DTW 2024: SK hynix & Dell Technologies Present the Future of AI Memory

SK hynix’s booth at DTW 2024

 

SK hynix is presenting its next-generation AI memory solutions at Dell Technologies World (DTW) 2024 in the heart of Las Vegas from May 20–23. Hosted annually by Dell Technologies, DTW welcomes some of the world’s biggest tech companies to highlight their latest developments, strategies, and visions. In line with DTW 2024’s theme “Accelerate AI Adoption to Unlock Innovation,” SK hynix is showcasing its advanced AI memory and demonstrating these solutions with Dell Technologies’ systems—underlining its strong partnership with the host.

SK hynix showcasing its next-generation AI memory solutions at the event

 

AI Solutions Set to Lead the Future Memory Ecosystem

Having participated in DTW since 2019, SK hynix has returned to emphasize the power of its high-performance AI memory products including its SSD, HBM¹, and CXL^®2 solutions.

¹High Bandwidth Memory (HBM): A high-value, high-performance product that revolutionizes data processing speeds by connecting multiple DRAM chips with through-silicon via (TSV).
²Compute Express Link^® (CXL^®): A PCIe-based next-generation interconnect protocol on which high-performance computing systems are based.

SK hynix’s cSSDs which show good compatibility with Dell PCs

 

The company is displaying its leading enterprise SSD (eSSD) solutions with Dell Technologies’ systems. These include the PCle³ Gen5-based PS1010 and PEB110, which showed positive results with Dell PowerEdge servers. SK hynix is also presenting its latest power-efficient and rapid server DRAM solutions, MCR DIMM⁴ and RDIMM⁵, which are suited for AI computing in high-performance servers.

Regarding client SSD (cSSD) products, PCB01⁶ boasted strong performance with Dell Alienware gaming PCs. Compared to the previous generations of cSSDs that includes PC801 and PC711, PCB01 offers significant enhancements in speed, quality, and power efficiency.

³Peripheral Component Interconnect Express (PCIe): A serial-structured, high-speed I/O interface used in the mainboard of digital devices.
⁴Multiplexer Combined Ranks Dual In-line Memory Module (MCR DIMM): A module product with multiple DRAMs bonded to a motherboard in which two ranks—basic information processing units—operate simultaneously, resulting in improved speed.
⁵Registered Dual In-line Memory Module (RDIMM): A high-density memory module used in servers and other applications to vertically connect DRAM dies.
⁶PCB01: A PCIe fifth-generation SSD that doubles the speed specifications of its previous generation, enabling the loading of large language models required for AI learning and inference in less than one second.

SK hynix’s latest memory products including LPCAMM2 and HBM3E on display

 

In addition to demonstrations, SK hynix is displaying some of its other next-generation AI memory products. These include LPCAMM2⁷, a solution optimized for on-device AI which offers performance levels equivalent to two DDR5⁸ SODIMMs⁹. The company’s industry-leading HBM3E, which provides exceptional processing speed, capacity, and heat dissipation, is also being presented alongside its corresponding device—H100 GPU.

⁷Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that offers power efficiency and high performance as well as space savings.
⁸Double Data Rate 5 (DDR5): A server DRAM that effectively handles the increasing demands of larger and more complex data workloads by offering enhanced bandwidth and power efficiency compared to the previous generation, DDR4.
⁹Small Outline Dual Inline Memory Module (SODIMM): A server DRAM smaller than the regular DIMM used in desktop PCs.

SK hynix’s CXL^® product CMM-DDR5 can expand system bandwidth and capacity

 

As another key technology for the AI era, CXL^® is highlighted through a demonstration of the company’s CXL^® Memory Module-DDR5 (CMM-DDR5) with Intel’s server. CMM-DDR5 has attracted attention for its ability to expand system bandwidth and capacity compared to systems only equipped with DDR5 DRAM.

“Dell Technologies is a strong supporter of the CXL^® ecosystem and an advocate of driving CXL^®-based memory standards throughout the industry,” said a Dell Technologies official. “We believe that CXL^®-based memory will prove to be valuable for systems providers and customers, and we are therefore excited to see the product demonstrations of SK hynix’s CMM-DDR5.”

Additionally, the synergy between SK hynix and its U.S. subsidiary Solidigm is highlighted as Solidigm’s SSD is also on display at the booth, which is operated by both companies.

Eung-bo Shim presenting about the impact of CXL^® memory solutions on the memory ecosystem

 

On the first day of the conference, Technical Leader Eung-bo Shim of the Next-Gen Memory & Storage team gave a talk on how CXL^® memory solutions will pave the way to the future memory ecosystem infrastructure. Such presentation sessions are expected to further the dialogue between SK hynix, its partners, and fellow industry players as the company aims to realize a memory-centric world in the AI era.

Advancing the Partnership With Dell Technologies in the AI Era

As leaders in their respective fields, SK hynix and Dell Technologies have formed a strong partnership that promises more advanced innovations in the future. Both companies are strengthening their efforts in the AI era, building anticipation for further collaborations that will realize faster AI adoption. Looking ahead, SK hynix remains committed to strengthening partnerships that will solidify its AI memory leadership.