{"id":4987,"date":"2019-06-26T10:48:47","date_gmt":"2019-06-26T10:48:47","guid":{"rendered":"http:\/\/localhost:8080\/sk-hynix-starts-mass-producing-worlds-first-128-layer-4d-nand\/"},"modified":"2026-06-09T23:23:17","modified_gmt":"2026-06-09T23:23:17","slug":"sk-hynix-starts-mass-producing-worlds-first-128-layer-4d-nand","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/sk-hynix-starts-mass-producing-worlds-first-128-layer-4d-nand\/","title":{"rendered":"SK hynix Starts Mass-Producing World\u2019s First 128-Layer 4D NAND"},"content":{"rendered":"
\u00b7 Mass-producing 128-Layer 1Tb TLC, the highest vertical stacking and highest density for a TLC NAND Flash chip<\/strong>
\n\u00b7 Significantly improved profitability with 40% higher productivity and 60% better investment efficiency<\/strong>
\n\u00b7 Sales to begin in the second half of this year, targeting high-capacity mobile and enterprise SSD market<\/strong><\/div>\n

<\/p>\n

\"\"<\/p>\n

Seoul, June 26, 2019<\/strong>
\nSK hynix Inc. (or \u2018the Company,\u2019 www.skhynix.com<\/a>) announced today that it has developed and starts mass-producing the world\u2019s first 128-Layer 1Tb (Terabit) TLC (Triple-Level Cell) 4D NAND Flash, only eight months after the Company announced the 96-Layer 4D NAND Flash last year.<\/p>\n

The 128-Layer 1Tb NAND chip offers the industry\u2019s highest vertical stacking with more than 360 billion NAND cells, each of which stores 3 bits, per one chip. To achieve this, SK hynix applied innovative technologies, such as \u201cultra-homogeneous vertical etching technology,\u201d \u201chigh-reliability multi-layer thin-film cell formation technology,\u201d and ultra-fast low-power circuit design, to its own 4D NAND technology.<\/p>\n

The new product provides the industry\u2019s highest density of 1Tb for TLC NAND Flash. A number of companies including SK hynix have developed 1Tb QLC (Quad-Level Cell) NAND products, but SK hynix is the first to commercialize the 1Tb TLC NAND Flash. TLC accounts for more than 85% of the NAND Flash market with excellent performance and reliability.<\/p>\n

The small chip size, the biggest advantage of the Company\u2019s 4D NAND, allowed SK hynix to realize ultra-high-density NAND Flash memory. The Company announced the innovative 4D NAND in October 2018, which combined 3D CTF (Charge Trap Flash) design with the PUC (Peri. Under Cell) technology.<\/p>\n

With the same 4D platform and process optimization, SK hynix was able to reduce the total number of manufacturing processes by 5% while stacking 32 more layers on the existing 96-Layer NAND. As a result, the investment cost for the transition from 96-Layer to 128-Layer NAND has been reduced by 60% compared to the previous technology migration, significantly boosting investment efficiency.<\/p>\n

The 128-Layer 1Tb 4D NAND increases bit productivity per wafer by 40% compared to the Company\u2019s 96-Layer 4D NAND.<\/p>\n

SK hynix will start shipping the 128-Layer 4D NAND flash from the second half of this year, while continuing to roll out various solutions.<\/p>\n

With its four-Plane architecture in a single chip, this product achieved a data transfer rate of 1,400Mbps (Megabits\/sec) at 1.2V, enabling high-performance and low-power mobile solutions and enterprise SSD.<\/p>\n

SK hynix plans to develop the next-generation UFS 3.1 product in the first half of next year for major flagship smartphone customers. With 128-Layer 1Tb NAND Flash, the number of NAND chips necessary for a 1TB (Terabyte) product, currently the largest capacity for a smart phone, will be reduced by half, compared to 512Gb NAND; it will provide customers with a mobile solution with 20% less power consumption in a 1mm-thin package.<\/p>\n

The Company also intends to start mass production of a 2TB client SSD with an in-house controller and software in the first half of next year. 16TB and 32TB Non-Volatile Memory express (NVMe) SSDs for cloud data centers will be released next year as well.<\/p>\n

\u201cSK hynix has secured the fundamental competitiveness of its NAND business with this 128-Layer 4D NAND,\u201d said Executive Vice President Jong Hoon Oh, Head of Global Sales & Marketing. \u201cWith this product, with the industry\u2019s best stacking and density, we will provide customers with a variety of solutions at the right time.\u201d<\/p>\n

SK hynix is developing the next-generation 176-Layer 4D NAND Flash, and will continue to strengthen the competitiveness of its NAND business through technological advantages.<\/p>\n

<\/p>\n

\"\"<\/p>\n

\u00a0<\/p>\n

Media Contact<\/strong>
\nSK hynix Inc.
\nGlobal Public Relations<\/p>\n

Technical Leader (Assistant Manager)
\nHyun Kyung Olivia Lee
\nPhone: +82.31.8093.4771
\nE-Mail: hyunkyung14.lee@sk.com<\/a><\/p>\n

Technical Leader (Senior Manager)
\nEun Suk Yixi Lee
\nPhone: +82.31.8093.4790
\nE-Mail: eunsuk8.lee@sk.com<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

\u2013 Mass-producing 128-Layer 1Tb TLC, the highest vertical stacking and highest density for a TLC NAND Flash chip \u2013 Significantly improved profitability with 40% higher productivity and 60% better investment efficiency \u2013 Sales to begin in the second half of this year, targeting high-capacity mobile and enterprise SSD market Image Download Seoul, June 26, 2019 [\u2026]<\/p>\n","protected":false},"author":23,"featured_media":4984,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":782,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[4],"tags":[491,490,19],"class_list":["post-4987","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press","tag-128-layer","tag-4d","tag-nand"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/4987","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/23"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=4987"}],"version-history":[{"count":1,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/4987\/revisions"}],"predecessor-version":[{"id":6463,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/4987\/revisions\/6463"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/4984"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=4987"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=4987"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=4987"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}