SK hynix Newsroom https://validator.w3.org/feed/docs/rss2.html Decoding AI: AI’s Role in the Climate Crisis Main Main Intel AI Summit Seoul 2025: SK hynix Highlights AI Memory and Global Tech Leadership Main SK hynix Named a World’s Most Ethical Company for Second Consecutive Year, Reaffirming Its Global Leadership in Ethical Management SK hynix Honored with Two Government Awards on the 53rd Commerce and Industry Day – Recognized for Leading the Global Memory Market SK hynix Holds 78th Annual General Meeting, “Pledging to Become a Global Top-Tier Company to Share Differentiated Value and Share Results with Shareholders” hynix Develops 0.10-micron 512Mb DDR Chey Tae-won, Chairman of SK Group, Attends GTC 2026 for First Time, Strengthens Role as “Innovation Partner” in AI Ecosystem SK hynix to Showcase AI Memory Leadership at NVIDIA GTC 2026 [2026 The Leaders] “Unlocking Microscopic Competitiveness with ‘Scaling Master Key’”: VP Hyunsok Kim, Head of Photo Technology [2026 The Leaders] “Connecting Technology, The Core Strength That Powers AI Memory Competitiveness”: VP Yunik Son, Head of Device Tech Solutions SK hynix Reaffirms Partnership With NVIDIA at GTC 2026, Unveiling Latest AI Memory Portfolio SK hynix Wins Double Awards in Climate Change and Water Security at 2025 CDP Korea Awards, Proving Global Leadership in Sustainability SK hynix Develops 1c LPDDR6, 6th-Generation 10nm-Class DRAM [2026 The Leaders] “SK hynix Turns Technology Leadership into Results, Serving as Compass toward ‘Full-stack AI Memory Creator’”: VP Joondeok Park, Head of DRAM Marketing [SOD’s Review] GTC 2026: From Models to Infrastructure – How the AI Race Is Shifting and What It Means for SK hynix [2026 The Leaders] “Powered by a No.1 DNA, SK hynix Will Lead the Next Generation of DRAM”: VP Kyoungchul Jang, Head of VG TD at R&D New Facility Investment for Yongin Semiconductor Cluster SK hynix at SC25: Showcasing Advanced AI Memory From HBM4 to Next-Gen Storage SK hynix Honored for Superior Safety Measures for Biz Partners for 3rd Consecutive Year SK hynix and Sandisk Begin Global Standardization of Next-Generation Memory ‘HBF’ [The Age of Semiconductors] What if a Single Word Could Heat up Data Centers? SK hynix Unveils Latest AI Memory Solutions at MWC 2026, Showcasing Its Technological Capabilities as a Full Stack AI Memory Creator SK hynix Announces FY25 Financial Results SK hynix to Establish U.S. Arm Specialized in AI Solutions SK hynix Showcases Next-Generation AI Memory Innovations at CES 2026 2026 Market Outlook – “Focus on the HBM-Led Memory Supercycle” Introducing Launch of ‘AI Company’ Focusing on AI Solutions SK hynix First to Complete Intel Data Center Certification for 32Gb Die-based 256GB Server DDR5 RDIMM Q4 2025 Earnings Conference Call Invitation SK hynix and Gauss Labs Present AI-Based Semiconductor Virtual Metrology Research at SPIE AL 2026 Multimedia SK hynix Presents AI-Driven R&D Innovation Vision at SEMICON Korea 2026, Reaffirming Role as Global Technology Leader SK hynix CEO Kwak Noh-Jung Finds Way Forward for AI Memory on the Ground at CES 2026 SK hynix LPDDR5X Achieves ASIL-D, the Highest Automotive Memory Functional Safety Rating  [The Age of Semiconductors] Could Memory Chips Make Relationships With Humanoids a Reality?  Fact Sheet SK Group Chairman Chey Tae-won and NVIDIA CEO Jensen Huang Meet To Discuss ‘AI One-Team Meeting’ SK hynix Unveils ‘Talent hy-way,’ an Innovation in the Recruitment Paradigm: ‘Paving the Way to the Future, Beyond Borders and Regions’ CEO’s 2026 New Year Message SK hynix Honored for Social Contribution Efforts at the 14th Korea Sharing National Awards SK hynix Honored with Two Major Titles at GSA Awards 2025 Chairman Chey Tae-won Joins Hands with Zuckerberg — From AI Chips to AI Glasses, Connected by Memory SK hynix Redefines Its Vision at SK AI Summit 2025: From AI Memory Provider to “Creator” SK hynix Recognized at SABRE Awards Asia-Pacific 2025 for Global Social Media Campaign “From Chips to Cloud, SK and MS Connect the Dots”… Chairman Chey Tae-won Expands AI Partnership in Seattle SK hynix Showcases Full-Stack AI Memory Portfolio at 2025 OCP Global Summit “Designing the Future of AI Chips — Together”… Chairman Chey Tae-won and CEO Hock Tan Declare ‘One Team’