Press Releasefeatured SK hynix Signs Preliminary Memorandum of Terms with U.S. Department of Commerce for Advanced Packaging Facility in Indiana Seoul, August 6, 2024 SK hynix Inc. (or “the company”, www.skhynix.com) announced today it has… August 6, 2024 user Love0
Culture & Peoplefeatured SK hynix VP Gyujei Lee Targets Continued HBM Success With Next-Gen Packaging Technology AI has been propelled to new heights by HBM1, the ultra-fast DRAM which has continually… August 5, 2024 user Love1
Culture & Peoplefeatured Top Team Insights: “Embrace Limitless Challenges to Strengthen Advanced Packaging Tech,” Motto of P&T Head Woojin Choi The SK hynix Newsroom is running a series of interviews with the Top Team—the executives… April 11, 2024 user Love3
Press Releasefeatured SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana News Highlights To build advanced packaging facility for next-generation HBM, while collaborating with Purdue University… April 3, 2024 user Love2
Culture & Peoplefeatured New Leadership Spotlight: Vice President Hoyoung Son Targets SK hynix’s Evolution Into Total AI Memory Provider Through Advanced Packaging Tech SK hynix has ramped up preparations for its evolution in the AI era with a… February 27, 2024 user Love1
