Seoul, Korea, December 5, 2000 – Hyundai Electronics Industries Co., Ltd. (HEI) announced yesterday that it has developed a micro semiconductor module for 256MB applicable to notebook computers and mobile telecommunications systems. HEI worked jointly with U.S.-based FormFactor Corp. of Livermore, California, using Wafer Level Chip Scale Package (WLCSP) technology to develop this new product. WLCSP enables the semiconductor package to be no larger than the chip itself. Compared with conventional Thin Small Outline Package (TSOP) technology which loads only 8 units (128MB) per module, WLCSP allows for double-density, loading 16 units (256MB total) in the same space. Thanks to WLCSP, each wafer die contains a complete package, with each die then separated by sawing. FormFactor licensed their patented MicroSpring contact to Hyundai earlier this year for use in the wafer level packaging technology utilized by HEI. The MicroSpring contacts are fabricated directly onto the DRAM wafers. The die can then be tested at the whole-wafer level, or in singulated Chip Scale Package (CSP) form. The tested die are then assembled into memory modules by re-using the same MicroSpring contact acting as the chip-to-board interconnect. HEI has cut costs by reducing the board loading space to 29% of previous requirements. A corresponding decrease in manufacturing lead-time is expected since packaging is completed at the wafer stage, eliminating subsequent assembly processes. The operating frequency and signal setup time of the new module shows improved ranges when compared to TSOP packaged modules. Finally, heat generated during operation is more quickly dissipated, thus protecting the chip and improving product performance. The WLCSP technology is also applicable to DRAM, SRAM, and Flash memory. It makes the shortest electronic connection between the memory unit and the board in a package no larger than a single chip, making it applicable as a next generation packaging solution suitable to high speed memory applications such as Rambus DRAM, DDR SDRAM as well as notebook computers and mobile telecommunications products. HEI plans to distribute engineering samples for adaptability evaluation of the new micro semiconductor module for 256MB by January 2001. About Hyundai Electronics Industries Co., Ltd. Hyundai Electronics Industries Co., Ltd. (HEI) of Ichon, Korea is an industry leader in the development, sales, marketing, and distribution of high-quality Semiconductors (including DRAM, SRAM, Flash memory, and System IC devices), Telecommunications, and Liquid Crystal Displays. The Semiconductor Group of Hyundai Electronics is the world’s largest DRAM supplier with eleven semiconductor manufacturing facilities worldwide, and production capacity of over 300,000 wafer starts per month. In addition, Hyundai is expanding its System IC business unit with leading technology and added deep-submicron foundry services to strategically broaden its overall semiconductor presence and achieve its goal of leading the global semiconductor market. Based in Korea, HEI maintains development, manufacturing, sales, and marketing facilities strategically located worldwide. Hyundai Electronics America (HEA) is a U.S. subsidiary of Hyundai Electronics Industries Co., Ltd. HEA is headquartered at 3101 North First Street, San Jose, CA 95134. More information on Hyundai Electronics America and its products is available from the company’s web site at http://www.hea.com. More information on FormFactor, Corp. and its products is available from that company’s web site at http://www.formfactor.com.
– Hyundai Electronics Industries Co., Ltd. (HEI) announced yesterday that it has developed a micro semiconductor module for 256MB applicable to notebook computers and mobile telecommunications systems.
