Technologyfeatured Semiconductor Back-End Process Episode 8: Exploring the Process Stages of Different Wafer-Level Packages Following an introduction to the basic process of assembling a wafer-level package in the previous… October 5, 2023 user Love0
Opinionfeatured SK hynix in EE Times: The Role of Interconnection in the Evolution of Advanced Packaging Technology Although technological advancements in the semiconductor industry are reaching their limits and development costs are… August 18, 2023 user Love0
Technologyfeatured Semiconductor Back-End Process Episode 4: Understanding the Different Types of Semiconductor Packages, Part 2 Continuing from the previous episode which introduced conventional and wafer-level packages, this article will explore… June 27, 2023 user Love97
Press Releasefeatured SK hynix Develops Industry’s First 12-Layer HBM3, Provides Samples to Customers News Highlights Develops HBM3 product with industry’s largest 24GB memory capacity; customers’ performance evaluation of… April 20, 2023 user Love1
Technology Packaging Technology, a Key to Next-Generation Semiconductor Competitiveness, How Far Has SK hynix Come? With the opening of the 4th industrial revolution era and the spread of high technologies… June 3, 2021 user Love0
Opinion Creating New Values in DRAM Using Through-Silicon-Via Technology for Continued Scaling in Memory System Performance and Capacity With the recent rapid growth and vast expansion of artificial intelligence (AI), machine learning, high-… November 20, 2019 user Love0
