Press Release

hynix Introduces Chip-Scale-Packaged DRAMs for Portable Applications

By August 8, 2001 December 7th, 2020 No Comments

Seoul, Korea, August 08, 2001

hynix Semiconductor America Inc. today announced the introduction of several high density DRAMs available in a FBGA (Fine pitched Ball-Grid-Array) package type.

This new CSP (Chip Scale Package) is targeted specifically to meet the needs of customers utilizing small form factor packaging in applications such as PDAs, notebook PCs, smart phones, digital video and still cameras and wireless communications. hynix is offering the 128M (8M x 16) SDRAM in a FBGA package with either a 2.5 or 3.3-volt power supply. The 3.3-volt version is generally used in PDAs and notebooks, while the 2.5-volt version extends the battery life and is a more practical solution for smart phones and later PDA models. The 1M x 16 SDRAM and the 4M x 16 SDRAM will also be offered in a FBGA package, as solutions for consumer electronic applications such as digital still cameras and digital video cameras.

“Different applications require slightly different packages and features,” said Arun Kamat, Director of Strategic Marketing at hynix. “We are offering the customer a complete product portfolio from which to select.” The FBGA features very small package sizes of 85 – 143 mm2, a height of less than 1mm and a ball pitch of 0.8mm, making it the smallest, high reliability package for DRAMs, and which meets JEDEC specifications. Samples of the 8M x 16 Low-Power SDRAM are available now with volume production planned this quarter. hynix plans to offer other higher density SDRAM multi-chip CSP solutions later in the third quarter.