{"id":2620,"date":"2023-06-23T00:00:51","date_gmt":"2023-06-23T00:00:51","guid":{"rendered":"http:\/\/localhost:8080\/sk-hynix-showcases-data-center-memory-solutions-at-hpe-discover-2023\/"},"modified":"2026-06-12T01:52:10","modified_gmt":"2026-06-12T01:52:10","slug":"sk-hynix-showcases-data-center-memory-solutions-at-hpe-discover-2023","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/sk-hynix-showcases-data-center-memory-solutions-at-hpe-discover-2023\/","title":{"rendered":"SK hynix Showcases Data Center Memory Solutions at HPE Discover 2023"},"content":{"rendered":"

SK hynix presented its next-generation memory technologies and products at HPE Discover 2023, an IT conference held this year in Las Vegas between June 20-22.
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\u25b2 Figure 1. SK hynix\u2019s exhibition booth at HPE Discover 2023<\/p>\n

Held annually by the American ICT company Hewlett Packard Enterprise (HPE), HPE Discover brings together the company\u2019s customers and partners along with industry experts to explore data center trends and the latest technologies such as memory solutions. SK hynix was among the exhibitors at the show as the company further strengthened its partnership with HPE.<\/p>\n

Under the slogan \u201cElevate Your Edge With Memory Performance,\u201d SK hynix showcased its industry-leading memory solutions for data centers. These included its PS1010 E3.S, a high-performance PCIe* <\/sup> Gen5-based eSSD, and DDR5 RDIMM, a DRAM module for servers applied with a 1bnm process. The capabilities of both products were highlighted during a joint promotion with HPE in which they were applied to Gen11, the host company\u2019s latest server range.<\/p>\n

* <\/sup>Peripheral Component Interconnect Express (PCle): A serial-structured, high-speed I\/O interface used on the motherboard of digital devices.<\/p>\n

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\u25b2 Figure 2. SK hynix and Solidigm display their advanced storage and memory solutions at HPE Discover 2023<\/p>\n

Visitors could also see SK hynix\u2019s lineup of advanced memory solutions including: HBM3* <\/sup> , a memory product that has been highlighted recently due to the rise of generative AI; CXL* <\/sup> memory, an interconnect technology that enables efficient scaling of memory bandwidth and capacity; and PIM* <\/sup> , a next-generation memory chip with computing capabilities. SK hynix\u2019s subsidiary company, Solidigm, also showcased its portfolio of products including its PCIe Gen4 NVMe* <\/sup> -based SSD.<\/p>\n

* <\/sup>High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).
\n* <\/sup>Compute Express Link (CXL): A next-generation interconnect protocol based on PCIe that efficiently bolsters high-performance computing systems.
\n* <\/sup>Processing-In-Memory (PIM): A next-generation technology that adds computational capabilities to semiconductor memories to solve congestions in data movement found in AI and big data processing.
\n* <\/sup>Non-Volatile Memory express (NVMe): A communication protocol for storage devices based on PCIe interface. It can achieve speeds of up to six times greater than traditional SATA interfaces, making it suitable for ultra-fast, large data processing.<\/p>\n

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\u25b2 Figure 3. Vice President Eui-cheol Lim of SK hynix\u2019s Solution Development division explains how PIM semiconductors will increase the efficiency of GPTs in the future<\/p>\n

SK hynix also held a session where its members spoke about the role and vision of memory solutions in the future. For his part of the presentation, Vice President Eui-cheol Lim of the Solution Development division gave a talk on how PIM semiconductors can increase the efficiency of Generative Pre-trained Transformers (GPTs). Technical Leaders Tai-jin Choi and Santosh Kumar of SK hynix America presented about trends in SSD storage technology for next-generation servers, and their colleague Technical Leader Yoosung Lee presented on how DDR5 is set to be the standard for next-generation DRAMs in the era of big data. All three presentations emphasized how memory solutions are essential in responding to the rapidly changing IT environment.<\/p>\n

\u201cGoing forward, we plan to not only strengthen our partnerships with key customers but also showcase our unprecedented, next-generation memory solutions,\u201d said Seok Kim, the head of GSM Strategy at SK hynix.<\/p>\n","protected":false},"excerpt":{"rendered":"

\u00a0 SK hynix presented its next-generation memory technologies and products at HPE Discover 2023, an IT conference held this year in Las Vegas between June 20-22. Figure 1. SK hynix\u2019s exhibition booth at HPE Discover 2023 \u00a0 Held annually by the American ICT company Hewlett Packard Enterprise (HPE), HPE Discover brings together the company\u2019s customers [\u2026]<\/p>\n","protected":false},"author":23,"featured_media":2613,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":12033,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[5],"tags":[155,294,1314,177,1008],"class_list":["post-2620","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-tech-and-ai","tag-cxl","tag-hbm3","tag-hpe","tag-pim","tag-semiconductor-memory"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/2620","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/23"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=2620"}],"version-history":[{"count":2,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/2620\/revisions"}],"predecessor-version":[{"id":8687,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/2620\/revisions\/8687"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/2613"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=2620"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=2620"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=2620"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}