ESGfeatured Our ESG Progress, Visualized: How SK hynix’s Sustainability Efforts Are Building a Better World November 1, 2023 user Love2
Opinionfeatured 3D Fe-NAND to Surpass 3D CTN Memory Following Cell Stacking Breakthrough Conventional 3D NAND memory stores data by trapping charges in the silicon nitride film known… October 31, 2023 user Love1
Opinionfeatured Enabling Nanoscale Device Fabrication Through Area-Selective Atomic Layer Deposition Semiconductor device scaling has brought about huge increases in transistor density, enabling the development of… October 23, 2023 user Love1
Culture & Peoplefeatured [SK hynix’s 40th Anniversary] CEO Kwak Noh-Jung Says Company to Become Specialty Semiconductor Memory Provider for the AI Era As the nature of business changes in the age of AI, SK hynix President and… October 10, 2023 user Love0
Technologyfeatured Semiconductor Back-End Process Episode 8: Exploring the Process Stages of Different Wafer-Level Packages Following an introduction to the basic process of assembling a wafer-level package in the previous… October 5, 2023 user Love0
Opinionfeatured SK hynix’s Evolution in CIS HDR Technology and Future Outlook While smartphone cameras have improved over the years, they still lag behind DSLR cameras in… September 26, 2023 user Love2
Opinionfeatured Beyond 20nm 3DXP: Why Selector-Only Memory is the Future for Ultra-Fine Processes Considerable research has been conducted on developing emerging memories to create a high-performance and cost-effective… September 21, 2023 user Love1
ESGfeatured Our ESG Progress, Visualized: SK hynix’s Innovations for a Greener Environment September 11, 2023 user Love2
Technologyfeatured Semiconductor Back-End Process Episode 7: The Wafer-Level Packaging Process Following on from the previous article which summarized the assembly process for conventional packages, this… September 4, 2023 user Love1
