SK hynix Honored with Two Major Titles at GSA Awards 2025

  News Highlights Company named “Best Financially Managed Semiconductor Company(Achieving Greater than $1 Billion in Annual Sales)” and “Outstanding Asia-Pacific Semiconductor Company” simultaneously Accelerates recovery from market downturn leveraging world-class HBM...

SK hynix Announces 3Q25 Financial Results

  News Highlights   Reports revenues of 24.4489 trillion won, operating profit of 11.3834 trillion won, net profit of 12.5975 trillion won Record-high quarterly performance driven by strong sales of HBM and high-performance server products HBM supply discussion for...

SK hynix Presents Next Generation NAND Storage Product Strategy at OCP 2025

News Highlights The company presented the ‘AIN Family’ which consists of NAND solution products optimized for performance(P), bandwidth(B), and density(D) respectively for AI SK hynix held ‘HBF Night’ to expand the ‘AIN B’(HBF product) ecosystem with a number of...

Q3 2025 Earnings Conference Call Invitation

SK hynix Inc. will present its third quarter earnings on October 29th, 2025 (Wed).A press release announcing the earnings will be released before 9:00 a.m. on the same day.The conference call will be held live in Korean – simultaneous interpretation in English will be...

SK hynix Completes World’s First HBM4 Development and Readies Mass Production

News Highlights The company is ready to supply the best-in-class HBM4 to customers according to their plans and to maintain competitive position The product’s bandwidth has doubled and power efficiency has improved 40% compared to the previous generation Company to...

SK hynix Begins Supplying Mobile NAND Solution ZUFS 4.1

News Highlights Company achieves world-first mass production of high-performance NAND solution products and starts supplying them to the mobile market The solution significantly improves sustained performance compared to conventional UFS, reducing app launch time by...

SK hynix Introduces Industry’s First Commercial High NA EUV

News Highlights Brings ASML’s EXE:5200B, critical system for next-generation chips, to M16 fab Improved precision, density by 1.7x and 2.9x to help competitive production Company to lead AI memory with cutting-edge tech required by key industries Seoul, September 3,...

SK hynix Starts Supplying Mobile DRAM With Highly Efficient Heat Dissipation

News Highlights Company first in industry to develop High-K EMC material, improves thermal conductivity by 3.5 times, thermal resistance by 47% Customers expect achievement to help address heat issue generated from on-device AI SK hynix to lead next-generation DRAM...

SK hynix Begins Mass Production of 321-Layer QLC NAND Flash

News Highlights Development of the industry’s highest-density QLC product completed, commercial launch scheduled for the first half of next year following completion of customer validation Expansion of independent operation units (“planes”) enables simultaneous large...