Culture & Peoplefeatured Strengthening HBM Market Leadership: Meet the SK hynix Team Behind the World’s First 12-Layer HBM3 "AI models continue to grow and drive demand for large memory capacity. We welcome the… May 19, 2023 user Love0
Press Releasefeatured SK hynix Develops Industry’s First 12-Layer HBM3, Provides Samples to Customers News Highlights Develops HBM3 product with industry’s largest 24GB memory capacity; customers’ performance evaluation of… April 20, 2023 user Love1
Opinionfeatured SK hynix in EE Times: The Value of Semiconductor Packaging Technology in the Era of Heterogeneous Integration In recent years, semiconductor companies are placing increased focus on packaging technology as it offers… February 9, 2023 user Love1
