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Our ESG Progress, Visualized: Achieving Stakeholder Satisfaction Through Corporate Governance
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SK hynix’s ESG Achievements Revealed in Sustainability Report 2023
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Machine learning-based signal line optimization
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Children taking part in the Happy Umbrella campaign to raise traffic safety awareness
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SK hynix Chongqing subsidiary helping local children in need
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Noh-Jung Kwak, President and Chief Safety, Product & Production Officer
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Kevin (Jongwon) Noh, President and Chief Marketing Officer (CMO)
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Interconnection Network of AI Chips
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AI Chip Market Outlook
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Two approaches for a CPS architecture
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Lowering production cost of bit by increasing chip density @ chip price set arbitrarily
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Lowering cost per chip by increasing number of chips per wafer @ number of chips and price set arbitrarily
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Core etching performance index related to the etch rate
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Etching Process
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Trend of technological development of deposition and etching
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Development of etching method along with miniaturization
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Strengths and weaknesses of wet etching and dry etching
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Etching related process flow
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Process of wire bonding and flip chip bonding
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Comparison_between_die_bonding_and_flip_chip_bonding
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Pick_&_place_of_a_chip
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Chip_ejection
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Change of the dicing method for separating into individual chips
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SK hynix_Decrease in Chip Size according to MLC
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Comparison of wire bonding type and flip chip type
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3D Package with Via Hole penetrating silicon chips
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DBL achieved by PKG Mold Equipment Improvement
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