Technology Stacking Ultra-hyper Pure Layer over Ultra-pure Wafer: Epitaxy Technology Semiconductor substrates refer to wafers in a broad sense. On the wafer surface, we directly… September 30, 2021 user Love2
Technology Etching, Process to Complete Semiconductor Patterning – 2 Wet etching of the early days has led to the development in the cleaning or… May 25, 2021 user Love0
Technology Etching, Process to Complete Semiconductor Patterning – 1 Patterning processes include exposure, development, etching, and ion implantation. Among them, the etching process is… May 11, 2021 user Love0
Technology Definition of Semiconductors When an object called “semiconductor” is defined, it is usually interpreted literally. As a word… April 23, 2021 user Love0
Technology Encapsulation Process, A Way of Sealing Packages The “encapsulation process”, which encapsulates packages, is a step where a semiconductor chip is wrapped… March 18, 2021 user Love0
Technology Wire Bonding, a Way to Stitch Chips to PCBs To each sheet of wafers that have completed the front-end process, 500 to 1,200 chips,… March 4, 2021 user Love0
Technology Die Bonding, Process for Placing a Chip on a Package Substrate A packaging process, which is a back-end process for manufacturing semiconductors, proceeds in the order… February 25, 2021 user Love0
Technology Back Grinding Determines the Thickness of a Wafer Wafers that have passed a wafer test after a front-end process goes through a back-end… September 24, 2020 user Love0
Technology “Light, Thin, Short and Small”, The Development of Semiconductor Packages Circuit-patterned wafers which have gone through a semiconductor fabrication (FAB) process are vulnerable to various… August 13, 2020 user Love0
