Culture & Peoplefeatured SK hynix VP Gyujei Lee Targets Continued HBM Success With Next-Gen Packaging Technology AI has been propelled to new heights by HBM1, the ultra-fast DRAM which has continually… August 5, 2024 user Love1
Technologyfeatured [Rulebreakers’ Revolutions] How MR-MUF’s Heat Control Breakthrough Elevated HBM to New Heights Challenging convention, defying limits, and aiming for the skies, rulebreakers remake the rules in their… July 30, 2024 user Love2
Culture & Peoplefeatured Top Team Insights: “Embrace Limitless Challenges to Strengthen Advanced Packaging Tech,” Motto of P&T Head Woojin Choi The SK hynix Newsroom is running a series of interviews with the Top Team—the executives… April 11, 2024 user Love3
Press Releasefeatured SK hynix Begins Volume Production of Industry’s First HBM3E News Highlights SK hynix extends success of HBM3, marking first case in industry to mass… March 19, 2024 user Love2
Culture & Peoplefeatured Strengthening HBM Market Leadership: Meet the SK hynix Team Behind the World’s First 12-Layer HBM3 "AI models continue to grow and drive demand for large memory capacity. We welcome the… May 19, 2023 user Love0
Press Releasefeatured SK hynix Develops Industry’s First 12-Layer HBM3, Provides Samples to Customers News Highlights Develops HBM3 product with industry’s largest 24GB memory capacity; customers’ performance evaluation of… April 20, 2023 user Love1
Opinionfeatured The Value of Semiconductor Packaging Technology in the Era of Heterogeneous Integration In recent years, semiconductor companies are placing increased focus on packaging technology as it offers… February 9, 2023 user Love1
