[One-Team Spirit] 10,000 Times Thinner Than Human Hair? How SK hynix’s Miniaturization Innovation Secured Its DRAM Leadership June 27, 2025 TECH&AI STORY Corporate Culture DDR DRAM Miniaturization One team spirit One-Team Spirit series
SK hynix Presents Future DRAM Technology Roadmap at IEEE VLSI 2025 June 9, 2025 PRESS DRAM IEEE VLSI symposium IEEE VLSI symposium 2025
[Rulebreakers’ Revolutions] How SK hynix’s Design Innovations Pushed GDDR7 to New Limits of Speed December 27, 2024 TECH&AI DRAM DRAM design GDDR7 graphic design JEDEC NRZ PAM3 Rulebreakers Rulebreakers' Revolutions
[Semiconductor 101] “Why” Modern Tech Needs Semiconductors & SK hynix’s Key Contributions October 21, 2024 TECH&AI AI Era AI Memory DRAM HBM NAND Flash Semiconductor 101 semiconductor market
[Rulebreakers’ Revolutions] How SK hynix Broke Barriers in Mobile DRAM Scaling With World-First HKMG Application September 10, 2024 TECH&AI DRAM HKMG Mobile DRAM Process Integration Rulebreakers Rulebreakers' Revolutions Scaling
[Semiconductor 101] When Semiconductors & SK hynix Made Their Mark on the World September 6, 2024 TECH&AI DRAM milestones NAND Flash Semiconductor 101 semiconductor industry SRAM
SK hynix Develops Industry’s First 1c DDR5 August 29, 2024 PRESS 1c DDR5 1c DRAM AI Memory Datacenter DDR5 DRAM EUV
SK hynix Presents Extensive AI Memory Lineup at Expanded FMS 2024 August 8, 2024 TECH&AI 12-layer HBM3E AI Memory DRAM FMS FMS2024 Future Memory and Storage HBM3E NAND Flash
SK hynix to Produce DRAM From M15X in Cheongju April 24, 2024 PRESS AI AI Memory Cheongju DRAM HBM M15X
SK hynix Commercializes World’s Fastest Mobile DRAM LPDDR5T November 13, 2023 PRESS DRAM LPDDR5T MediaTek Mobile AP
SK hynix’s DDR5 Key to Enabling Industry-Leading Performing Data Centers, White Paper Reveals September 14, 2023 TECH&AI 4th Gen Xeon 4th Generation Xeon data center DDR5 DRAM Intel Intel® Xeon® Scalable Processors LPDDR5X SK hynix white paper Xeon
SK hynix Develops World’s Best Performing HBM3E, Provides Samples to Customer for Performance Evaluation August 21, 2023 PRESS AI application DRAM HBM HBM3E SK hynix