Sam Lee's Ask Me Anything @ SK hynix America

The Innovator - Viktar Zaitsau, Leader of Design VerificationTeam

[Invisible Memory : Part.3] Semiconductor Memory in Our Smart Cities

[SK HYNIX STUDIO] Everything Okay Here?

[Invisible Memory : Part.2 Video Version] Semiconductor Memory in Our Smart Homes

The Portrait – What social responsibility means at SKHMS E

The Innovators – Priya Lanka, Engineering Manager @ SK hynix memory solutions America

SK hynix’s Memory – Beyond History to the Future

[SK HYNIX STUDIO] THE EYE-VENGERS

Introducing SK hynix memory solutions Eastern Europe in Belarus

SK hynix: The Future of Memory at CES 2020

A Secret of an Old Man Living in a House with a Persimmon Tree

[SK hynix brand SSD] THE DAY HAS COME

Tenacity series 3. Hi-Gineers, their crisis tackling DNA

SK hynix 20nm class 8Gb LPDDR4

CIS is used per camera

SK hynix employees posing for the commemorative photo celebrating the mass-production of HBM2E

Sam Lee, Head of SK hynix America Inc. (second from left), Tony Yoon, Head of SKHMS America (second from right)

Sam Lee, Head of SK hynix America Inc. (center), Tony Yoon, Head of SKHMS America (right)

An SK hynix employee gifting consolation goods to hospital workers on Nurse’s day

Wuxi SK hynix Happiness Foundation donated quarantine supplies to its community

SK hynix_Mask donation to aid COVID 19 relief efforts (1)

SK hynix_Mask donation to aid COVID 19 relief efforts (2)

SK hynix_1Ynm DDR5 DRAM

CIS

Equipment

PKG Mold Equipment

SK hynix_Innovative Patent Award

SK hynix_Environmental Product Declaration

SK hynix_A Decade of Innovation (1)

SK hynix_A Decade of Innovation (2)

SK hynix_A Decade of Innovation (3)

SK hynix Wuxi_Receiving a presidential citation

SK hynix Wuxi_Environmental Consulting (1)

SK hynix Wuxi_Environmental Consulting (2)

SK hynix Wuxi_SK Cleaning

SK hynix Wuxi_Happiness bus

SK hynix Wuxi_Happiness bus physical examination

SK hynix Wuxi_Happiness umbrella

SK hynix Wuxi_Happiness umbrella protect kids

SK hynix Wuxi_Flash of Hope

16TB E1.L eSSD, a standard form factor for next-generation data centers

Solution products based on 128-layer 1Tb 4D NAND (Clockwise from top left) 16TB E1.L eSSD, 2TB cSSD, 1TB UFS 3.1

Ultra-thin (1.0mm) 1TB UFS 3.1 for 5G smartphones

2TB cSSD with the industry’s highest power efficiency

World’s first 128-layer 1Tb 4D NAND Flash by SK hynix

DDR5

CMOS Image Sensor

Gold S31

[SK hynix Brand Film] Always with Our Lives

Happy GPS 1. Everyone has moments they don’t want to forget

[SK hynix TV Commercial 2019] Cheongju, a city of world-class semiconductors

[SK hynix TV Commercial 2019] Local specialty of Icheon, Korea

[SK hynix TV Commercial 2018_3] The semiconductor that will change the world

[SK hynix TV Commercial 2018_2] SK hynix, create the universe from within”

Tenacity Syndrome 2. Han Hee-su meets her in 10 years

We are looking for a person who has a "Tenacity Syndrome."

Social Value 2030

Five Goals of Green 2030

Resistance changes in MTJ

Change in Magnetization Direction of the Free Layer 1

Change in Magnetization Direction of the Free Layer according 2

The resistance change of the MTJ when applying a current voltage

Principle of the Hall Effect

Comparison of circut structure of MRAM, STT-MRAM, and SOT-MRAM

Energy Consumption by Memory Semiconductor Type

17 Sustainable Development Goals

Method of Measuring Social Value

Operation of the Emissions Trading System

ECO Vision 2022

GHG Treatment Process through Scrubber

Schematic diagram of an artificial sensor

Von Neumann Method & Neuromorphic Method

Humanoid AI

SK hynix_Image sensor application & Image generation mechanism

SK hynix_Schematic diagram of photo diode structure change along with reduction in pixel size

SK hynix_Structure of color filter array

SK hynix_Wafer stacking configuration

Increased Importance of ESG in terms of corporate value enhancement

Major ESG Activities by SK hynix

SK_hynix Structure of CMOS Image Sensor

SK hynix_Airy disk diffraction image

SK hynix_Structure comparison of conventional sensor and stack sensor

SK hynix_PDAF Structure

SK_hynix_Camera_mounting_location_in_self-driving_car

Footsteps of SK hynix’s Data Science Organization “Rooting AI Technologies in the Field”

Data Science Organization Operated with Internal and External Talents

“Performing Field Analysis and Technological Innovation Tasks”

DS organization conducting various analysis tasks

SK hynix’s Dream of Becoming an AI-based “Intelligent Company”

The Future Direction of the Data Science Organization

process that changes the form of wafer and semiconductor

Tape lamination and wafer structure from the front side

Three detailed porcesses of back grinding

MCP structure

Diversification of grinding method by the thickness of wafers

SK hynix_MLC Cell States

SK hynix_Decrease in Chip Size according to MLC

SK hynix_Comparison of 2D-NAND and 3D-NAND

SK hynix_Concept diagram representing the evolution from 2D to 4D-NAND

SK hynix_Semiconductor Memory

Changes in the number of semiconductor packaging pins (or balls) in contact with the system board

Internal and external structure of semiconductor package

Diagram of package internal connection type, external connection type and mounting method

Comparison of wire bonding type and flip chip type

3D Package with Via Hole penetrating silicon chips

Types of external package type and mounting methods

IC Package Types

SK hynix_Six Major Greenhouse Gases

SK hynix_Major Cases of Energy Efficiency Improvement

SK hynix_Potential Cost Reduction from Greenhouse Gas Reduction

SK hynix Distributed ECU Integrated ECU DCU

SK hynix Storage in a modern car

SK hynix Estimated density and storage type of NAND Flash memory

SK Mobility Technology

Share of demand by major industries

Significat increase in the number of CIS equipped in Smartphone

Latest 3-layer stacked image sensor

Memory Semiconductor Application

Smart Speaker Market

SK hynix_Invisible Memory Quiz

SK hynix_Invisible Memory Quiz & Answer

Duties of Custom Clearance Team

Specifications of Computing Memory

Specifications of Graphic Memory

Specifications of Mobile Memory

Memories for the Revolutionary Path

Revolutionary Path and Evolutionary Path

Specifications of High Bandwidth Memory

SK hynix_Semiconductor Memory Application

SK hynix_Two ways of Stack MCP

SK hynix_Cross-Sectional View of Stack MCP

SK hynix_Comparing PKG RDL with IRDL

SK hynix_Structure of Corporate Competitiveness

Digital Platforms Leading SK hynix’s Digital Transformation

SK hynix_Digital Transformation Process

BVT Bionic Eye System

Internal Structure of an Eye

The working Mechanisms of CIS and Human Eyes

SK hynix_DDR5 Specifications

SK hynix_DDR5 Advantages

SK hynix_FAB Constant Temperature Technology (1)

SK hynix_FAB Constant Temperature Technology (2)

Cameras per Smartphone

Multi-Camera Adoption Rate

Q2B Re-mosaic Algorithm

Supporting 3x Optical Zoom

On-Offline Courses

Best 5 Merits of the Knowledge-sharing Platform "Semiconductor Academy"

Comments from Students

Obtained Zero Waste to Landfill Validation

Eco-friendly Efforts

Via PKG Mold Equipment Improvent

DBL achieved by PKG Mold Equipment Improvement

Cloud gaming mechanism

Algorithm of ray tracing

Global cloud gaming market size

Features of 5G

SK hynix Image SNR

SK hynix Evolution of CIS Pixel Technology

SK hynix CIS Pixel Evolution QUAD pixel operation principle

SK hynix @CES2020_By The Numbers

SK hynix_Global VRAR Market

SK hynix_VR HMD_Structure & Basic Principle

SK hynix_Maximum FOV of human eyes

SK hynix_GDDR6

3D TSV DRAM & HBM

3D TSV DRAM & Dual-Die Package

SoC-HBM System-in-Package (SiP)

HBM in SiP

HBM Technology Roadmap

DDR5 DRAM

EUV Lithography

Gold S31 Specifications

DBL, Double Bottom Line

4D NAND Flash

Waste into Resources_PASS (Poly Aluminum Sulfate Silicate)

2022 Eco Vision