{"id":3710,"date":"2021-07-22T02:14:17","date_gmt":"2021-07-22T02:14:17","guid":{"rendered":"http:\/\/localhost:8080\/sk-hynix-in-ee-times-how-advanced-packaging-technologies-are-helping-increase-system-performance\/"},"modified":"2026-07-29T15:00:41","modified_gmt":"2026-07-29T06:00:41","slug":"sk-hynix-in-ee-times-how-advanced-packaging-technologies-are-helping-increase-system-performance","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/sk-hynix-in-ee-times-how-advanced-packaging-technologies-are-helping-increase-system-performance\/","title":{"rendered":"How Advanced Packaging Technologies Are Helping Increase System Performance"},"content":{"rendered":"

The packaging process, where different parts of a component are connected together, can be an overlooked aspect of semiconductor manufacturing. In the past, some in the industry considered packaging to be a rudimentary part of the process considered on the back-end.<\/p>\n

Packaging, though, is now getting a fresh look as the semiconductor industry seeks to pack even more performance and capabilities into less space. In this EE Times column<\/a>, SK hynix Project Leader Ho-Young Son provides new insights into how packaging can push the boundaries of memory chips and system performance overall.
\nHe explains how advanced technologies, such as TSV (through-silicon via) and Fan-out wafer-level packaging, are helping create even smaller, thinner memory chips with higher capacities. These packaging techniques also have added benefits, such as more efficiently dissipating heat.<\/p>\n

To find out more, please visit EE Times to read the full column titled \u201cAdvanced Packaging Technologies Overcoming the Memory System Performance and Capacity Limitation<\/a>\u201d.<\/p>\n

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Ho-Young Son, Ph.D.<\/p>\n

PL (Project Leader) of IIP (Intergrated Interconnect & Packaging) Team.<\/span><\/p>\n<\/div>\n<\/div>\n

<\/p>\n","protected":false},"excerpt":{"rendered":"

The packaging process, where different parts of a component are connected together, can be an overlooked aspect of semiconductor manufacturing. In the past, some in the industry considered packaging to be a rudimentary part of the process considered on the back-end. Packaging, though, is now getting a fresh look as the semiconductor industry seeks to [\u2026]<\/p>\n","protected":false},"author":23,"featured_media":3707,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":7605,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[5],"tags":[31,1093,1092,1059],"class_list":["post-3710","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-tech-and-ai","tag-advanced-packaging","tag-expert-perspective","tag-ho-young-son","tag-opinion"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/3710","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/23"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=3710"}],"version-history":[{"count":4,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/3710\/revisions"}],"predecessor-version":[{"id":11876,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/3710\/revisions\/11876"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/3707"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=3710"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=3710"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=3710"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}