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[We Do Future Technology] Become a Semiconductor Expert with SK hynix – UFS

[We Do Future Technology] Become a Semiconductor Expert with SK hynix – AI Semiconductors

[We Do Future Technology] Become a Semiconductor Expert with SK hynix – HBM

[CES 2023] SK hynix Presents Its Green Digital Solution

Paul Palonsky: The Long-Term Partner to SK hynix America

Description of HKMG Technology

SK hynix Presents Its Green Digital Solution at CES 2023 (11)

SK hynix Presents Its Green Digital Solution at CES 2023 (10)

SK hynix Presents Its Green Digital Solution at CES 2023 (9)

SK hynix Presents Its Green Digital Solution at CES 2023 (8)

SK hynix Presents Its Green Digital Solution at CES 2023 (7)

SK hynix Presents Its Green Digital Solution at CES 2023 (6)

SK hynix Presents Its Green Digital Solution at CES 2023 (5)

SK hynix Presents Its Green Digital Solution at CES 2023 (4)

SK hynix Presents Its Green Digital Solution at CES 2023 (3)

SK hynix Presents Its Green Digital Solution at CES 2023 (2)

SK hynix Presents Its Green Digital Solution at CES 2023 (1)

PVT-aware timing optimization technology

LPDDR5X, which is 33% faster than LPDDR5, can download thirteen 5GB movies in 1 second

SK hynix Successfully Establishes Itself as a Total Solution Provider at OCP Global Summit 2022 (3)

[SEDEX 2022] Crowd visiting Technology zone to experience various exhibits

[SEDEX 2022] Crowd visiting Technology zone to experience various exhibits

[SEDEX 2022] Crowd visiting Technology zone to experience various exhibits

[SEDEX 2022] Crowd visiting Technology zone to experience various exhibits

[SEDEX 2022] We Do Technology, an SK hynix story designed to create a better world

[SEDEX 2022] We Do Technology, an SK hynix story designed to create a better world

PRISM ESG Framework - Innovate Technology

Concepts of how SK hynix converges safety and technologies

Using Technology to Create a Safer Workplace

SK hynix’s latest memory solutions facing server applications presented at Intel Vision (3)

Shared booth of SK hynix and Solidigm at Dell Technologies World 2022

SK hynix and Solidigm Make First Joint Appearance at Dell Technologies World 2022

SK hynix showcasing its data center solutions and green technology at Dell Technologies World 2022 (1)

SK hynix showcasing its data center solutions and green technology at Dell Technologies World 2022 (2)

SK hynix showcasing its data center solutions and green technology at Dell Technologies World 2022 (3)

Solidigm promoting its industry-leading QLC portfolio at Dell Technologies World 2022 (1)

Solidigm promoting its industry-leading QLC portfolio at Dell Technologies World 2022 (2)

Jin Lim, Vice President at SK hynix presenting at Dell Technologies World 2022

A Day in the Life: Semiconductor Technology’s Impact on E-commerce

[Invisible Memory : Part.3] Semiconductor Memory in Our Smart Cities

Tenacity series 3. Hi-Gineers, their crisis tackling DNA

Changes of SK hynix over the last 10 years (as of Dec. 31, 2021)

SK hynix_A Decade of Innovation (3)

Solution products based on 128-layer 1Tb 4D NAND (Clockwise from top left) 16TB E1.L eSSD, 2TB cSSD, 1TB UFS 3.1

Ultra-thin (1.0mm) 1TB UFS 3.1 for 5G smartphones

Gold S31

[SK hynix TV Commercial 2018_3] The semiconductor that will change the world

Digital to Analog Converter

DRAM Products with TSV Technology Applied

Growth of 3D Image Sensors Market

Trend of technological development of deposition and etching

Social Value 2030

Five Goals of Green 2030

Operation of the Emissions Trading System

Increased Importance of ESG in terms of corporate value enhancement

Footsteps of SK hynix’s Data Science Organization “Rooting AI Technologies in the Field”

“Performing Field Analysis and Technological Innovation Tasks”

SK hynix_Comparison of 2D-NAND and 3D-NAND

3D Package with Via Hole penetrating silicon chips

SK Mobility Technology

Latest 3-layer stacked image sensor

SK hynix_FAB Constant Temperature Technology (1)

SK hynix_FAB Constant Temperature Technology (2)

Supporting 3x Optical Zoom

SK hynix Evolution of CIS Pixel Technology

3D TSV DRAM & HBM

3D TSV DRAM & Dual-Die Package

HBM Technology Roadmap

Gold S31 Specifications