Culture & Peoplefeatured Top Team Insights: “Overcome Inertia With Innovation”, AI Infra Head Justin Kim’s Strategy in the AI Era The SK hynix Newsroom is launching a series of interviews with the Top Team—the executives… February 7, 2024 user Love0
Culture & Peoplefeatured New Leadership Spotlight: SK hynix’s First Female Research Fellow, Vice President Oh Haesoon, on Advancing NAND Flash Oh Haesoon broke new ground at the end of 2023 when she was appointed SK… January 29, 2024 user Love0
ESGfeatured Our ESG Progress, Visualized: Achieving Stakeholder Satisfaction Through Corporate Governance December 22, 2023 user Love2
Technologyfeatured Semiconductor Back-End Process Episode 11: Reliability Tests and Standards for Semiconductor Packages This series has examined the semiconductor back-end process in detail, covering everything from the different… December 20, 2023 user Love1
Technologyfeatured [Tech Pathfinder] How SK hynix’s Advanced 4D NAND Technologies Are Overcoming Stacking Limitations At the Flash Memory Summit (FMS) 2023 in August, SK hynix unveiled samples of the… December 19, 2023 user Love0
ESGfeatured Innovative Minds, Sustainable Solutions: The Journey of Recycling CMP Pads Consumable materials essential for semiconductor production such as wafers, slurries1, and pads are disposed of… December 12, 2023 user Love2
Technologyfeatured Semiconductor Back-End Process Episode 10: Exploring the Roles of Materials in Wafer-Level Semiconductor Packaging Following the previous episode which covered the materials that make up conventional packages, this article… December 11, 2023 user Love1
Opinionfeatured Crystalline IGZO Transistors With High Thermal Stability Show Promise for Next-Gen Memory Channels Amorphous InGaZnO1 (a-IGZO)-based thin-film transistors2 (TFT) have shown potential as stackable channel materials for next-generation memory solutions… November 30, 2023 user Love1
