Chairman Chey Tae-won Joins Hands with Zuckerberg — From AI Chips to AI Glasses, Connected by Memory February 13, 2026 TECH&AI AI Memory HBM Meta Partnership
“From Chips to Cloud, SK and MS Connect the Dots”… Chairman Chey Tae-won Expands AI Partnership in Seattle February 13, 2026 TECH&AI AI data centers AI Memory HBM Microsoft Partnership
“Designing the Future of AI Chips — Together”… Chairman Chey Tae-won and CEO Hock Tan Declare ‘One Team’ February 13, 2026 TECH&AI AI Memory Broadcom HBM One Team Partnership
SK Group Chairman Chey Tae-won and NVIDIA CEO Jensen Huang Meet To Discuss ‘AI One-Team Meeting’ February 13, 2026 TECH&AI AI Memory HBM NVIDIA Partnership
SK hynix Presents AI-Driven R&D Innovation Vision at SEMICON Korea 2026, Reaffirming Role as Global Technology Leader February 12, 2026 TECH&AI AI Memory SEMICON SEMICON Korea 2026
SK hynix LPDDR5X Achieves ASIL-D, the Highest Automotive Memory Functional Safety Rating January 19, 2026 TECH&AI ASIL-D Automotive Memory DRAM ISO ISO26262 LPDDR5X
SK hynix CEO Kwak Noh-Jung Finds Way Forward for AI Memory on the Ground at CES 2026 January 8, 2026 TECH&AI AI Memory CES 2026 HBM HBM4 Partnerships
[The Age of Semiconductors] Could Memory Chips Make Relationships With Humanoids a Reality? December 15, 2025 TECH&AI ACIM AI Memory Humanoids Neuromorphic Computing PIM Robotics The Age of Semiconductors
SK hynix at SC25: Showcasing Advanced AI Memory From HBM4 to Next-Gen Storage November 28, 2025 TECH&AI AI Memory HBM4 HPC SC25 Supercomputing
SK hynix Redefines Its Vision at SK AI Summit 2025: From AI Memory Provider to “Creator” November 20, 2025 TECH&AI AI Memory Full-Stack AI Memory Creator SK AI Summit SK AI Summit 2025 Vision
SK hynix Showcases Full-Stack AI Memory Portfolio at 2025 OCP Global Summit October 31, 2025 TECH&AI 2025 OCP Global Summit AI Memory AiM Data centers HBM4 OCP Global Summit
[Exploring the AI Ecosystem] How SK hynix is Driving AI’s Future October 16, 2025 TECH&AI AI Memory Exploring the AI Ecosystem Full Stack AI Memory Provider HBM