professor at Tohoku University before joining SK hynix in 2018. After entering the company, Lee developed South Korea\u2019s first TSV*<\/span> technology and paved the way for the success of SK hynix\u2019s AI memory by applying MR-MUF*<\/span> to HBM2E\u2014 the third generation of HBM*<\/span>.<\/p>\n

*<\/span> 3D packaging: A packaging method that vertically connects chips, allowing data to be sent and received directly between the chips with technologies such as through-silicon via (TSV).
\n*<\/span> Through-silicon via (TSV): A type of vertical interconnect access (via) that passes through a silicon die, enabling the stacking of layers and signal transmission between them.
\n*<\/span> Mass reflow-molded underfill (MR-MUF): A process in which a liquid protective material is injected between the spaces of stacked chips before hardening to protect the circuits. MR-MUF offers more efficient and effective heat dissipation compared to the method of laying a film material between each chip.
\n*<\/span> High Bandwidth Memory (HBM): A high-value, high-performance product that vertically connects multiple DRAMs to dramatically increase the data processing speed compared to existing DRAMs. There are five generations of HBM, starting with the original HBM and followed by HBM2, HBM2E, HBM3, and HBM3E\u2014an extended version of HBM3.<\/p>\n

\"Lee<\/p>\n

\u25b2 Lee is a recognized leader in semiconductor packaging technology<\/p>\n

\u201cResearch on TSV-based 3D packaging has led to commercialized products in various fields, with HBM being the most notable example,\u201d he explained. \u201cSK hynix\u2019s proprietary packaging technology, MR-MUF, has enabled the stable mass production of highly complex HBM with high manufacturing yield and scalability, while also improving key characteristics such as thermal dissipation performance. This technology was first applied to HBM2E and contributed to SK hynix\u2019s rise as the global AI memory leader. Through continuous technological advancements, MR-MUF has been successfully applied to HBM3 and HBM3E, further strengthening SK hynix\u2019s HBM market leadership.\u201d<\/strong><\/p>\n

\"The<\/p>\n

\u25b2 The Dawon Kahng Award recognizes outstanding talents in the semiconductor industry<\/p>\n

Lee boasts an impressive list of awards to match his significant achievements. One such honor came in 2024 when he became the first Korean recipient of the IEEE EPS Electronics Manufacturing Technology Award<\/a>. Having now added the Dawon Khang Award to his list of accolades, he revealed the latest award is particularly meaningful for him.<\/p>\n

\u201cI am honored to receive an award that holds great significance in the industry,\u201d he said. \u201cAbove all, I feel a deep sense of fulfillment as it recognizes SK hynix\u2019s standing and the exceptional capabilities of the Package Development department. Although I\u2019m humbled by this award, I take it as encouragement to contribute even more to advancing the semiconductor industry. I also want to thank the Package Development members for their dedication and hard work.\u201d<\/strong><\/p>\n

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Packaging Technology & One-Team Collaboration at the Heart of Semiconductor Innovation<\/h3>\n
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Reflecting on the award, Lee particularly values the achievement as he became the first industry executive from the packaging field to receive the prize.<\/p>\n

\"Lee<\/p>\n

\u25b2 Lee has over 27 years of research experience in 3D packaging and integrated circuits<\/p>\n

\u201cThe paradigm of semiconductor technology advancement is shifting from miniaturization to packaging, elevating the back-end process to an equal standing with the front-end. Companies now play a more critical role in driving innovation than ever before. In other words, packaging technology and companies are at the heart of semiconductor innovation. I believe this award highlights and reinforces this pivotal shift,\u201d he emphasized.<\/strong><\/p>\n

Lee also predicted that packaging technology would become even more important. He explained that the evolution of packaging technology is driving the growth of new industries and that packaging capabilities will be a key factor in determining not only business value but also future survival. \u201cThe competition among global companies to secure packaging technology and strengthen semiconductor dominance has already begun,\u201d he said. \u201cThe Package Development department will respond to this competition with solid technological expertise and strong \u2018one-team\u2019 collaboration.\u201d<\/p>\n

\u201cPackage Development members possess a fearless spirit of challenge and an unwavering determination to resolve issues to the very end. This is the foundation of our overwhelming technological prowess,\u201d he stated. \u201cFurthermore, SK hynix\u2019s strong \u2018one-team\u2019 culture has been the driving force behind its successful semiconductor innovations. Thanks to this, we were able to successfully implement MR-MUF technology and secure a leading position in the HBM market. Moving forward, the company will continue to pioneer future markets with a spirit of challenge and a collaborative mindset, driving further innovation.\u201d<\/strong><\/p>\n

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Securing Advanced Packaging Technologies by Fostering a Spirit of Challenge<\/h3>\n
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Lee also shared his two key development plans to respond to future market demands, including advancing HBM packaging technology and securing heterogeneous integration technology based on chiplets*<\/span>.<\/p>\n

*<\/span> Chiplet: A technology that breaks up chips into functions and connects these separated pieces on a single substrate to enable heterogeneous bonding and integration.<\/p>\n

\"Lee<\/p>\n

\u25b2 Lee aims to meet the demands of next-generation AI systems<\/p>\n

\u201cWe must continue innovating in HBM packaging technology to meet the demands of large-scale, high-performance, and energy-efficient AI systems,\u201d Lee said. \u201cTo achieve this, we\u2019re advancing MR-MUF technology and developing next-generation solutions including hybrid bonding*<\/span>. In the medium-to-long term, we plan to implement 2.5D and 3D SiP*<\/span> leveraging chiplet technology to respond to memory-centric*<\/span> needs. Moreover, we aim to enhance chip-to-chip connectivity by employing fan-out wafer-level packaging*<\/span> and hybrid bonding. This will enable us to secure advanced packaging technologies that improve performance and energy efficiency.\u201d<\/strong><\/p>\n

*<\/span> Hybrid bonding: A technology that directly connects chips without bumps when stacking, enabling thinner chips and high-layer products. SK hynix is looking at both Advanced MR-MUF and hybrid bonding methods for 16-layer and higher HBM products.
\n*<\/span> System-in-Package (SiP): A packaging technology that integrates multiple integrated circuits into a single unit, enabling it to perform most or all functions of an electronic system.
\n*<\/span> Memory-centric: A computing environment in which memory plays a key role in processing and managing data across devices.
\n*<\/span> Fan-Out Wafer-Level Packaging (FO-WLP): A back-end packaging technology for chips involving directly attaching data input\/output (I\/O) pads to the chip\u2019s outer area, eliminating the need for a substrate.<\/p>\n

Ultimately, Lee\u2019s strategy is to create a \u201ctotal semiconductor solution,\u201d integrating devices, processes, designs, and packaging to strengthen SK hynix\u2019s competitive advantage.<\/p>\n

Regarding this, he encouraged team members to keep pushing forward. \u201cIf we continue to demonstrate a spirit of challenge and a \u2018one-team\u2019 mindset, we can fully achieve our goals. By challenging ourselves and working together, we can develop technologies that go beyond simply creating \u2018good\u2019 products and truly change the world. I will actively support the team as they pave new paths as first movers.\u201d<\/p>\n

Looking back on his career, Lee underscored the importance of nurturing new talent. \u201cHaving received the prestigious Dawon Kahng Award, following my IEEE EPS Award, I feel a great sense of responsibility,\u201d he said. \u201cI want to foster an environment where younger engineers feel encouraged to take on new challenges. As an expert in the semiconductor industry, I will do my best to elevate SK hynix\u2019s and South Korea\u2019s global semiconductor competitiveness.\u201d<\/strong><\/p>\n

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