{"id":4979,"date":"2019-08-12T09:47:19","date_gmt":"2019-08-12T09:47:19","guid":{"rendered":"http:\/\/localhost:8080\/sk-hynix-develops-worlds-fastest-high-bandwidth-memory-hbm2e\/"},"modified":"2026-06-09T23:17:47","modified_gmt":"2026-06-09T23:17:47","slug":"sk-hynix-develops-worlds-fastest-high-bandwidth-memory-hbm2e","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/sk-hynix-develops-worlds-fastest-high-bandwidth-memory-hbm2e\/","title":{"rendered":"SK hynix Develops World\u2019s Fastest High Bandwidth Memory, HBM2E"},"content":{"rendered":"
\u00b7 Industry\u2019s first 460GB per second (3.6Gbps per Pin) data processing speed performance<\/strong>
\n\u00b7 Expected to be adopted by high-end machine learning, supercomputers and 5G network applications in the fourth industrial era<\/strong><\/div>\n

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\u00a0<\/p>\n

Seoul, Aug 12, 2019<\/strong>
\nSK hynix Inc. (or \u2018the Company,\u2019 www.skhynix.com<\/a>) announced today that it has developed HBM2E DRAM product with the industry\u2019s highest bandwidth. The new HBM2E boasts approximately 50% higher bandwidth and 100% additional capacity compared to the previous HBM2.<\/p>\n

SK hynix\u2019s HBM2E supports over 460GB (Gigabyte) per second bandwidth based on the 3.6Gbps (gigabits-per-second) speed performance per pin with 1,024 data I\/Os (Inputs\/Outputs). Through utilization of the TSV (Through Silicon Via) technology, a maximum of eight 16-gigabit chips are vertically stacked, forming a single, dense package of 16GB data capacity.<\/p>\n

SK hynix\u2019s HBM2E is an optimal memory solution for the fourth Industrial Era, supporting high-end GPU, supercomputers, machine learning, and artificial intelligence systems that require the maximum level of memory performance. Unlike commodity DRAM products which take on module package forms and mounted on system boards, HBM chip is interconnected closely to processors such as GPUs and logic chips, distanced only a few \u339b units apart, which allows even faster data transfer.<\/p>\n

\u201cSK hynix has established its technological leadership since its world\u2019s first HBM release in 2013,\u201d said Jun-Hyun Chun, Head of HBM Business Strategy. \u201cSK hynix will begin mass production in 2020, when the HBM2E market is expected to open up, and continue to strengthen its leadership in the premium DRAM market.\u201d<\/p>\n

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Media Contact<\/strong>
\nSK hynix Inc.
\nGlobal Public Relations<\/p>\n

Technical Leader (Assistant Manager)
\nHyun Kyung Olivia Lee
\nPhone: +82.31.8093.4771
\nE-Mail: hyunkyung14.lee@sk.com<\/a><\/p>\n

Technical Leader (Senior Manager)
\nEun Suk Yixi Lee
\nPhone: +82.31.8093.4790
\nE-Mail: eunsuk8.lee@sk.com<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

\u2013 Industry\u2019s first 460GB per second (3.6Gbps per Pin) data processing speed performance \u2013 Expected to be adopted by high-end machine learning, supercomputers and 5G network applications in the fourth industrial era Image Download Seoul, Aug 12, 2019 SK hynix Inc. (or \u2018the Company,\u2019 www.skhynix.com) announced today that it has developed HBM2E DRAM product with [\u2026]<\/p>\n","protected":false},"author":23,"featured_media":4977,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":753,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[4],"tags":[112,367],"class_list":["post-4979","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press","tag-hbm2e","tag-memory"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/4979","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/23"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=4979"}],"version-history":[{"count":1,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/4979\/revisions"}],"predecessor-version":[{"id":6459,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/4979\/revisions\/6459"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/4977"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=4979"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=4979"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=4979"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}