{"id":1752,"date":"2024-10-17T06:00:31","date_gmt":"2024-10-17T06:00:31","guid":{"rendered":"http:\/\/localhost:8080\/2024-ocp-global-summit-advancing-ai-and-data-center-memory\/"},"modified":"2026-06-11T16:40:32","modified_gmt":"2026-06-11T16:40:32","slug":"2024-ocp-global-summit-advancing-ai-and-data-center-memory","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/2024-ocp-global-summit-advancing-ai-and-data-center-memory\/","title":{"rendered":"SK hynix at the 2024 OCP Global Summit: Leading the Future of AI & Data Center Memory Solutions"},"content":{"rendered":"

\"SK<\/p>\n

SK hynix is showcasing its leading AI and data center memory products at the 2024 Open Compute Project (OCP) Global Summit<\/span><\/a> held October 15\u201317 in San Jose, California. The annual summit brings together industry leaders to discuss advancements in open source hardware and data center technologies. This year, the event\u2019s theme is \u201cFrom Ideas to Impact,\u201d which aims to foster the realization of theoretical concepts into real-world technologies.<\/p>\n

\"SK<\/p>\n

\u25b2 SK hynix\u2019s booth at the 2024 OCP Global Summit<\/p>\n

In addition to presenting its advanced memory products at the summit, SK hynix is also strengthening key industry partnerships and sharing its AI memory expertise through insightful presentations. This year, the company is holding eight sessions\u2014up from five in 2023\u2014on topics including HBM* <\/sup> and CMS* <\/sup>.<\/p>\n

* <\/sup>High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV).
\n* <\/sup>Compute Memory Solution (CMS): A memory solution optimized for AI, HPC, and data centers, enhancing speed, efficiency, and scalability for compute-heavy workloads.<\/p>\n

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Displays & Demonstrations at the Booth: Transforming AI & Data Centers<\/h3>\n
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Visitors to SK hynix\u2019s booth can see a range of the company\u2019s cutting-edge AI and data center solutions and view demonstrations with high-performance customer systems.<\/p>\n

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\u25b2 SK hynix\u2019s groundbreaking AI and data center products on display<\/p>\n

Among the products being demonstrated is CMM-Ax* <\/sup>, formerly known as CMS 2.0, which was shown under its new name for the first time. For the demonstration, SK hynix is highlighting the product\u2019s role in next-generation compute memory for AI infrastructure, particularly for multi-modal applications. Meanwhile, a heterogeneous memory management solution involving CMM (CXL Memory Module)-DDR5* <\/sup> and HMSDK* <\/sup> is also being demonstrated as well as Niagara 2.0* <\/sup>, which is illustrating its efficient utilization of pooled memory resources. Another demonstration is highlighting the computational storage drive\u2019s (CSD) AI storage capabilities for large-scale training systems.<\/p>\n

* <\/sup>CXL Memory Module-Ax (CMM-Ax): A high-performance memory module optimized for computational workloads, improving AI and data center efficiency.
\n* <\/sup>CXL Memory Module-DDR5 (CMM-DDR5): A next-gen DDR5 memory module based on CXL that enhances system bandwidth, speed, and performance for AI, cloud, and high-performance computing.
\n* <\/sup>Heterogeneous Memory Software Development Kit (HMSDK):\u00a0A software development kit specially designed to support CXL memory, a next-generation memory system based on the CXL open industry standard.
\n* <\/sup>Niagara 2.0: An integrated HW\/SW solution for pooled memory that allows multiple hosts (CPUs and GPUs) to efficiently share large memory pools to minimize unused or underutilized memory known as stranded memory. By supporting optimal data placement through hot and cold data detection, it can significantly improve system performance.<\/p>\n

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\u25b2 SK hynix is showcasing CXL-based solutions including CMM-Ax and Niagara 2.0<\/p>\n

In addition, a live demonstration of the GDDR6-AiM* <\/sup>-based accelerator card AiMX is being held using Meta\u2019s latest large language model (LLM), Llama3 70B, which has 70 billion parameters. The demonstration shows AiMX\u2019s capability to tackle industry challenges. For example, data centers\u2019 LLM services improve GPU efficiency by simultaneously processing requests from multiple users. However, as the length of the generated token increases, the computation of the attention layer* <\/sup> increases, lowering GPU efficiency. Through the demonstration, AiMX shows it can overcome this issue by handling large amounts of data while offering greater efficiency and lower power consumption compared to the latest accelerators.<\/p>\n

* <\/sup>Accelerator-in-Memory (AiM): SK hynix\u2019s PIM semiconductor product. PIM is next-generation technology that adds computational functions to memory semiconductors, solving the data transfer bottleneck in AI and big data processing fields.
\n* <\/sup>Attention layer: A mechanism which allows a model to determine the importance of input data to focus on more relevant information.<\/p>\n

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\u25b2 The AiMX card is being demonstrated with Meta\u2019s latest LLM, Llama3 70B<\/p>\n

The company also displayed a range of its industry-leading AI memory and data center products. HBM3E is shown along with the NVIDIA H200 Tensor Core GPU<\/a><\/span> and NVIDIA GB200 Grace Blackwell Superchip. The booth also features SK hynix\u2019s DDR5 RDIMM and MCR DIMM server DRAM, as well as enterprise SSDs (eSSDs), with Supermicro servers. The DDR5 products on display include the world\u2019s first DDR5 DRAM built using the 1c node, the sixth generation of the 10nm process technology. Designed to meet the growing computational and energy demands of AI-driven data centers, the 16 Gb 1c DDR5 offers improved performance and energy efficiency from the previous generation. Additionally, SK hynix unveiled the 1bnm 96 GB DDR5 which can reach speeds of up to 7,200 megabits per second (Mbps), making it ideal for supporting massive data flows in data centers.
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\u25b2 HBM3E is presented alongside NVIDIA\u2019s H200 and GB200, while DDR5 RDIMM and MCR DIMM products are shown with Supermicro servers<\/p>\n

In the SSD section, the Gen5 eSSDs PS1010 and PS1030\u00a0and the Gen4 PE9010 are among those on display. Offering ultra-fast read\/write speeds, these SSD solutions are vital for accelerating AI training and inference in large-scale environments. Through all these innovations, SK hynix is continuing to lead the way in AI memory and storage solutions, fueling the future of AI and transforming data center operations.
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\u25b2 Gen5 eSSDs showcased at the summit<\/p>\n

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Expanded Presentation Sessions: Sharing AI Memory Expertise<\/h3>\n
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Reflecting SK hynix\u2019s growing influence as the leading AI memory provider, the company is holding eight insightful sessions\u2014three more than in 2023\u2014on the future of AI memory solutions.
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\u25b2 SK hynix is sharing its industry expertise through eight presentations<\/p>\n