{"id":3284,"date":"2022-05-12T00:00:40","date_gmt":"2022-05-12T00:00:40","guid":{"rendered":"http:\/\/localhost:8080\/sk-hynix-flaunts-its-latest-server-based-products-at-intel-vision\/"},"modified":"2026-06-13T22:39:06","modified_gmt":"2026-06-13T22:39:06","slug":"sk-hynix-flaunts-its-latest-server-based-products-at-intel-vision","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/sk-hynix-flaunts-its-latest-server-based-products-at-intel-vision\/","title":{"rendered":"SK hynix Flaunts Its Latest Solutions for Server Applications at Intel Vision"},"content":{"rendered":"

Global DRAM leader SK hynix exhibited at the Intel Vision conference from May 10-11, introducing the latest memory solutions for server applications, including DDR5 DIMM alongside its next-generation solutions such as Processing in Memory (PIM) and Compute Express Link (CXL).<\/p>\n

As part of the Intel\u00ae ON<\/a> Series, <\/span>Intel Vision is <\/span>a newly envisioned ICT conference and exhibition <\/span>being held this year<\/span> for the first time. <\/span>Decision makers from major <\/span>players <\/span>in the technology field, as well as renowned industry opinion leaders<\/span><\/span>,<\/span><\/span> were invited to the event<\/span> featuring the latest innovations and technologies from Intel and its partners.<\/span><\/span>\u00a0<\/span><\/p>\n

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\u25b2 Image 1. View of SK hynix\u2019s booth at Intel Vision<\/p>\n

SK hynix is a key player in the memory field<\/span> and has a long-standing partnership with Intel<\/span><\/span>. <\/span><\/span>T<\/span>h<\/span>e<\/span><\/span> solid <\/span>relationship was on full display at the <\/span>hybrid <\/span>online and offline <\/span>event<\/span> where SK hynix was an invited guest.<\/span><\/span>\u00a0<\/span><\/p>\n

At its booth, SK hynix<\/span> presented its DDR5*<\/sup><\/span>DRAM, developed in October 2020 as the first of its kind in the world.<\/a>
\n<\/span> The company continued its dominance as a leader in DRAM technology by releasing the <\/span>industry\u2019s largest density 24 Gb (gigabit) DDR5 product sample<\/a> in December 2021<\/span>.<\/span>\u00a0<\/span><\/p>\n

DDR5 <\/span>allows for <\/span>high-speed processes with<\/span> bandwidth speeds at least <\/span>50<\/span><\/span>%<\/span><\/span> faster than DDR4<\/span> and <\/span>can support <\/span>256 GB of high density using TSV technology.<\/span> It also prov<\/span>es more trustworthy by self-correcting <\/span>errors in units of 1 bit <\/span>with a built-in Error Correcting Code (ECC). Systems using SK <\/span>hynix\u2019s<\/span> DDR5<\/span> are expected to see <\/span>reliability<\/span><\/span> improve<\/span> by<\/span><\/span> roughly 20 times<\/span><\/span>.<\/span><\/span>\u00a0<\/span><\/span><\/p>\n

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\u25b2 Image 2. SK hynix\u2019s latest memory solutions facing server applications presented at Intel Vision<\/p>\n

These features allow for more stable and seamless usage in big data processes<\/span> like cloud computing, artificial intelligence (AI), and machine learning (ML), as well as the metaverse.<\/span>\u00a0<\/span><\/p>\n

It\u2019s also the most environmentally beneficial DDR product to date with<\/span> a low operating voltage of 1.1 V, reducing electricity consumption by 20%. Along with the premium memory HBM3*<\/sup><\/span><\/span>, these products will continue to carry the load from a total cost of ownership (TCO<\/span>)<\/span> standpoint.<\/span>\u00a0<\/span><\/p>\n

SK <\/span>hynix<\/span> also introduced<\/span> its GDDR6-AiM<\/span><\/span>, <\/span><\/span>the<\/span> latest<\/span><\/span> PiM*<\/sup><\/span><\/span><\/span><\/span>\u00a0<\/sup><\/span><\/span>solution<\/span> at SK <\/span>hynix<\/span><\/span>,<\/span><\/span> and Comput<\/span>e<\/span> Express Link (CXL) capabilities.<\/span><\/span>\u00a0<\/span><\/p>\n

GDDR6-AiM<\/a> was first unveiled at 2022 ISSCC*<\/sup><\/span><\/span>\u00a0<\/sup>in San Francisco in early 2022. It <\/span>allows for <\/span>computational functions to <\/span>be added to <\/span>memory chips<\/span>. W<\/span>hen <\/span>combined <\/span>with CPU\/GPU<\/span>, <\/span><\/span>GDDR6-AiM can improve the overall processing <\/span>speeds <\/span>by <\/span>up to <\/span>16 times<\/span><\/span>. <\/span><\/span>The <\/span>next<\/span><\/span>\u2013<\/span><\/span>generation intelligent memory chi<\/span>p <\/span>can be used where <\/span>fast<\/span> computations are needed<\/span><\/span>,<\/span><\/span> like machine learning and <\/span>high<\/span><\/span>\u2013<\/span><\/span>performance computing (<\/span>HPC<\/span><\/span>)<\/span>.<\/span><\/span> It reduce<\/span>s<\/span> power<\/span> consumption in the CPU\/GPU by reducing data <\/span>transfer<\/span>, thereby lowering energy usage by approximately 80%<\/span> compared to previous products<\/span>. That in turn<\/span> is expected to make it<\/span> more<\/span> eff<\/span>ective<\/span> in lowering carbon emissions.<\/span><\/span>\u00a0<\/span><\/p>\n

CXL*<\/sup><\/span>\u00a0<\/sup>is a new, up-and-coming interface solution<\/span><\/span> that is <\/span>expected to <\/span>contribute <\/span>to <\/span>expand<\/span>ed<\/span> memory performance<\/span> and <\/span>enhanced <\/span>speeds.<\/span><\/span>\u00a0<\/span><\/span><\/p>\n

\u201cP<\/span>articipating at <\/span>Intel Vision<\/span> further solidifie<\/span>d<\/span><\/span> our <\/span>partnership with Intel<\/span><\/span>,\u201d<\/span><\/span> said <\/span>Sungsoo<\/span> Ryu, Head of DRAM Product Planning & Enabling at <\/span>SK <\/span>hynix<\/span><\/span>.<\/span> <\/span>\u201cSK hynix <\/span>plans to continue to strengthen its competitiveness in providing total memory solutions <\/span>from <\/span>datacenter memory<\/span><\/span>,<\/span> <\/span>like DDR5 and CXL memory, <\/span>to <\/span>memory solutions facing client devices<\/span><\/span>.<\/span>\u201d<\/span><\/span>\u00a0<\/span><\/p>\n

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\u25b2 Image 3. Miniature of M16 Fab at SK hynix Icheon Campus<\/p>\n

By participating in the Intel Vision event, SK hynix<\/span> raised expectations for future endeavors by further committing to R&D in the memory industry and solidifying its cooperation and partnership with Intel.<\/span>\u00a0<\/span><\/p>\n

<\/div>\n

* <\/sup>DDR (Double Data Rate): DRAM standard specification defined by the Joint Electron Device Engineering Council (JEDEC). DDR5 is the next-generation DRAM standard set to replace the current DDR4.
\n* <\/sup>HBM (High Bandwidth Memory): Following previous generations of HBM, HBM2, and HBM2E, HBM3 is an upgrade to HBM2 specifications with increased bandwidth and capacities.
\n* <\/sup>PiM (Processing in Memory): Next-generation technology that provides a solution for data congestion issues for AI and big data by adding computational functions to semiconductor memory.
\n* <\/sup>ISSCC: The International Solid-State Circuits Conference was held virtually from February 20-24, 2022, under the theme, \u201cIntelligent Silicon for a Sustainable World.\u201d
\n* <\/sup>CXL (Compute Express Link) Memory: Heterogeneous computing memory interface that is different from existing DDRx interface. CXL interface can realize memories such as bandwidth & capacity expansion memory, persistent memory, and pooled memory. Major players in datacenter industry ecosystem are currently participating in the CXL consortium.<\/p>\n","protected":false},"excerpt":{"rendered":"

Global DRAM leader SK hynix exhibited at the Intel Vision conference from May 10-11, introducing the latest memory solutions for server applications, including DDR5 DIMM alongside its next-generation solutions such as Processing in Memory (PiM) and Compute Express Link (CXL).\u00a0 As part of the Intel\u00ae ON Series, Intel Vision is a newly envisioned ICT conference [\u2026]<\/p>\n","protected":false},"author":23,"featured_media":3278,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":9088,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[5],"tags":[940,1417,367,1418,499],"class_list":["post-3284","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-tech-and-ai","tag-application","tag-intelvision","tag-memory","tag-server","tag-solution"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/3284","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/23"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=3284"}],"version-history":[{"count":2,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/3284\/revisions"}],"predecessor-version":[{"id":8985,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/3284\/revisions\/8985"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/3278"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=3284"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=3284"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=3284"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}