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WHAT’s NEW

[Tech Note] Why does AI still have to wait with tens of thousands of GPUs? How silicon photonics and CPO are building the ‘highways of light’

Oct 29, 2026
TECH&AI NEW
Q3 2026 Earnings Conference Call Access Details

Oct 28, 2026
IR NEW
SK hynix Announces 3Q26 Financial Results

Oct 28, 2026
PRESS IR NEW
Solidigm to Discontinue Review of Potential IPO, Reaffirming Commitment to Long-Term Growth and Shareholder Value

Oct 23, 2026
FACT
- semiconductor industry
- Solidigm
[AI Infrastructure Insight] How AI infrastructure will be designed for the future

Oct 22, 2026
TECH&AI
Q3 2026 Earnings Conference Call Invitation

Oct 21, 2026
PRESS IR
[AI Ecosystem] The semiconductor paradigm shifts toward memory

Oct 21, 2026
TECH&AI
“Memory-Centric Server Systems Are the Future”: SK hynix Presents Its Next-Generation AI Infrastructure Vision at OCP Global Summit 2026

Oct 16, 2026
TECH&AI
[Inside the Research] In the AI era, NAND moves beyond storage to computing… 3D FeNAND co-optimization at IEEE

Oct 14, 2026
TECH&AI
From identifying promising technologies to creating new business opportunities: How SK hynix Ventures finds the path forward

Oct 2, 2026
STORY
[AI Ecosystem] Redesigning infrastructure: Why architecture determines performance

Oct 2, 2026
TECH&AI
Clarification Regarding Recent Media Reports on Solidigm

Oct 1, 2026
FACT
- semiconductor industry

THE SERIES

[Tech Note] Semiconductor Insights for the AI Era

[Expert Views] Expert perspectives on SK hynix

SK hynix DRAM: At the Heart of All Computing

SK hynix HBM: The Undisputed Global Market Leader

SK hynix's AI Memory Technologies in One View

SK hynix NAND: Pushing the Limits of Vertical Stacking

[ONE TEAM SPIRIT] A Shining Moment of One Team Spirit

[2026 The Leaders]A New Leadership for Technological Innovation