{"id":801,"date":"2026-02-25T23:30:00","date_gmt":"2026-02-25T23:30:00","guid":{"rendered":"http:\/\/localhost:8080\/sk-hynix-and-sandisk-begin-global-standardization-ofnext-generation-memory-hbf\/"},"modified":"2026-06-15T08:35:08","modified_gmt":"2026-06-15T08:35:08","slug":"sk-hynix-and-sandisk-begin-global-standardization-ofnext-generation-memory-hbf","status":"publish","type":"post","link":"https:\/\/news.skhynix.com\/en\/sk-hynix-and-sandisk-begin-global-standardization-ofnext-generation-memory-hbf\/","title":{"rendered":"SK hynix and Sandisk Begin Global Standardization of Next-Generation Memory \u2018HBF\u2019"},"content":{"rendered":"<div class=\"post-intro\" style=\"text-align: left;\"><strong>\u00b7 SK hynix and Sandisk form a joint workstream under OCP to start standardization<\/strong><br \/>\n<strong>\u00b7 New memory layer between HBM and SSD to secure scalability and power efficiency in AI inference infrastructure<\/strong><\/div>\n<p style=\"text-align: left;\"><strong>Seoul, February 26, 2026 <\/strong>\u2013 SK hynix Inc. (or \u201cthe company\u201d, <a title=\"\" href=\"https:\/\/www.skhynix.com\/eng\/main.do\" target=\"_blank\" rel=\"noopener\">www.skhynix.com<\/a>) and Sandisk Corporation held \u2018HBF Spec. Standardization Consortium Kick-Off\u2019 event at Sandisk Headquarters in Milpitas, California on the 25th(local time) announcing global standardization strategy of next-generation memory solution HBF(High Bandwidth Flash) aimed at the AI inference era.<\/p>\n<p style=\"text-align: left;\">SK hynix said, \u201cBy making HBF an industry standard, together with Sandisk, we will lay the foundation for the entire AI ecosystem to grow together. A dedicated workstream under OCP<span style=\"color: #ff0000;\">*<\/span> will be launched with Sandisk to begin standardization work.\u201d<\/p>\n<div class=\"footnote\" style=\"text-align: left;\"><span style=\"color: red;\">*<\/span>Open Compute Project (OCP): A world\u2019s largest open data center technology initiative<\/div>\n<p style=\"text-align: left;\">Recently, the AI industry is shifting from training which focuses on creating Large Language Models (LLMs) to inference, which accelerates actual AI services to users.<\/p>\n<p style=\"text-align: left;\">Fast and efficient memory is essential as the number of users using AI services increases rapidly. However, the existing memory structure cannot meet the high capacity data processing and power efficiency at the same time in the inference stage and HBF technology is designed to address these limitations.<\/p>\n<p style=\"text-align: left;\">HBF technology is a new memory layer between ultra-fast memory, HBM and high-capacity storage device, SSD. HBF technology can fill the gap between HBM\u2019s high performance and SSD\u2019s high capacity and ensure both capacity expansion and power efficiency required for AI inferencing. While HBM handles the high level bandwidth, HBF technology serves as a supporting layer in the architecture.<\/p>\n<p style=\"text-align: left;\">In particular, HBF technology is expected to reduce the total cost of ownership (TCO) while increasing the scalability of AI systems. The industry forecasts that the demand of complex memory solutions, including HBF, will pick up around 2030.<\/p>\n<p style=\"text-align: left;\">In the AI inference market, the role of a total memory solution company that can provide both HBM and HBF is becoming more important as system level optimization of CPU, GPU, and memory determines the overall competitiveness rather than the performance of a single chip.<\/p>\n<p style=\"text-align: left;\">In line with this, SK hynix and Sandisk are proactively pursuing HBF solution\u2019s standardization and commercialization based on their design, packaging and mass production experience in HBM and NAND.<\/p>\n<p style=\"text-align: left;\">\u201cThe key to AI infrastructure is to go beyond the performance competition of individual technologies and to optimize the entire ecosystem,\u201d said, Ahn Hyun, President and Chief Development Officer. \u201cThrough HBF technology standardization the company will establish acooperative system and present an AI-era optimized memory architecture to create new value for customers and partners.\u201d<\/p>\n<p style=\"text-align: left;\"><strong>About SK hynix Inc.<\/strong><br \/>\nSK hynix Inc., headquartered in Korea, is the world\u2019s top-tier semiconductor supplier offering Dynamic Random Access Memory chips (\u201cDRAM\u201d) and flash memory chips (\u201cNAND flash\u201d) for a wide range of distinguished customers globally. The Company\u2019s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at <a href=\"https:\/\/www.skhynix.com\/eng\/main.do\">www.skhynix.com<\/a>, <a href=\"https:\/\/news.skhynix.com\/\">news.skhynix.com<\/a>.<\/p>\n<p style=\"text-align: left;\">Sandisk, the Sandisk logo and HBF are registered trademarks or trademarks of Sandisk Corporation or its affiliates in the U.S. and\/or other countries.<\/p>\n<div>\n<p><iframe loading=\"lazy\" title=\"SK hynix and Sandisk Begin Global Standardization of Next-Generation Memory \u2018HBF\u2019\" width=\"580\" height=\"326\" src=\"https:\/\/www.youtube.com\/embed\/fxvoQZsjZUo?feature=oembed\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" referrerpolicy=\"strict-origin-when-cross-origin\" allowfullscreen><\/iframe><\/p>\n<\/div>\n<p style=\"text-align: left;\"><strong>Media Contact<\/strong><br \/>\nSK hynix Inc.<br \/>\nGlobal Public Relations<\/p>\n<p><em>Technical Leaders<\/em><br \/>\nMinseok Jang<br \/>\nE-Mail: global_pr@skhynix.com<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Seoul, February 26, 2026 \u2013 SK hynix Inc. (or \u201cthe company\u201d, www.skhynix.com) and Sandisk Corporation held \u2018HBF Spec. Standardization Consortium Kick-Off\u2019 event at Sandisk Headquarters in Milpitas, California on the 25th(local time) announcing global standardization strategy of next-generation memory solution HBF(High Bandwidth Flash) aimed at the AI inference era. SK hynix said, \u201cBy making HBF [\u2026]<\/p>\n","protected":false},"author":23,"featured_media":800,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_migrated_source_id":21994,"footnotes":"","_members_access_role":[],"_members_access_error":""},"categories":[4],"tags":[12,16,52],"class_list":["post-801","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press","tag-ai","tag-hbf","tag-sandisk","series-global-ai-company-nand"],"acf":[],"_links":{"self":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/801","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/users\/23"}],"replies":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/comments?post=801"}],"version-history":[{"count":4,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/801\/revisions"}],"predecessor-version":[{"id":9442,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/posts\/801\/revisions\/9442"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media\/800"}],"wp:attachment":[{"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/media?parent=801"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/categories?post=801"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/news.skhynix.com\/en\/wp-json\/wp\/v2\/tags?post=801"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}