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SK hynix Showcases Industry-Leading Memory Technology at GTC 2025

SK hynix will showcase HBM and other AI memory, including 12‑high HBM3E, SOCAMM, and a model of 12‑high HBM4, at NVIDIA GTC 2025 to advance its “Full Stack AI Memory Provider” vision.
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SK hynix Showcases Industry-Leading Memory Technology at GTC 2025

News Highlights

  • Various memory products for AI data centers, on-device, automotive businesses on display
  • Seoul, March 19, 2025

    SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it will participate in the GTC 2025, a global AI conference taking place March 17-21 in San Jose, California, with a booth titled “Memory, Powering AI and Tomorrow”.

    SK hynix Showcases Industry-Leading Memory Technology at GTC 2025

    The company will present HBM and other memory products for AI data centers and on-device* and memory solutions for automotive business essential for AI era.

    *On-device: a technology that implements certain functions on the device itself, instead of going through computation by a physically separated server. As for the on-device AI, a smart device’s direct collection and computation of information allows fast reactions of the AI performance, while promising an improved customized AI service

    Among the industry-leading AI memory technology to be displayed at the show are 12-high HBM3E and SOCAMM*, a new memory standard for AI servers.

    *SOCAMM(Small Outline Compression Attached Memory Module): a low-power DRAM-based memory module for AI server

    At the event, top company executives led by Chief Executive Officer Kwak Noh-Jung, President, Head of AI Infra and Chief Marketing Officer Juseon (Justin) Kim and Head of Global S&M Lee Sangrak will meet with the leaders of the global AI industry to enhance collaboration.

    Following the industry’s first mass production and supply of the 12-high HBM3E, SK hynix is now planning to complete the preparatory works for large-scale production of the 12-high HBM4 within the second half for immediate start of supply to order. At GTC 2025, a model of the 12-high HBM4, which is under development, will also be displayed.

    “We are proud to present our line-up of industry-leading products at GTC 2025,” President & Head of AI Infra Juseon (Justin) Kim said. “With a differentiated competitiveness in the AI memory space, we are on track to bring our future as the Full Stack AI Memory Provider* forward.”

    *Full Stack AI Memory Provider: SK hynix’s vision to be a provider of a full-range of AI memory products and technologies

    SK hynix Showcases Industry-Leading Memory Technology at GTC 2025

    About SK hynix Inc.

    SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”) and flash memory chips (“NAND flash”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

    Media Contact

    SK hynix Inc.
    Global Public Relations

    Technical Leader
    Kanga Kong, Minseok Jang, Sooyeon Lee
    E-Mail: global_pr@skhynix.com