{"id":632,"date":"2026-04-19T23:25:43","date_gmt":"2026-04-19T23:25:43","guid":{"rendered":"http:\/\/localhost:8080\/mass-production-socamm2-192gb\/"},"modified":"2026-07-16T07:24:07","modified_gmt":"2026-07-16T07:24:07","slug":"mass-production-socamm2-192gb","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/mass-production-socamm2-192gb\/","title":{"rendered":"SK hynix Begins Mass Production of 192GB SOCAMM2\u00a0\u2018Setting a New Standard for AI Server Memory Performance\u2019"},"content":{"rendered":"

News Highlights<\/strong><\/p>\n

\u00b7 Mass production of 192GB high capacity products designed for the NVIDIA Vera Rubin platform<\/strong>
\n\u00b7 Maximizes power efficiency by featuring high density DRAM based on the latest 1cnm process<\/strong>
\n\u00b7 Company to closely collaborate with NVIDIA to solve bottlenecks in AI infrastructure and provide optimal performance<\/strong><\/div>\n

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Seoul, April 20, 2026 <\/strong>\u2013 SK hynix Inc. (or \u201cthe company\u201d, www.skhynix.com) announced today that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10-nanometer technology) LPDDR5X low-power DRAM.<\/p>\n

SOCAMM2*<\/span>is a module that adapts low-power memory \u2013 which was previously used mainly in mobile products like smartphones \u2013 for server environments. It is designed to be a primary memory solution for next-generation AI servers.<\/p>\n

*<\/span> SOCAMM2 (Small Outline Compression Attached Memory Module 2): An AI server\u2013optimized memory module based on LPDDR. It offers a slim form factor and high scalability, while its compression connector enhances signal integrity and allows for easy module replacement<\/p>\n

SK hynix emphasized that the 1cnm based SOCAMM2 product that is now in mass production delivers more than double the bandwidth with over 75% improved power efficiency compared to conventional RDIMM*<\/span>, providing an optimized solution for high performance AI operations.<\/p>\n

*<\/span> RDIMM (Registered Dual In-Line Memory Module): DRAM module for server\/workstation that includes a register or buffer chip to relay address and command signals between the memory controller and DRAM chip in a memory module<\/p>\n

In particular, the company noted that its\u00a0SOCAMM2 products are designed for\u00a0NVIDIA\u00a0<\/a>Vera-Rubin<\/a>\u00a0platform.
\nSK hynix expects the new SOCAMM2 product will fundamentally resolve the memory bottlenecks encountered during the training and inference of large language model (LLM) with hundreds of billions of parameters, thereby playing a pivotal role in dramatically accelerating the processing speed of the overall system.
\nThe company stated that with the AI market shifting focus from inference to training, SOCAMM2 is gaining significant attention as a next-generation memory solution capable of operating LLMs with low power consumption. To meet the demands of its global Cloud Service Provider (CSP) customers, SK hynix has not only been providing a supply portfolio, but also stabilized its mass production system early on.
\n\u201cBy supplying the 192GB SOCAMM2, SK hynix has established a new standard for AI memory performance\u201d Justin Kim, President & Head of AI Infra (CMO, Chief Marketing Officer) at SK hynix said. \u201cWe will solidify our position as the most trusted AI memory solution provider, through close collaboration with our global AI customers.\u201d
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SK hynix SOCAMM2 192GB product<\/p><\/div><\/a>

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SK hynix SOCAMM2 192GB product<\/p><\/div><\/a>

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