HEI SOLD OFF THE HEAT-AMALGAMATION POWER PLANT
July 2, 1999
WHAT'S NEW
-
-
HEI HAS RELEASED THE NEWLY STANDARDIZED PC266A 128M DDR SYNCHRONOUS DRAM FOR THE FIRST TIMEJune 10, 1999
-
HEI PROVIDES PICO AND MICRO BTS TO AIRTOUCHJune 2, 1999
-
HEI DEVELOPED 4M SRAM USED IN MOBILE COMMUNICATIONS INSTRUMENTSMay 20, 1999
-
HYUNDAI AND LG SIGN DEFINITIVE AGREEMENT ON ACQUISITION OF LG SEMICON BY HYUNDAI ELECTRONICS INDUSTRIESMay 20, 1999
-
THE SEMICONDUCTOR PLANT OF HEI IN THE U.S. ATTAINED THE ISO CERTIFICATEMay 14, 1999
-
HEI AGREES TO SELL MAJORITY INTEREST IN CHIPPAMarch 16, 1999
-
HEI, THE SECOND LARGEST MARKET SHARE IN THE DRAM MARKET IN 1998.March 13, 1999
-
HEI LAUCHING LATEST SPECIFICATIONS OF PC 266 SYNCHRONOUS DYNAMIC RAM SAMPLESMarch 5, 1999
-
HEI OF KOREA AND NEC ELECTRONICS OF JAPAN ESTABLISH STRATEGIC ALLIANCE IN SEMICONDUCTOR MEMORYFebruary 26, 1999
-
HEI REACHES TURNOVER OF U$400 MILLIONS IN ITS RAMBUS DRAM SALES THIS YEARJanuary 22, 1999
-
HEI Wins Chip Patent Suit in USDecember 22, 1998