HEI PROVIDES PICO AND MICRO BTS TO AIRTOUCH
June 2, 1999
SK hynix
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HEI DEVELOPED 4M SRAM USED IN MOBILE COMMUNICATIONS INSTRUMENTSMay 20, 1999
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HYUNDAI AND LG SIGN DEFINITIVE AGREEMENT ON ACQUISITION OF LG SEMICON BY HYUNDAI ELECTRONICS INDUSTRIESMay 20, 1999
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THE SEMICONDUCTOR PLANT OF HEI IN THE U.S. ATTAINED THE ISO CERTIFICATEMay 14, 1999
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HEI AGREES TO SELL MAJORITY INTEREST IN CHIPPAMarch 16, 1999
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HEI, THE SECOND LARGEST MARKET SHARE IN THE DRAM MARKET IN 1998.March 13, 1999
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HEI LAUCHING LATEST SPECIFICATIONS OF PC 266 SYNCHRONOUS DYNAMIC RAM SAMPLESMarch 5, 1999
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HEI OF KOREA AND NEC ELECTRONICS OF JAPAN ESTABLISH STRATEGIC ALLIANCE IN SEMICONDUCTOR MEMORYFebruary 26, 1999
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HEI REACHES TURNOVER OF U$400 MILLIONS IN ITS RAMBUS DRAM SALES THIS YEARJanuary 22, 1999
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HEI Wins Chip Patent Suit in USDecember 22, 1998
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HEI Develops Self-Designed NON-Memory Chio Manufacturing Process with a Circuit Width of 0.25μDecember 12, 1998
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HEI Starts Commercial Production of World’s Fastest 128M SDRAMsNovember 26, 1998