SK hynix Develops World’s Best Performing HBM3E, Provides Samples to Customer for Performance Evaluation August 21, 2023 PRESS AI application DRAM HBM HBM3E SK hynix
The Role of Interconnection in the Evolution of Advanced Packaging Technology August 18, 2023 TECH&AI Flip Chip Bonding Hybrid Bonding Package Packaging TSV Wire Bonding
FMS 2023: SK hynix Showcases World’s First 321-Layer NAND Samples & Storage Solutions August 16, 2023 TECH&AI 321-layer 4D NAND Automobile Flash Memory Flash Memory Summit FMS FMS2023 KV-CSD Mobile PCIe PCIe Gen5 UFS
SK hynix Starts Mass Production of Industry’s First 24GB LPDDR5X DRAM August 11, 2023 Media DRAM LPDDR
SK hynix Starts Mass Production of Industry’s First 24GB LPDDR5X DRAM August 11, 2023 Media DRAM LPDDR
SK hynix Starts Mass Production of Industry’s First 24GB LPDDR5X DRAM August 11, 2023 PRESS DRAM Edge Device HKMG LPDDR LPDDR5X MassProduction OPPO
SK hynix’s LPDDR5T Verified as World’s Fastest Mobile DRAM Using MediaTek’s Next-Gen Mobile Platform August 10, 2023 TECH&AI Dimensity Platform JEDEC LPDDR5T LPDDR6 MediaTek Mobile AP SoC System-on-chip
SK hynix Showcases Samples of World’s First 321-Layer NAND August 8, 2023 PRESS 321-layer 4D NAND Flash Memory Flash Memory Summit FMS NAND TLC
SK hynix Showcases Samples of World’s First 321-Layer NAND August 8, 2023 Media 321-layer 4D NAND NAND TLC