On Feb. 10 (local time), SK Group Chairman Chey Tae-won visited Seattle to meet with Microsoft CEO Satya Nadella, where they discussed strengthening cooperation in HBM and joint strategies to strengthen AI data centers and solutions. The meeting is seen as a step toward expanding SK Group’s partnership with Microsoft beyond semiconductors and into AI infrastructure and services, further strengthening its position within the global AI ecosystem.
The two parties reportedly focused on the current status and future vision regarding Microsoft’s recently unveiled AI accelerator, “MAIA 200.” SK hynix is reviewing plans to broaden collaboration to encompass various AI semiconductors while securing stable demand through a long-term HBM supply agreement with Microsoft.
The Seattle meeting is particularly noteworthy as it broadened the scope of collaboration into an end-to-end AI partnership spanning from AI chips to data centers. Looking ahead, SK Group plans to accelerate its position as an innovative leader of the global AI market by strengthening its collaboration with Microsoft across diverse sectors, including not only memory products like HBM but also the construction and operation of AI data centers and cloud-based AI solutions.
