{"id":4508,"date":"2020-07-02T10:01:21","date_gmt":"2020-07-02T10:01:21","guid":{"rendered":"http:\/\/localhost:8080\/sk-hynix-starts-mass-production-of-high-speed-dram-hbm2e\/"},"modified":"2026-06-09T11:25:58","modified_gmt":"2026-06-09T11:25:58","slug":"sk-hynix-starts-mass-production-of-high-speed-dram-hbm2e","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/sk-hynix-starts-mass-production-of-high-speed-dram-hbm2e\/","title":{"rendered":"SK hynix Starts Mass-Production of High-Speed DRAM, \u201dHBM2E\u201d"},"content":{"rendered":"

Seoul, July 02, 2020<\/strong>
\nSK hynix Inc. (or \u2018the Company,\u2019 www.skhynix.com<\/a>) announced that it has started the full-scale mass-production of high-speed DRAM, \u2018HBM2E\u2019, only ten months after the Company announced the development of the new product in August last year.<\/p>\n

SK hynix\u2019s HBM2E supports over 460GB (Gigabyte) per second with 1,024 I\/Os (Inputs\/Outputs) based on the 3.6Gbps (gigabits-per-second) speed performance per pin. It is the fastest DRAM solution in the industry, being able to transmit 124 FHD (full-HD) movies (3.7GB each) per second. The density is 16GB by vertically stacking eight 16Gb chips through TSV (Through Silicon Via) technology, and it is more than doubled from the previous generation (HBM2).<\/p>\n

HBM2E boasts high-speed, high-capacity, and low-power characteristics; it is an optimal memory solution for the next-generation AI (Artificial Intelligence) systems including Deep Learning Accelerator and High-Performance Computing, which all require high-level computing performance. Furthermore, it is expected to be applied to the Exascale supercomputer \u2013 a high-performance computing system which can perform calculations a quintillion times per second \u2013 that will lead the research of next-generation basic and applied science, such as climate changes, bio-medics, and space exploration.<\/p>\n

\u201cSK hynix has been in the forefront of technology innovation that contributes to human civilization with achievements including the world\u2019s first development of HBM products,\u201d said Jonghoon Oh, Executive Vice President and Chief Marketing Officer (CMO) at SK hynix. \u201cWith the full-scale mass-production of HBM2E, we will continue to strengthen our presence in the premium memory market and lead the fourth industrial revolution.<\/p>\n

Annotation<\/strong>
\n\u25a0 HBM (High Bandwidth Memory)
\n\u2013 High performance, high bandwidth memory products that adopt TSV technology to dramatically accelerate data processing speed over traditional DRAMs.<\/p>\n

\u25a0 TSV (Through Silicon Via)
\n\u2013 An interconnecting technology that connects the upper and lower chips through thousands of fine holes on DRAM chip.
\n\u2013 Delivers data, commands, and currents through column-shaped paths that penetrate the entire silicon wafer thickness after stacking multiple DRAM chips on the buffer chip.
\n\u2013 Up to 30% decrease in size and up to 50% decrease in power consumption over existing packaging methods.<\/p>\n

\u25a0 Standards for data process speed conversion
\n\u2013 1GB = 8Gb
\n\u2013 3.6Gbps per pin with 1024 data I\/Os (Inputs\/Outputs) = 3686.4Gbps
\n\u2013 3686.4Gbps \/ 8 = 460.8GB\/s (Gb -> GB conversion)<\/p>\n

<\/p>\n

\"\"<\/p>\n

Figure 1. SK hynix starts mass-production of high-speed DRAM, \u201dHBM2E\u201d<\/p>\n

\u00a0<\/p>\n

<\/p>\n

\"\"<\/p>\n

Figure 2. SK hynix employees posing for the commemorative photo celebrating the mass-production of HBM2E<\/p>\n

\u00a0<\/p>\n

About SK hynix Inc.<\/strong>
\nSK hynix Inc., headquartered in Korea, is the world\u2019s top tier semiconductor supplier offering Dynamic Random Access Memory chips (\u201cDRAM\u201d), flash memory chips (\u201cNAND flash\u201d) and CMOS Image Sensors (\u201cCIS\u201d) for a wide range of distinguished customers globally. The Company\u2019s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com<\/a>, news.skhynix.com<\/a>.<\/p>\n

\u00a0<\/p>\n

Media Contact<\/strong>
\nSK hynix Inc.
\nGlobal Public Relations<\/p>\n

Technical Leader
\nJaehwan Kevin Kim
\nE-Mail: global_newsroom@skhynix.com<\/a><\/p>\n

Technical Leader
\nSejin Julia Yoo
\nE-Mail: global_newsroom@skhynix.com<\/a><\/p>\n

Technical Leader
\nEun Suk Yixi Lee
\nE-Mail: global_newsroom@skhynix.com<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

Seoul, July 02, 2020 SK hynix Inc. (or \u2018the Company,\u2019 www.skhynix.com) announced that it has started the full-scale mass-production of high-speed DRAM, \u2018HBM2E\u2019, only ten months after the Company announced the development of the new product in August last year. SK hynix\u2019s HBM2E supports over 460GB (Gigabyte) per second with 1,024 I\/Os (Inputs\/Outputs) based on [\u2026]<\/p>\n","protected":false},"author":23,"featured_media":4505,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":5268,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[4],"tags":[394,51,112,393],"class_list":["post-4508","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press","tag-cmo","tag-dram","tag-hbm2e","tag-mass-production"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/4508","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/23"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=4508"}],"version-history":[{"count":3,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/4508\/revisions"}],"predecessor-version":[{"id":6366,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/4508\/revisions\/6366"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/4505"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=4508"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=4508"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=4508"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}