Semiconductor Back-End Process Episode 3: Understanding the Different Types of Semiconductor Packages
  • Technology
  • featured

Semiconductor Back-End Process Episode 3: Understanding the Different Types of Semiconductor Packages

In the previous episode, it was established that semiconductors require packaging for protection. These packages come in all different shapes...
How Selector-Only Memory Emerged as the Leading Solution for CXL
  • Opinion
  • featured

How Selector-Only Memory Emerged as the Leading Solution for CXL

Since its release in 2019, Compute Express Link (CXL)1 has emerged as an efficient interconnect for processors, memory expansion and...
SK hynix Enters Industry’s First Compatibility Validation Process for 1bnm DDR5 Server DRAM
  • Press Release
  • featured

SK hynix Enters Industry’s First Compatibility Validation Process for 1bnm DDR5 Server DRAM

News Highlights Offers fastest operating speed in DDR5 history, ultra-low power consumption with adoption of HKMG process Expects to successfully...

PRESS CENTER Show All +

Press Releasefeatured
May 30, 2023

SK hynix Enters Industry’s First Compatibility Validation Process for 1bnm DDR5 Server DRAM

News Highlights Offers fastest operating speed in DDR5 history, ultra-low power consumption with adoption of HKMG process Expects to successfully complete validation of industry-leading 1bnm DDR5 Mass production of industry’s…
user
Love0
Press Releasefeatured
April 26, 2023

SK hynix Reports First Quarter 2023 Financial Results

Revenues at 5.088 trillion won, operating loss at 3.402 trillion won, net loss at 2.586 trillion won Operating loss continues due to weak demand and price fall of memory chips;…
user
Love2
Press Releasefeatured
April 20, 2023

SK hynix Develops Industry’s First 12-Layer HBM3, Provides Samples to Customers

News Highlights Develops HBM3 product with industry’s largest 24GB memory capacity; customers’ performance evaluation of samples underway Features high-capacity and high-performance through stacking of 12 DRAM chips Plans to complete…
user
Love1

INSIGHT Show All +

Technologyfeatured
June 1, 2023

Semiconductor Back-End Process Episode 3: Understanding the Different Types of Semiconductor Packages

In the previous episode, it was established that semiconductors require packaging for protection. These packages come in all different shapes and sizes while using different methods to protect and connect…
user
Love0
Opinionfeatured
May 30, 2023

How Selector-Only Memory Emerged as the Leading Solution for CXL

Since its release in 2019, Compute Express Link (CXL)1 has emerged as an efficient interconnect for processors, memory expansion and accelerators in terms of power usage and resources. This is…
user
Love0
Businessfeatured
May 25, 2023

SK hynix Showcases Its Next-Generation Technologies at Dell Technologies World 2023

SK hynix participated in Dell Technologies World (DTW) 2023 in Las Vegas, USA for four days between May 22-25 to showcase its latest memory technologies and products.   SK hynix’s…
user
Love0

SK hynix STORY Show All +

Culture & Peoplefeatured
May 19, 2023

Strengthening HBM Market Leadership: Meet the SK hynix Team Behind the World’s First 12-Layer HBM3

"AI models continue to grow and drive demand for large memory capacity. We welcome the efforts by SK hynix to increase HBM memory capacity to support cutting-edge AI models." -…
user
Love0
Culture & Peoplefeatured
April 27, 2023

Overcoming the Downturn: Meet the SK hynix Marketers Tackling External Challenges

What exactly is the role of a semiconductor marketer? How has their job changed in recent years? How do they gain the knowledge and skills required for global activities? Which…
user
Love2
Culture & Peoplefeatured
March 30, 2023

SK hynix in EE Times: SK hynix’s Revolutionary Technology Center Presents Its Blueprint for Future Semiconductor Research

“Over the next decade, the semiconductor market will become more dynamic than ever. To be prepared, we need to start taking initiatives beginning with changing the way we work,” says…
user
Love2

MULTIMEDIA Show All +