![\"SK](\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/05\/27150254\/SK-hynix_HPE-Discover-2024_01.png\" "\\"SK")
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\u25b2 SK hynix\u2019s booth at HPE Discover 2024<\/p>\n
SK hynix has returned to Las Vegas to showcase its leading AI memory solutions at HPE Discover 2024, Hewlett Packard Enterprise\u2019s (HPE) annual technology conference. Held from June 17\u201320, HPE Discover 2024 features a packed schedule with more than 150 live demonstrations, as well as technical sessions, exhibitions, and more. This year, attendees can also benefit from three new curated programs on edge computing and networking, hybrid cloud technology, and AI.<\/p>\n
Under the slogan \u201cMemory, The Power of AI,\u201d SK hynix is displaying its latest memory solutions at the event including those supplied to HPE. The company is also taking advantage of the numerous networking opportunities to strengthen its relationship with the host company and its other partners.<\/p>\n
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SK hynix\u2019s booth at HPE Discover 2024 consists of three product sections and a demonstration zone which showcase the unprecedented capabilities of its AI memory solutions.<\/p>\n
![\"\"](\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2024\/06\/11174234\/SK-hynix_HPE-Discover-2024_03.png\")
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\u25b2 SK hynix\u2019s AI memory solutions on display including its HBM3E and CMM-DDR5<\/p>\n
The first section features the company\u2019s groundbreaking memory solutions for AI, including HBM* <\/sup> solutions. In particular, the industry-leading HBM3E has emerged as a core product to meet the growing demands of AI systems due to its exceptional processing speed, capacity, and heat dissipation. A key solution from the company\u2019s CXL\u00ae2<\/sup> lineup, CXL Memory Module-DDR5* <\/sup> (CMM-DDR5), is also on display in this section. In the AI era where high performance and capacity are vital, CMM-DDR5 has gained attention for its ability to expand system bandwidth by up to 50% and capacity by up to 100% compared to systems only equipped with DDR5 DRAM.<\/p>\n * <\/sup>High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV). \u25b2 SK hynix\u2019s server DRAM products are optimized for AI computing<\/p>\n In the second section of the booth, SK hynix is presenting its leading server DRAM solutions. The company\u2019s power-efficient and rapid DDR5 RDIMM* <\/sup> and MCR DIMM* <\/sup> are featured, showcasing their ability to support AI computing in high-performance servers. Equipped with 1bnm, the fifth generation of the 10 nm process technology, DDR5 RDIMM can reach speeds of up to 6,400 megabits per second (Mbps), while MCR DIMM boasts speeds of up to 8,800 Mbps. Additionally, SK hynix is displaying its LPCAMM2* <\/sup>, a module solution that is increasingly being applied in AI PCs due to its low-power and high-performance features.<\/p>\n * <\/sup>Registered Dual In-line Memory Module (RDIMM): A high-density memory module used in servers and other applications to vertically connect DRAM dies. <\/p><\/div><\/a><\/div>\n<\/div>\n <\/p><\/div><\/a><\/div>\n<\/div>\n<\/div>\n \u25b2 SK hynix presents its SSD portfolio including products supplied to HPE<\/p>\n Visitors could also see some of SK hynix\u2019s latest enterprise SSDs (eSSD) in the third section of the booth. These include the PCle Gen5-based PS1010 and PS1030, which are recognized to be ideal for AI, big data, and machine learning applications due to their rapid sequential read speeds. Within the same section, SK hynix\u2019s U.S. subsidiary Solidigm is presenting its QLC* <\/sup>-based eSSDs such as D5-P5430, D5-P5316, and D5-P5336. Offering industry-leading performance and massive capacity, these products will serve as optimal solutions for various customers that require immense storage space.<\/p>\n * <\/sup>Quadruple Level Cell (QLC): A form of NAND flash memory that can store up to 4 bits of data per memory cell.<\/p>\n \u25b2 SK hynix hosted sessions on how its memory solutions are fueling innovation in AI<\/p>\n During the presentation sessions at the conference, SK hynix held talks that focused on how the company\u2019s memory products are fueling innovation in AI. On June 18, Technical Leader Brian Yoon of DRAM Technology Planning at SK hynix America provided an overview of CXL and discussed enabling memory expansion with CMM-DDR5. Yoon also touched on the features of HMSDK* <\/sup>, a software that supports CMM-DDR5. Hours later, Director Santosh Kumar of NAND Technology Planning at SK hynix America and Technical Leader Seonjae Kim of SSD Enablement at SK hynix covered SSD technology trends and how SK hynix and Solidigm can meet future SSD demands. During the talk, the pair shared how the companies\u2019 SSD products are optimized for AI storage and modern data center workloads.<\/p>\n * <\/sup>Heterogeneous Memory Software Development Kit (HMSDK): A software development kit specially designed to support CXL memory, a next-generation memory system based on the CXL open industry standard.<\/p>\n \u00a0<\/p>\n At HPE Discover 2024, SK hynix has underlined how it is spearheading innovations in the AI memory sector. The event is not only a chance for the company to showcase its industry-leading solutions, but also a time to strengthen its partnership with HPE and other industry players.<\/p>\n \u201cSK hynix is maintaining a close partnership with HPE based on its industry-leading memory technology, including securing contracts to supply high-capacity DDR5 and 16-channel Gen5 eSSD products,\u201d said Vice President Myoungsoo Park, head of US\/EU Sales at SK hynix. \u201cWe will continue to strengthen our cooperation with global partners to further solidify our technological leadership as the world\u2019s number one AI memory provider.\u201d<\/p>\n","protected":false},"excerpt":{"rendered":" SK hynix\u2019s booth at HPE Discover 2024 \u00a0 SK hynix has returned to Las Vegas to showcase its leading AI memory solutions at HPE Discover 2024, Hewlett Packard Enterprise\u2019s (HPE) annual technology conference. Held from June 17\u201320, HPE Discover 2024 features a packed schedule with more than 150 live demonstrations, as well as technical sessions, [\u2026]<\/p>\n","protected":false},"author":23,"featured_media":1957,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":15204,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[5],"tags":[14,155,25,36,1314,1313],"class_list":["post-1964","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-tech-and-ai","tag-ai-memory","tag-cxl","tag-essd","tag-hbm3e","tag-hpe","tag-hpediscover"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/1964","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/23"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=1964"}],"version-history":[{"count":2,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/1964\/revisions"}],"predecessor-version":[{"id":8469,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/1964\/revisions\/8469"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/1957"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=1964"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=1964"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=1964"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}
\n* <\/sup>Compute Express Link\u00ae<\/sup> (CXL\u00ae<\/sup>): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.
\n* <\/sup>Double Data Rate 5 (DDR5): A server DRAM that effectively handles the increasing demands of larger and more complex data workloads by offering enhanced bandwidth and power efficiency compared to the previous generation, DDR4.<\/p>\n![\"\"](\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2024\/06\/11174013\/SK-hynix_HPE-Discover-2024_04.png\")
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\n* <\/sup>Multiplexer Combined Ranks Dual In-line Memory Module (MCR DIMM): A module product with multiple DRAMs bonded to a motherboard in which two ranks\u2014basic information processing units\u2014operate simultaneously, resulting in improved speed.
\n* <\/sup>Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that offers power efficiency and high performance as well as space savings. It offers performance levels equivalent to two DDR5 SODIMMs, making it optimized for on-device AI.<\/p>\n\n\n\n\t![\"\"](\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/11173452\/SK-hynix_HPE-Discover-2024_02.png\")
\n\t![\"\"](\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/06\/11173453\/SK-hynix_HPE-Discover-2024_051.png\")
<\/div><\/div><\/div><\/div><\/div>\n\n\n\n<\/div>\nSharing the Latest Innovations and Trends in AI Memory<\/h3>\n
<\/div>\n<\/div>\n<\/div>\n![\"\"](\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2024\/06\/11174014\/SK-hynix_HPE-Discover-2024_06.png\")
<\/p>\n\n\n<\/div>\nEmbracing the Memory Community to Power the Future of AI<\/h3>\n
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