SK hynix’s booth at CXL DevCon 2024 SK hynix participated in the first-ever Compute Express Link Consortium Developers Conference (CXL DevCon) held in Santa Clara, California from April 30–May…
May 2, 2024
SK hynix’s booth at the TSMC 2024 Technology Symposium SK hynix showcased its next-generation technologies and strengthened key partnerships at the TSMC 2024 Technology Symposium held in Santa Clara,…
April 25, 2024
Revenues at 12.43 trillion won, operating profit at 2.886 trillion won, net profit at 1.917 trillion won 1Q revenues all-time high, operating profit 2nd highest for 1Q result NAND turns…
April 24, 2024
News Highlights Investment of more than 20 trillion won aimed at preemptively responding to soaring demand for HBM Plans to complete construction of new fab in November 2025 for early…
April 24, 2024
Books are great companions. They raise and answer questions. Open up new worlds and offer us the chance to escape our own. Provide us with knowledge and entertainment. Perhaps above…
April 23, 2024
Jaeyun Yi was appointed as the head of SK hynix’s Global Revolutionary Technology Center (RTC), which conducts research and development of next-generation semiconductors, at the end of 2023. As a…
April 22, 2024
News Highlights SK hynix and TSMC sign MOU to collaborate on HBM4 development and next-generation packaging technology SK hynix will adopt TSMC’s cutting-edge foundry process to advance HBM4 performance Product…
April 19, 2024
SK hynix received the Best ESG Bond award at the 2023 IFR Asia Awards for its innovative USD 2.5 billion triple-tranche combination trade. Held in Hong Kong by International Financing…
April 17, 2024
SK hynix Inc. will present its first quarter earnings on April 25th, 2024 (Thu). A press release announcing the earnings will be released before 9:00 a.m. on the same day….
April 16, 2024
The SK hynix Newsroom is running a series of interviews with the Top Team—the executives in charge of the company’s major business divisions. This series provides insights into the business…
April 11, 2024
News Highlights To build advanced packaging facility for next-generation HBM, while collaborating with Purdue University for R&D Selects Indiana for strong support provided by the state and local government, infrastructure…
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