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WHAT’s NEW

“Memory-Centric Server Systems Are the Future”: SK hynix Presents Its Next-Generation AI Infrastructure Vision at OCP Global Summit 2026

Oct 16, 2026
TECH&AI NEW
[Inside the Research] In the AI era, NAND moves beyond storage to computing… 3D FeNAND co-optimization at IEEE

Oct 14, 2026
TECH&AI
From identifying promising technologies to creating new business opportunities: How SK hynix Ventures finds the path forward

Oct 2, 2026
STORY
[AI Ecosystem] Redesigning infrastructure: Why architecture determines performance

Oct 2, 2026
TECH&AI
Clarification Regarding Recent Media Reports on Solidigm

Oct 1, 2026
FACT
- semiconductor industry
[AI infrastructure insight] Why power and cooling have become the next challenge for AI data centers

Sep 30, 2026
TECH&AI
“Behind AI’s Rapid Growth Lies Memory” — SK hynix Shares Its Next-Generation Memory Portfolio at the TSMC OIP Conference

Sep 28, 2026
TECH&AI
SK hynix Hosts ‘2026 Global Forum,’ Sharing Its Technology Vision and Future Strategy for the AI Era

Sep 21, 2026
STORY
SK hynix Launches ‘SK hynix Ventures’ in Silicon Valley to Expand Global AI Ecosystem Investment

Sep 18, 2026
PRESS
SK hynix Presents ‘New Spectrum’ for AI Infrastructure at ‘AI Infra Summit 2026’

Sep 17, 2026
TECH&AI
No plans have been confirmed regarding the reported talks between SK hynix and Intel on memory chip production in the U.S.

Sep 16, 2026
FACT
- semiconductor industry
SK hynix Charts Its Business and Technology Direction at the 2026 Future Forum—”Now Is the Golden Time to Leap Forward”

Sep 9, 2026
TECH&AI STORY

THE SERIES

[Expert Views] Expert perspectives on SK hynix

SK hynix DRAM: At the Heart of All Computing

SK hynix HBM: The Undisputed Global Market Leader

SK hynix's AI Memory Technologies in One View

SK hynix NAND: Pushing the Limits of Vertical Stacking

[ONE TEAM SPIRIT] A Shining Moment of One Team Spirit

[2026 The Leaders]A New Leadership for Technological Innovation