SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand
August 7, 2026
PRESS
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SK hynix Unveils First HBF Standard Specifications with Sandisk, Presenting AI Memory Solutions at ‘FMS 2026’August 4, 2026 -
SK hynix Announces 2Q26 Financial ResultsJuly 29, 2026 -
Q2 2026 Earnings Conference Call InvitationJuly 28, 2026 -
SK Group and NVIDIA Expand Strategic Partnership Across AI Factories and Next-Generation MemoryJuly 25, 2026 -
SK hynix Lists ADRs on NASDAQ, Elevating Global Status at the Heart of Capital MarketsJuly 10, 2026 -
SK hynix Ships Samples of 12-Layer Next-Gen ‘HBM4E’June 18, 2026 -
SK hynix and NVIDIA Announce Multi-year Technology Partnership to Advance Memory for AI FactoriesJune 7, 2026 -
SK hynix unveils ‘iHBM’ thermal solution to boost AI performanceMay 26, 2026 -
SK hynix received 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBMApril 25, 2026 -
SK hynix Announces 1Q26 Financial ResultsApril 22, 2026 -
Q1 2026 Earnings Conference Call InvitationApril 22, 2026