SK Group Chairman Chey Tae-won met with TSMC Chairman and CEO C.C. Wei in Taiwan on Jun. 3 (local time), where the two leaders exchanged views on the latest trends in next-generation AI technologies and held in-depth discussions on how to jointly shape the future of the AI ecosystem.
The meeting marked the first in-person encounter between the two chairmen since June 2024, reaffirming the strong mutual trust the companies have built over time. Both sides agreed to further broaden their collaboration across next-generation HBM development and advanced packaging, in a concerted effort to stay ahead in the fast-evolving AI market.
Amid growing supply bottlenecks across the global AI value chain, the pairing of SK hynix`s world-leading AI memory technology with TSMC’s foundry capabilities is expected to offer a practical and scalable solution.
Looking ahead, the two companies plan to accelerate efforts to strengthen their position in the custom AI memory market, targeting the diverse and growing demands of global big tech customers. Through its partnership with TSMC, SK hynix aims to deliver high-performance products at the right time and solidify its leadership position in the AI era.
