Seoul, Korea, September 2, 2003
hynix Semiconductor (www.hynix.com) has completed the development of its 0.18um high voltage process technology.
The 0.18um high voltage process technology was developed to address the increased requirement for a “one-chip” total solution on LDI (LCD Driver IC), which includes: Gate, Source, Controller, DC/DC converter and SRAM. The “one-chip” solution benefits manufacturers with reduced chip size and weight, resulting in a significant reduction in manufacturing cost, all due to this breakthrough of 0.18um High Voltage Process Technology. Tomato LSI, a leading LDI design house, developed the “one-chip” LCD Driver IC using hynix’s technology and received excellent results on moving picture performance.
Volume production through hynix will commence September of 2003. This process technology results in chip sizes that are 20~30% smaller than the current pure foundry service providers, thus giving customers a distinct price competitiveness when the LDI market is under constant and severe competition.
hynix is the leader in the 0.18um high voltage process technology and is a step ahead of leading Japanese foundries in the LDI markets. LDI demand is growing rapidly as a result of increased demand for larger LCD panels and superior 3D graphic performance, with hynix’s 0.18um high voltage process it took the first step in paving the way to secure new customers, sales revenue and is determined to set a trend for leaders.
hynix has scheduled the release of ULP (ultra low power) process technologies for mobile applications by December 2003, as well as various voltage ranges by February 2004 to strengthen its distinct competitive advantage in high voltage processes. About hynix Semiconductor Inc. hynix Semiconductor Inc. (HSI) of Ichon, Korea, is an industry leader in the development, sales, marketing and distribution of high-quality semiconductors, including DRAM, SRAM, Flash memory and system IC devices.
hynix Semiconductor is the world’s leading DRAM supplier with thirteen semiconductor-manufacturing facilities worldwide, and production capacity of over 300,000 wafer starts per month. In addition, hynix is expanding its system IC business unit with leading technology and added deep sub-micron foundry services to strategically broaden its overall semiconductor presence and achieve its goal of leading the global semiconductor market. hynix maintains worldwide development, manufacturing, sales and marketing facilities.
