{"id":2267,"date":"2023-11-30T06:00:02","date_gmt":"2023-11-30T06:00:02","guid":{"rendered":"http:\/\/localhost:8080\/c-igzo-transistors-with-high-thermal-stability-show-promise-for-next-gen-memory-channels\/"},"modified":"2026-07-29T14:56:21","modified_gmt":"2026-07-29T05:56:21","slug":"c-igzo-transistors-with-high-thermal-stability-show-promise-for-next-gen-memory-channels","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/c-igzo-transistors-with-high-thermal-stability-show-promise-for-next-gen-memory-channels\/","title":{"rendered":"Crystalline IGZO Transistors With High Thermal Stability Show Promise for Next-Gen Memory Channels"},"content":{"rendered":"<p>Amorphous InGaZnO<span style=\"color: #ff0000;\">*<\/span>\u00a0(a-IGZO)-based thin-film transistors<span style=\"color: #ff0000;\">*<\/span> (TFT) have shown potential as stackable channel materials for next-generation\u00a0memory solutions due to their extremely low off-current (I<sub>off<\/sub>) and high electron mobility. However, currently there is no active research being conducted on IGZO devices operating at thermal budgets<span style=\"color: #ff0000;\">*<\/span> above 550\u00b0C during hydrogen-rich processes, which are normally used in memory development. This results in a-IGZO instability issues driven by hydrogen-related defects during these processes.<\/p>\n<p class=\"footnote\"><span style=\"color: #ff0000;\">*<\/span>InGaZnO: A semiconducting material consisting of\u00a0indium\u00a0(In),\u00a0gallium\u00a0(Ga),\u00a0zinc\u00a0(Zn), and\u00a0oxygen\u00a0(O).<br \/>\n<span style=\"color: #ff0000;\">*<\/span>Thin-film transistor (TFT): A type of MOSFET fabricated through thin-film deposition traditionally used in liquid crystal displays (LCDs).<br \/>\n<span style=\"color: #ff0000;\">*<\/span>Thermal budget: The total amount of thermal energy or heat that can be dissipated or allowed within a device without exceeding its specified temperature limits.<\/p>\n<p>In light of this, SK hynix\u2019s Revolutionary Technology Center (RTC) conducted research on crystalline IGZO (c-IGZO) TFTs and compared their characteristics with a-IGZO TFTs. Presented at the 2023 Very Large-Scale Integration (VLSI) Symposium, the study aimed to demonstrate that c-IGZO TFTs can be more thermally stable than a-IGZO under hydrogen-rich processes.<\/p>\n<div style=\"height: 16px; line-height: 16px;\"><\/div>\n<div style=\"text-align: center;\">\n<div style=\"display: inline-block; max-width: 748px; width: 100%; text-align: left;\">\n<div style=\"height: 2px; background: #666666; margin-bottom: 6px;\"><\/div>\n<h3 class=\"sub-title\" style=\"margin: 0; line-height: 1.4;\">Demonstrating the Thermal Stability &amp; Hydrogen Process Resistance of c-IGZO<\/h3>\n<div style=\"height: 2px; background: #666666; margin-top: 6px;\"><\/div>\n<\/div>\n<\/div>\n<p style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-13567 size-full\" src=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/05\/27154935\/Sk-hynix_RTC_C-IGZO_image_01.png\" alt=\"(a) The various process steps involving hydrogen at 550\u00b0C after IGZO deposition. (b) Transmission electron microscopy (TEM) images of a-IGZO and (c) c-IGZO before and after subsequent deposition processes and electron energy loss spectroscopy (EELS) images after processing.\" width=\"1000\" height=\"477\" \/><\/p>\n<p class=\"caption\">\u25b2 Figure 1. (a) The various process steps involving hydrogen at 550\u00b0C after IGZO deposition. (b) Transmission electron microscopy (TEM) images of a-IGZO and (c) c-IGZO before and after subsequent deposition processes and electron energy loss spectroscopy (EELS) images after processing.<\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" class=\"alignnone wp-image-13701 size-full\" src=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/05\/27154940\/Sk-hynix_RTC-Article_Crystallized-IGZO-Transistors_02.jpg\" alt=\"(a) The transfer characteristics of a-IGZO (A\u2019) and c-IGZO TFTs (A-D), which have incrementally increasing amounts of gallium from A to D, at a drain voltage (Vds) of 1V (W\/L=0.8\/0.1 micrometers [\u03bcm]). (b) A comparison of the ><\/p>\n<p class=\"caption\">\u25b2 Figure 2. (a) The transfer characteristics of a-IGZO (A\u2019) and c-IGZO TFTs (A-D), which have incrementally increasing amounts of gallium from A to D, at a drain voltage (Vds) of 1V (W\/L=0.8\/0.1 micrometers [\u03bcm]). (b) A comparison of the on-current (drain current [Ids] at gate voltage [Vgs]-threshold voltage [Vth]=3V) with Vth performance for various IGZO conditions.<\/p>\n<p>As shown in Figures 1 (b) and (c), agglomeration<span style=\"color: #ff0000;\">*<\/span>\u00a0was observed in a-IGZO following several high thermal hydrogen-rich deposition processes, while c-IGZO remained stable without structural changes.\u00a0This suggests that c-IGZO is significantly more resistant to hydrogen at high temperatures than a-IGZO and enables additional oxide thickness (T<sub>ox<\/sub>)\u00a0scaling. Meanwhile, Figure 2 (b) shows that the threshold voltage (V<sub>th<\/sub>) can be controlled by adjusting the composition of c-IGZO (A to D). When c-IGZO demonstrated a similar V<sub>th <\/sub>to a-IGZO, the on-current (I<sub>on<\/sub>) was 1.8 times higher in c-IGZO (C) than a-IGZO (A\u2019).<\/p>\n<p class=\"footnote\"><span style=\"color: #ff0000;\">*<\/span>Agglomeration: The process of particles or granules sticking together to form larger clusters or agglomerates.<\/p>\n<p style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-13700 size-full\" src=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/05\/27154944\/Sk-hynix_RTC-Article_Crystallized-IGZO-Transistors_03.png\" alt=\"An off-current at 25\u00b0C of c-IGZO (C) TFT with a channel length of 70 nanometers (nm) extracted from an Arrhenius plot\" width=\"1000\" height=\"555\" \/><\/p>\n<p class=\"caption\">\u25b2 Figure 3. An off-current at 25\u00b0C of c-IGZO (C) TFT with a channel length of 70 nanometers (nm) extracted from an Arrhenius plot<\/p>\n<p style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-13697 size-full\" src=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/05\/27154948\/Sk-hynix_RTC-Article_Crystallized-IGZO-Transistors_04.jpg\" alt=\"The transfer characteristics of a-IGZO (Tox=100\u212b) and optimized c-IGZO TFT.\" width=\"1000\" height=\"524\" \/><\/p>\n<p class=\"caption\">\u25b2 Figure 4. The transfer characteristics of a-IGZO (Tox=100\u212b) and optimized c-IGZO TFT (Tox= 50\u212b). (Vds = 1V)<\/p>\n<p style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-13698 size-full\" src=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/05\/27154952\/Sk-hynix_RTC-Article_Crystallized-IGZO-Transistors_05.jpg\" alt=\"The optimized c-IGZO (Tox =50\u212b) TFT after positive bias temperature stress (PBTS) testing for 1,000 seconds (s).\" width=\"1000\" height=\"551\" \/><\/p>\n<p class=\"caption\">\u25b2 Figure 5. The optimized c-IGZO (Tox =50\u212b) TFT after positive bias temperature stress (PBTS) testing for 1,000 seconds (s).<\/p>\n<p>Figure 3 shows that extremely low I<sub>off<\/sub> of 1.82\u00d710<sup>\u221218<\/sup> A\/micrometers (\u03bcm) was demonstrated in the c-IGZO TFT with a channel length<span style=\"color: #ff0000;\">*<\/span>\u00a0(L<sub>g<\/sub>) of 70 nanometers (nm). This suggests that c-IGZO can be a feasible material for DRAM cells as it offers a long data retention time.<\/p>\n<p>The researchers also found that, through composition control and T<sub>ox<\/sub> scaling, the subthreshold swing<span style=\"color: #ff0000;\">*<\/span>\u00a0and I<sub>on<\/sub> of the optimized c-IGZO showed significant improvement (Figure 4). Furthermore, Figure 5 shows that despite the relatively thin T<sub>ox<\/sub>\u00a0of 50\u212b, the optimized c-IGZO device demonstrated similar V<sub>th\u00a0<\/sub>shift (\u0394V<sub>th<\/sub>) as a-IGZO (+19 millivolts [mV]) after the positive bias temperature stress<span style=\"color: #ff0000;\">*<\/span>\u00a0(PBTS) test. This indicates that c-IGZO has better V<sub>th<\/sub>\u00a0stability than a-IGZO.<\/p>\n<p class=\"footnote\"><span style=\"color: #ff0000;\">*<\/span>Channel length: A critical dimension of a MOSFET which represents the length of the semiconductor channel between the source and drain terminals.<br \/>\n<span style=\"color: #ff0000;\">*<\/span>Subthreshold swing: The amount of change in the gate voltage required to change the drain current by a factor of 10.<br \/>\n<span style=\"color: #ff0000;\">*<\/span>Positive bias temperature stress (PBTS): A reliability test for a semiconductor device which involves subjecting the device to elevated temperatures while applying a positive bias voltage to the gate terminal.<\/p>\n<div style=\"height: 16px; line-height: 16px;\"><\/div>\n<div style=\"text-align: center;\">\n<div style=\"display: inline-block; max-width: 748px; width: 100%; text-align: left;\">\n<div style=\"height: 2px; background: #666666; margin-bottom: 6px;\"><\/div>\n<h3 class=\"sub-title\" style=\"margin: 0; line-height: 1.4;\">C-IGZO: The Future of Next-Gen Memory Channel Materials<\/h3>\n<div style=\"height: 2px; background: #666666; margin-top: 6px;\"><\/div>\n<\/div>\n<\/div>\n<p>The researchers found that c-IGZO has better thermal stability and is more immune to hydrogen processes than a-IGZO. Due to these characteristics, c-IGZO can be an excellent candidate for new channel materials in future memory devices with high thermal budgets.<\/p>\n<p><em>For more information regarding RTC\u2019s research, please visit the center\u2019s <\/em><em>research website (<\/em><span style=\"text-decoration: underline;\"><a href=\"https:\/\/research.skhynix.com\" target=\"_blank\" rel=\"noopener noreferrer\"><em>https:\/\/research.skhynix.com<\/em><\/a><\/span><em>). The RTC operates the site to<\/em><em> share insights on its ongoing research of future technologies and to actively communicate with various global research organizations.<\/em><\/p>\n<p style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-13569 size-full\" src=\"https:\/\/d18r0a86za96sg.cloudfront.net\/wp-content\/uploads\/2026\/05\/27154955\/Sk-hynix_RTC_C-IGZO_profile-banner.png\" alt=\"The profile banner of Whayoung Kim, Researcher at Revolutionary Technology Center (RTC), SK hynix\" width=\"1000\" height=\"170\" \/><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Amorphous InGaZnO*\u00a0(a-IGZO)-based thin-film transistors* (TFT) have shown potential as stackable channel materials for next-generation\u00a0memory solutions due to their extremely low off-current (Ioff) and high electron mobility. However, currently there is no active research being conducted on IGZO devices operating at<\/p>\n","protected":false},"author":6,"featured_media":2260,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":13563,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[5],"tags":[644,645,600,473,643,646],"class_list":["post-2267","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-tech-and-ai","tag-c-igzo","tag-crystalline-igzo","tag-revolutionary-technology-center","tag-rtc","tag-tft","tag-thin-film-transistors"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/2267","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/6"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=2267"}],"version-history":[{"count":4,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/2267\/revisions"}],"predecessor-version":[{"id":11719,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/2267\/revisions\/11719"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/2260"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=2267"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=2267"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=2267"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}