News Highlights
- SK hynix to operate customer exhibition booth to enhance customer connection
- Unveils 16-layer HBM4 with 48 GB for the first time and showcases conventional and AI-focused products such as SOCAMM2 and LPDDR6
- With ‘AI System Demo Zone,’ visualizes custom HBM structure to present future technology
- Company to create new value based on differentiated memory solutions and close collaboration with customers
Seoul, January 6, 2026
SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it will open a customer exhibition booth at Venetian Expo and showcase its next-generation AI memory solutions at CES 2026, in Las Vegas from January 6 to 9 (local time).
The company said: “Under the theme ‘Innovative AI, Sustainable tomorrow,’ we plan to showcase a wide range of next-generation memory solutions optimized for AI and will work closely with customers to create new value in the AI era.”
SK hynix has previously operated both a SK Group joint exhibition and a customer exhibition booth at CES. This year, the company will focus on the customer exhibition booth to expand touchpoint with key customers to discuss potential collaboration.
The company showcases its 16-layer HBM4 with 48 GB, a next-generation HBM product, for the first time during the exhibition. It is the next-generation product of the 12-layer HBM4 with 36 GB, which demonstrated the industry’s fastest speed of 11.7 Gbps, and is under development aligned with customers’ schedules.
The 12-layer HBM3E with 36 GB, which will drive the market this year, will also be presented. In particular, the company will jointly exhibit GPU modules that have adopted HBM3E for AI servers with a customer and demonstrate its role within AI systems.
In addition to HBM, the company plans to showcase SOCAMM2, a low-power memory module specialized for AI servers, to demonstrate the competitiveness of its diverse product portfolio in response to the rapidly growing demand for AI servers.
Also, SK hynix will exhibit its lineup of conventional memory products optimized for AI, demonstrating its technological leadership across the market. The company will present its LPDDR6, optimized for on-device AI, offering significantly improved data processing speed and power efficiency compared to previous generations.
In NAND flash, the company will present its 321-layer 2 Tb QLC product, optimized for ultra-high capacity eSSDs, as demand surges from rapid expansion of AI data centers. With best-in-industry integration, this product significantly improves power efficiency and performance compared to previous generation QLC products, making it particularly advantageous in AI data center environments where lower power consumption is needed.
The company will set up an ‘AI System Demo Zone’ where visitors can experience how its AI system memory solutions that are being prepared for the future interconnect to form an AI ecosystem.
In this zone, the company will present cHBM1 optimized for specific AI chips or systems, PIM2-based AiMX3, CuD4 which conducts computing in memory, CMM-Ax5 thatintegrates computing capabilities into CXL6 memory, and Data-aware CSD7.
1Custom HBM (cHBM): A product that integrates some functions located in GPUs and ASICs to the HBM base die, reflecting customer requirements. As the AI market evolves from conventional to inference efficiency and optimization, HBM is also evolving from conventional products to customized solutions. This solution is expected to enhance the performance of GPUs and ASICs while reducing the power required to transfer data with HBM, leading to improved overall system efficiency.
2Processing-In-Memory (PIM): A next-generation memory technology that integrates computational capabilities into memory, addressing data movement bottlenecks in AI and big data processing.
3Accelerator-in-Memory based Accelerator (AiMX): SK hynix’s accelerator card prototype featuring a GDDR6-AiM chip which is specialized for large language models (LLMs).
4Compute-using-DRAM (CuD): A next generation product that contributes to accelerating data processing by performing simple computations within the cell.
5CXL Memory Module-Accelerator xPU (CMM-Ax): A solution that adds computational functionality to CXL’s advantage of expanding high-capacity memory, contributing to improving performance and energy efficiency of the next-generation server platforms.
6Compute Express Link (CXL): A next-generation interface that efficiently connects CPU, GPU, memory, and other components in high-performance computing systems to support massive, ultra-fast computation. Based on the PCIe interface, CXL allows fast data transfer and has pooling capabilities to efficiently utilize memory.
7Computational Storage Drive (CSD): A storage device that can process data on its own.
For cHBM(Custom HBM), due to specific interest from customers, a large-scale mock-up has been prepared to allow visitors to witness first-hand its innovative structure. As the competition of the AI market shifts from mere performance to inference efficiency and cost optimization, this visualizes a new design approach that integrates part of computation and control functions into HBM which was handled by conventional GPU or ASIC in the past.
“As innovation triggered by AI accelerates further, customers’ technical requirements are evolving rapidly,” Justin Kim, President & Head of AI Infra at SK hynix, said. “We will meet customer needs with differentiated memory solutions. With close cooperation with customers, the company will create new value to contribute to the advancement of the AI ecosystem.”
About SK hynix Inc.
SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”) and flash memory chips (“NAND flash”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.
Media Contact
SK hynix Inc.
Global Public Relations
Technical Leader
Minseok Jang, Sooyeon Lee
E-Mail: global_pr@skhynix.com
