Press Release

HEI Devlops the World’s the Smallest Direct RAMBUS DRAM Chip

By September 16, 1998 December 9th, 2019 No Comments
– HAS 20% SMALLER SIZE THAN THE EXISTING PRODUCTS
– EXPECTED TO BE PRODUCED OVER 1 MILLION CHIPS PER MONTH FROM THE SECOND QUARTER OF THE YEAR ’99
– HAS 6 TIMES FASTER DATA PROCESSING RATE COMPARED TO SYNCHRONOUS DRAMS
– ENABLES HEI TO ATTACK SEMICONDUCTOR MARKET EFFECTIVELY BY OBTAINING TECHNOLOGY FOR DEVELOPING NEXT-GENERATION SUPER SPEED DRAM
INCLUDING DDR DRAMS AND SINKLINK DRAMS

HEI (President : Kim Young-Hwan) development of the world’s smallest 72 megabit direct Rambus dynamic random access memory chip enbales it to start full-scale competition in next-generation’s super speed memory chip market.

HEI plans to ramp up its production of Rambus DRAMs from the ist quarter of the year ’99, increasing the number of chips to be produced/supplied to over 1 million per month from the 2nd quarter of the same year. With the development of Rambus DRAM, HEI has almost finished developing DDR(Double Data Rate) DRAM and Sinklink DRAM, representative next-generation super speed DRAMs, and plans to produce samples soon.

HEI’s development of these super speed DRAMs enables it to compete effectively in next-generation super speed DRAM market including 64M synchronous DRAM market for PC-100. HEI ‘s DRAM, which applied/developed the technology of using design rule of 0.22 micron circuit width, reduces the size of the chips 20% compared to the size of existing products. The smaller the size of the chips are, the more the number of chips can be produced per one sheet of wafer, thus cutting the production cost that much. Also, by using low volatage of 2.0-2.5V and low electricity, and utilizing micro ball grid array packaging technology, the one for miniaturized semiconductor chips, to realize the smallest size possible, the product can be used for notebook PCs which require low electricity as well as high performance computers such as desktop PCs and workstations.

At present, HEI is considered to have developed a product most likly to succeed in mass-producing among the world’s 14 biggest chip manufacturers that have licensing contract with Rambus for developing Rambus DRAM. HEI is getting favorable opinions on its newly developed Rambus DRAM’s specifications from the world’s two biggest PC manufacturers, Compac and Dell, and is displaying Rambus DRAM chips and RIMM Rambus In-line Memory Modules at IDF(Intel Developer Forum) from 15th to 17th of September. Also, Rambus DRAM is expected to have about 15% of total market share, which is worth 3 billion dollars, in semiconductor market for chips over 64M DRAMs by the year 2000.