Press Releasefeatured SK hynix Begins Volume Production of the World’s First 12-Layer HBM3E News Highlights The company plans to supply the highest-performing, highest-capacity 12-layer HBM3E to customers by… September 26, 2024 user Love0
Culture & Peoplefeatured SK hynix VP Gyujei Lee Targets Continued HBM Success With Next-Gen Packaging Technology AI has been propelled to new heights by HBM1, the ultra-fast DRAM which has continually… August 5, 2024 user Love1
Culture & Peoplefeatured Top Team Insights: “Embrace Limitless Challenges to Strengthen Advanced Packaging Tech,” Motto of P&T Head Woojin Choi The SK hynix Newsroom is running a series of interviews with the Top Team—the executives… April 11, 2024 user Love3
Culture & Peoplefeatured New Leadership Spotlight: Vice President Hoyoung Son Targets SK hynix’s Evolution Into Total AI Memory Provider Through Advanced Packaging Tech SK hynix has ramped up preparations for its evolution in the AI era with a… February 27, 2024 user Love1
Technologyfeatured Semiconductor Back-End Process Episode 8: Exploring the Process Stages of Different Wafer-Level Packages Following an introduction to the basic process of assembling a wafer-level package in the previous… October 5, 2023 user Love0
Opinionfeatured The Role of Interconnection in the Evolution of Advanced Packaging Technology Although technological advancements in the semiconductor industry are reaching their limits and development costs are… August 18, 2023 user Love1
Technologyfeatured Semiconductor Back-End Process Episode 4: Understanding the Different Types of Semiconductor Packages, Part 2 Continuing from the previous episode which introduced conventional and wafer-level packages, this article will explore… June 27, 2023 user Love97
Press Releasefeatured SK hynix Develops Industry’s First 12-Layer HBM3, Provides Samples to Customers News Highlights Develops HBM3 product with industry’s largest 24GB memory capacity; customers’ performance evaluation of… April 20, 2023 user Love1
Technology Packaging Technology, a Key to Next-Generation Semiconductor Competitiveness, How Far Has SK hynix Come? With the opening of the 4th industrial revolution era and the spread of high technologies… June 3, 2021 user Love0
Opinion Creating New Values in DRAM Using Through-Silicon-Via Technology for Continued Scaling in Memory System Performance and Capacity With the recent rapid growth and vast expansion of artificial intelligence (AI), machine learning, high-… November 20, 2019 user Love0
