{"id":5579,"date":"2026-05-26T08:27:37","date_gmt":"2026-05-26T08:27:37","guid":{"rendered":"http:\/\/skhynix-prd-alb-526071671.us-east-1.elb.amazonaws.com\/?p=5579"},"modified":"2026-06-18T10:46:20","modified_gmt":"2026-06-18T10:46:20","slug":"ihbm-solutio","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/ihbm-solutio\/","title":{"rendered":"SK hynix unveils \u2018iHBM\u2019 thermal solution to boost AI performance"},"content":{"rendered":"
\u00b7 Enhances heat dissipation by integrating ICEs into the HBM package
\n\u00b7 Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
\n\u00b7 Lowers barriers to adoption by leveraging market-proven MR\u2013MUF technology, featuring high design compatibility<\/strong><\/div>\n

Seoul, May 26, 2026<\/strong> \u2013 SK hynix Inc. (or \u201cthe company\u201d, www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)* within the high-bandwidth memory(HBM) package for next-generation HBM products.<\/p>\n

* <\/span>ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-based material, designed to dissipate heat from the HBM package by providing an additional thermal path.<\/div>\n

Heat management has become a critical challenge as HBM technology advances with higher stacking and faster speeds to cater to the surging demand for AI data processing.<\/p>\n

The efficient management of power density*<\/span> in the Die-to-Die Physical Layer (D2D PHY)*<\/span>\u2014the interface connecting HBM and GPU\u2014has emerged as a key factor defining the competitiveness of next-generation HBM.<\/p>\n

* <\/span>Power Density: the amount of heat emitting per space serving as a key defining factor for the cooling efficiency and product lifespan.
\n* <\/span>D2D PHY(Die-to-Die Physical Layer): a hardware interface that enables fast data transfer between the HBM base die and AI accelerator.<\/div>\n

With the iHBM solution, the company has taken a structural approach to addressing the heat management issue. Existing HBM products rely on an indirect cooling method that draws heat away through the core die. In contrast, the iHBM solution places ICEs directly in the D2D PHY area where heat concentration is the highest, creating an additional \u2018heat dissipation path\u2019. This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions.<\/p>\n

The company\u2019s mass-production capabilities also serves as a key advantage. SK hynix\u2019s Wafer Level Packaging(WLP)*<\/span> process, based on its market-proven Mass Reflow Molded Underfill(MR-MUF)*<\/span> technology, enables stable high-volume production of iHBM-equipped chips. Furthermore, the solution offers high design compatibility with existing System-in-Package(SiP)*<\/span> architectures, allowing customers to adopt the new thermal technology with minimal design adjustments.<\/p>\n

* <\/span>WLP(Wafer Level Packaging): The technology enables the packaging process and testing all at once without cutting a wafer into separate chips. It helps minimize the size of chips and improve electrical efficiency.
\n* <\/span>MR-MUF(Mass Reflow Molded Underfill): A process used for stacking semiconductors by injecting liquid protective materials between chips to protect circuits.
\n* <\/span>SiP(System in Package): A packaging technology that allows different chips to operate cohesively as a one system by placing them next to each other in a vertical or horizontal alignment.<\/div>\n

Through the iHBM solution, slated for deployment in next-generation HBM products, including HBM5, SK hynix aims to increase the stability and operational efficiency of HPCs, AI data centers by meeting heat management standards required in high-density and high-bandwidth environments.<\/p>\n

\u201ciHBM is an optimal solution for thermal management, combining our memory design capabilities with advanced packaging technology,\u201d said Kangwook Lee, Senior Vice President and Head of PKG Development at SK hynix, adding \u201cThe company will cement its AI memory leadership by taking preemptive steps to offer values needed in the AI environment for its customers.\u201d<\/p>\n

\"\"<\/p>\n

\u25b2 A conceptual diagram of the \u2018iHBM Solution\u2019 unveiled by SK hynix<\/p>\n

About SK hynix Inc.<\/strong>
\nSK hynix Inc., headquartered in Korea, is the world\u2019s top-tier semiconductor supplier offering Dynamic Random Access Memory chips (\u201cDRAM\u201d) and flash memory chips (\u201cNAND flash\u201d) for a wide range of distinguished customers globally. The Company\u2019s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com<\/a>, news.skhynix.com<\/a>.<\/p>\n

Media Contact<\/strong>
\nSK hynix Inc.
\nGlobal Public Relations<\/p>\n

Technical Leader<\/strong>
\nYoungwon Kim
\nE-Mail: global_pr@skhynix.com<\/p>\n","protected":false},"excerpt":{"rendered":"

\u00b7 Enhances heat dissipation by integrating ICEs into the HBM package \u00b7 Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments \u00b7 Lowers barriers to adoption by leveraging market-proven MR\u2013MUF technology, featuring high design<\/p>\n","protected":false},"author":23,"featured_media":5576,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":0,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[4],"tags":[13,17],"class_list":["post-5579","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press","tag-hbm","tag-mr-muf","series-global-ai-company-hbm","series-global-ai-company"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/5579","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/23"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=5579"}],"version-history":[{"count":4,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/5579\/revisions"}],"predecessor-version":[{"id":5581,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/5579\/revisions\/5581"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/5576"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=5579"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=5579"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=5579"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}