Global No.1 AI Memory Solution Provider SK hynix Showcases Its 40-Year History & Road Ahead at SEDEX 2023

 

SK hynix participated in Semiconductor Exhibition (SEDEX) 2023 at Seoul’s COEX from October 25–27 to showcase its advanced memory products and technologies which are leading the AI era.

Hosted by the Korea Semiconductor Industry Association (KSIA), SEDEX is the country’s largest semiconductor exhibition which brings together all areas of the industry including companies that produce semiconductor materials, components, and equipment. For this 25^th SEDEX, a record 320 companies, organizations, and schools participated under the theme of “AI, Semiconductor Innovation, and the Power to Connect the Future”.

Figure 1. Visitors at SK hynix’s booth discovering the company’s technologies and products

 

To commemorate its 40^th anniversary, SK hynix presented its products under the theme “After 40 Years of Tenacious Commitment, Becoming the Global No.1 AI Memory Solution Provider.” The booth was separated into six zones that showcased its next-generation memory solutions for AI, server products, brand SSDs, SAPEON¹ AI chip, CMOS image sensors (CIS)², and sustainable social value (SV) initiatives, respectively. In addition, a digital wall featuring a timeline of the company’s past highlighted significant moments from its 40-year history.

¹SAPEON: An AI startup jointly founded by SK hynix, SK Telecom, and SK Square. The company has developed the SAPEON AI processor for data centers which offers rapid deep learning computation speed and low-power consumption.

²CMOS Image Sensor (CIS): A sensor that converts the color and intensity of light into electrical signals and passes them on to a processing unit. Serves as the “eyes” of digital devices such as smartphones, tablets, etc.

Figure 2. SK hynix’s President and CEO Kwak Noh-Jung (front, center) visits the company’s booth during SEDEX 2023

 

SK hynix President and CEO Kwak Noh-Jung, who is also the president of KSIA, took a tour of 18 exhibition spaces including SK hynix’s booth, and showed his support for the development of the country’s semiconductor industry.

SK hynix’s newsroom also visited the company’s booth to take a closer look at the advanced memory products and AI solution on display, as well as its SV creation activities.

SK hynix’s Stellar Moments Presented on Its History Wall

Amidst SK hynix’s six zones that displayed its products, technologies, and sustainability management, the center of the booth featured a digital history wall. Commemorating the company’s 40^th anniversary, the wall highlighted key moments from the company’s establishment in 1983 to today.

Those key milestones include: the production of South Korea’s first 16K SRAM in 1984; the launch of the Blue Chip project in 2001 that modernized manufacturing processes with minimal expenditure; the launch of the rebranded SK hynix in 2012; record operating profits in 2018; and the start of construction on the Yongin semiconductor cluster in 2022.

Figure 3. The “40th Anniversary Wall” zone showcasing SK hynix’s major achievements

 

The wall also provided a glimpse into SK hynix’s vision of the Icheon-Cheongju-Yongin fab triangle. With the Yongin cluster planned to become operational in 2027, the company plans to optimize its production, increase its business efficiency, and transform South Korea into a global semiconductor mecca.

Showcasing Globally Leading AI Memory Technologies

With the emergence of generative AI services such as ChatGPT, semiconductor memory companies are rushing to develop AI technologies and services to meet the unprecedented demand for AI solutions. As such, SK hynix introduced two AI memory products based on HBM³ and AiM⁴ in the “Global No.1 AI Memory” zone.

³High Bandwidth Memory (HBM): A high-value, high-performance product that possesses much higher data processing speeds compared to existing DRAMs by vertically connecting multiple DRAMs with through-silicon via (TSV).

⁴Accelerator in Memory (AiM): SK hynix’s PIM semiconductor product name, which includes GDDR6-AiM.

HBM3E boasts industry-leading data processing speeds of 1.15 terabytes (TB) per second and is optimized to process large amounts of data for applications such as AI computing. At the booth, a video showing its improvements over its predecessor was played alongside a product sample.

AiMX accelerates AI processing by adding computational capabilities to memory products. Consequently, it has the ability to run large-scale language models at high speed and low power. Visitors to the booth were able to see prototypes of both the PIM⁵-based GDDR6-AiM and the AiMX cards which incorporate GDDR6-AiM.

⁵Processing-In-Memory (PIM): A next-generation technology that adds computational capabilities to semiconductor memories to solve the problem of data movement congestion in AI and big data processing.

Figure 4. Visitors viewing various SK hynix products such as HBM3E and AiMX at the “Global No.1 AI Memory” zone

 

In the “Server Solution” zone, the company showcased DDR5 for servers and eSSD products. Optimized for improving AI performance, the products meet the server industry’s need for low-power, high-performance DRAMs, as well as the IT industry’s requirements for mass storage.

Other products such as the DDR5 chip that supports AI computing in high-performance servers were also on display. Crowd favorites included DDR5 RDIMM which features the 5th generation of the 10nm process technology and boasts speeds of more than 6,400 megabits per second (Mbps), and MCR DIMM which reaches speeds of more than 8 gigabits per second (Gbps).

Three types of eSSD were also displayed: the PCle (Peripheral Component Interconnect Express) Gen5-based PS1010 E3.S, PS1010 U.2 15mm, and PE9110 E1.S. These storage products attracted attention for their enhanced speed and durability that are optimal for big data and machine learning.

Figure 5. Visitors looking at DDR5, MCR DIMM, and eSSD products at the “Server Solution” zone

 

Exotic Beetle X31 Display and SV Activities Draw the Crowds

Beetle X31, a consumer SSD in the shape of an Egyptian scarab beetle, received positive reviews for its distinct design and its ability to maintain high performance levels while effectively dissipating heat. This “Brand SSD” zone was distinguishable from other exhibition spaces as it featured Egyptian hieroglyphics and art to highlight the exotic design of Beetle X31.

Figure 6. The Beetle X31 on display against an ancient Egyptian backdrop

 

In the “SAPEON” zone, samples of the SAPEON X220 AI chip were on display along with 5011Q, a CIS product that captures more light with large 1.0 micrometer (μm)-sized pixels. Unlike the conventional method of achieving high resolution by reducing the pixel size, 5011Q captures more light in large pixels to improve the image quality. At SEDEX 2023, SK hynix unveiled a mass-produced version of 5011Q for the first time.

Figure 7. Visitors viewing the latest semiconductor products including the SAPEON X220 AI chip and 5011Q CIS

 

In the “Social Value” zone, SK hynix presented its ESG activities and achievements that included its ongoing Eco Alliance⁶ operations, energy-efficient manufacturing, and water management practices. The zone also highlighted programs that contributed to SV creation and talent development. These included Hy-Five, which connects partnering companies with young jobseekers, and Hy-Po, which provides semiconductor internships to university students.

⁶Eco Alliance: An environmental union of semiconductor companies led by SK hynix and comprising leading semiconductor technology partner and member companies.

Figure 8. Visitors learning about SK hynix’s various ESG management activities at the “Social Value” zone

 

Meanwhile, SK hynix also organized fun activities for visitors. A quiz about the company and a semiconductor-themed pinball machine attracted crowds to the booth.

Figure 9. Visitors enjoying various events and games at SK hynix’s booth

 

Continuing a History of Innovation to Lead the AI Era

At SEDEX 2023, SK hynix showcased its 40-year history featuring a string of technological breakthroughs alongside its latest memory solutions. Having been a pioneer of the memory industry for decades, the company will continue this tradition of innovation as it looks set to lead the AI era for years to come.