{"id":2013,"date":"2024-05-21T06:00:39","date_gmt":"2024-05-21T06:00:39","guid":{"rendered":"http:\/\/localhost:8080\/sk-hynix-dell-technologies-present-the-future-of-ai-memory\/"},"modified":"2026-07-16T09:22:16","modified_gmt":"2026-07-16T09:22:16","slug":"sk-hynix-dell-technologies-present-the-future-of-ai-memory","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/sk-hynix-dell-technologies-present-the-future-of-ai-memory\/","title":{"rendered":"DTW 2024: SK hynix & Dell Technologies Present the Future of AI Memory"},"content":{"rendered":"

\"SK<\/p>\n

\u25b2 SK hynix\u2019s booth at DTW 2024<\/p>\n

SK hynix is presenting its next-generation AI memory solutions at Dell Technologies World (DTW) 2024<\/span><\/a> in the heart of Las Vegas from May 20\u201323. Hosted annually by Dell Technologies, DTW welcomes some of the world\u2019s biggest tech companies to highlight their latest developments, strategies, and visions. In line with DTW 2024\u2019s theme \u201cAccelerate AI Adoption to Unlock Innovation,\u201d SK hynix is showcasing its advanced AI memory and demonstrating these solutions with Dell Technologies\u2019 systems\u2014underlining its strong partnership with the host.<\/p>\n

\"SK<\/p>\n

\u25b2 SK hynix showcasing its next-generation AI memory solutions at the event<\/p>\n

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AI Solutions Set to Lead the Future Memory Ecosystem<\/h3>\n
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Having participated in DTW since 2019, SK hynix has returned to emphasize the power of its high-performance AI memory products including its SSD, HBM* <\/sup>, and CXL\u00ae<\/sup>* <\/sup> solutions.<\/p>\n

* <\/sup>High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV).
\n* <\/sup>Compute Express Link\u00ae<\/sup> (CXL\u00ae<\/sup>): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.<\/p>\n

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\u25b2 SK hynix\u2019s cSSDs which show good compatibility with Dell PCs<\/p>\n

The company is displaying its leading enterprise SSD (eSSD) solutions with Dell Technologies\u2019 systems. These include the PCle* <\/sup> Gen5-based PS1010 and PEB110, which showed positive results with Dell PowerEdge servers. SK hynix is also presenting its latest power-efficient and rapid server DRAM solutions, MCR DIMM* <\/sup> and RDIMM* <\/sup>, which are suited for AI computing in high-performance servers.<\/p>\n

Regarding client SSD (cSSD) products, PCB01* <\/sup> boasted strong performance with Dell Alienware gaming PCs. Compared to the previous generations of cSSDs that includes PC801 and PC711, PCB01 offers significant enhancements in speed, quality, and power efficiency.<\/p>\n

* <\/sup>Peripheral Component Interconnect Express (PCIe): A serial-structured, high-speed I\/O interface used in the mainboard of digital devices.
\n* <\/sup>Multiplexer Combined Ranks Dual In-line Memory Module (MCR DIMM): A module product with multiple DRAMs bonded to a motherboard in which two ranks\u2014basic information processing units\u2014operate simultaneously, resulting in improved speed.
\n* <\/sup>Registered Dual In-line Memory Module (RDIMM): A high-density memory module used in servers and other applications to vertically connect DRAM dies.
\n* <\/sup>PCB01: A PCIe fifth-generation SSD that doubles the speed specifications of its previous generation, enabling the loading of large language models required for AI learning and inference in less than one second.<\/p>\n

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\u25b2 SK hynix\u2019s latest memory products including LPCAMM2 and HBM3E on display<\/p>\n

In addition to demonstrations, SK hynix is displaying some of its other next-generation AI memory products. These include LPCAMM2* <\/sup>, a solution optimized for on-device AI which offers performance levels equivalent to two DDR5* <\/sup> SODIMMs* <\/sup>. The company\u2019s industry-leading HBM3E, which provides exceptional processing speed, capacity, and heat dissipation, is also being presented alongside its corresponding device\u2014H100 GPU.<\/p>\n

* <\/sup>Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that offers power efficiency and high performance as well as space savings.
\n* <\/sup>Double Data Rate 5 (DDR5): A server DRAM that effectively handles the increasing demands of larger and more complex data workloads by offering enhanced bandwidth and power efficiency compared to the previous generation, DDR4.
\n* <\/sup>Small Outline Dual Inline Memory Module (SODIMM): A server DRAM smaller than the regular DIMM used in desktop PCs.<\/p>\n

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\u25b2 SK hynix\u2019s CXL\u00ae<\/sup> product CMM-DDR5 can expand system bandwidth and capacity<\/p>\n

As another key technology for the AI era, CXL\u00ae<\/sup><\/strong> is highlighted through a demonstration of the company\u2019s CXL\u00ae<\/sup><\/strong> Memory Module-DDR5 (CMM-DDR5) with Intel\u2019s server. CMM-DDR5 has attracted attention for its ability to expand system bandwidth and capacity compared to systems only equipped with DDR5 DRAM.<\/p>\n

\u201cDell Technologies is a strong supporter of the CXL\u00ae<\/sup><\/strong> ecosystem and an advocate of driving CXL\u00ae<\/sup><\/strong>-based memory standards throughout the industry,\u201d said a Dell Technologies official. \u201cWe believe that CXL\u00ae<\/sup><\/strong>-based memory will prove to be valuable for systems providers and customers, and we are therefore excited to see the product demonstrations of SK hynix\u2019s CMM-DDR5.\u201d<\/p>\n

Additionally, the synergy between SK hynix and its U.S. subsidiary Solidigm is highlighted as Solidigm\u2019s SSD is also on display at the booth, which is operated by both companies.<\/p>\n

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\u25b2 Eung-bo Shim presenting about the impact of CXL\u00ae<\/sup> memory solutions on the memory ecosystem<\/p>\n

On the first day of the conference, Technical Leader Eung-bo Shim of the Next-Gen Memory & Storage team gave a talk on how CXL\u00ae<\/sup><\/strong> memory solutions will pave the way to the future memory ecosystem infrastructure. Such presentation sessions are expected to further the dialogue between SK hynix, its partners, and fellow industry players as the company aims to realize a memory-centric world in the AI era.<\/p>\n

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Advancing the Partnership With Dell Technologies in the AI Era<\/h3>\n
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As leaders in their respective fields, SK hynix and Dell Technologies have formed a strong partnership that promises more advanced innovations in the future. Both companies are strengthening their efforts in the AI era, building anticipation for further collaborations that will realize faster AI adoption. Looking ahead, SK hynix remains committed to strengthening partnerships that will solidify its AI memory leadership.<\/p>\n","protected":false},"excerpt":{"rendered":"

SK hynix\u2019s booth at DTW 2024 \u00a0 SK hynix is presenting its next-generation AI memory solutions at Dell Technologies World (DTW) 2024 in the heart of Las Vegas from May 20\u201323. Hosted annually by Dell Technologies, DTW welcomes some of the world\u2019s biggest tech companies to highlight their latest developments, strategies, and visions. In line [\u2026]<\/p>\n","protected":false},"author":23,"featured_media":2003,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":15068,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[5],"tags":[14,155,468,1318,36,639,214,53],"class_list":["post-2013","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-tech-and-ai","tag-ai-memory","tag-cxl","tag-dell-technologies-world","tag-dtw-2024","tag-hbm3e","tag-lpcamm2","tag-pcb01","tag-solidigm"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/2013","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/23"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=2013"}],"version-history":[{"count":3,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/2013\/revisions"}],"predecessor-version":[{"id":11165,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/2013\/revisions\/11165"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/2003"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=2013"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=2013"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=2013"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}