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[Brand Video] Who Are the Rulebreakers?

[We Do Future Technology] Become a Semiconductor Expert with SK hynix – UFS

[We Do Future Technology] Become a Semiconductor Expert with SK hynix – AI Semiconductors

[We Do Future Technology] Become a Semiconductor Expert with SK hynix – HBM

Description of HKMG Technology

SK hynix’s LPDDR5 Lineup Made With the HKMG Process

PVT-aware timing optimization technology

Machine learning-based signal line optimization

SK hynix’s timeline towards developing the world’s first-ever and finest LPDDR

SK-hynix_NAND development history_infographic

Concept diagram representing the evolution from 2D to 4D NAND (2)

Concept diagram representing the evolution from 2D to 4D NAND (1)

[SEDEX 2022] Visitors enjoying various quiz events and games at the SK hynix booth

[SEDEX 2022] Communication zone showcasing SK hynix’s visual media and goods

[SEDEX 2022] Communication zone showcasing SK hynix’s visual media and goods

[SEDEX 2022] Crowd visiting Technology zone to experience various exhibits

[SEDEX 2022] Crowd visiting Technology zone to experience various exhibits

[SEDEX 2022] Crowd visiting Technology zone to experience various exhibits

[SEDEX 2022] Crowd visiting Technology zone to experience various exhibits

[SEDEX 2022] Sculptures showcase the evolution of DRAM and NAND Flash

[SEDEX 2022] Kwak Noh-Jung, President and co-CEO, is seen during a visit to the memory centric universe zone

[SEDEX 2022] Kwak Noh-Jung, President and co-CEO, is seen during a visit to the memory centric universe zone

[SEDEX 2022] We Do Technology, an SK hynix story designed to create a better world

[SEDEX 2022] We Do Technology, an SK hynix story designed to create a better world

FMS 2022 Reflections: SK hynix Poised to Become Next Generation 4D NAND Leader

FMS 2022 Reflections: SK hynix Poised to Become Next Generation 4D NAND Leader

FMS 2022 Reflections: SK hynix Poised to Become Next Generation 4D NAND Leader

FMS 2022 Reflections: SK hynix Poised to Become Next Generation 4D NAND Leader

SK hynix's 4D NAND Development History

FMS 2022 Reflections: SK hynix Poised to Become Next Generation 4D NAND Leader

FMS 2022 Reflections: SK hynix Poised to Become Next Generation 4D NAND Leader

FMS 2022 Reflections: SK hynix Poised to Become Next Generation 4D NAND Leader

FMS 2022 Reflections: SK hynix Poised to Become Next Generation 4D NAND Leader

PRISM ESG Framework - Innovate Technology

SK hynix Unlocks NAND Memory Potential with Innovative Products at FMS 2022

SK hynix Unlocks NAND Memory Potential with Innovative Products at FMS 2022

SK hynix Unlocks NAND Memory Potential with Innovative Products at FMS 2022

SK hynix Unlocks NAND Memory Potential with Innovative Products at FMS 2022

SK hynix Unlocks NAND Memory Potential with Innovative Products at FMS 2022

SK hynix Unlocks NAND Memory Potential with Innovative Products at FMS 2022

SK hynix Unlocks NAND Memory Potential with Innovative Products at FMS 2022

SK hynix Unlocks NAND Memory Potential with Innovative Products at FMS 2022

SK hynix Unlocks NAND Memory Potential with Innovative Products at FMS 2022

SK hynix and Solidigm Take Partnership Further by Attending HPE Discover 2022 Together

SK hynix and Solidigm Take Partnership Further by Attending HPE Discover 2022 Together

SK hynix and Solidigm Take Partnership Further by Attending HPE Discover 2022 Together

SK hynix and Solidigm Take Partnership Further by Attending HPE Discover 2022 Together

SK hynix and Solidigm Take Partnership Further by Attending HPE Discover 2022 Together

SK hynix and Solidigm Take Partnership Further by Attending HPE Discover 2022 Together

Concepts of how SK hynix converges safety and technologies

Using Technology to Create a Safer Workplace

SK hynix Chongqing subsidiary helping provide safe schooling and housing support

Volunteers lending a hand at the Second Harvest food bank

Volunteers lending a hand at the Second Harvest food bank

MOU signing to build smart farms and create jobs for people with disabilities

Shared booth of SK hynix and Solidigm at Dell Technologies World 2022

SK hynix and Solidigm Make First Joint Appearance at Dell Technologies World 2022

SK hynix showcasing its data center solutions and green technology at Dell Technologies World 2022 (1)

SK hynix showcasing its data center solutions and green technology at Dell Technologies World 2022 (2)

SK hynix showcasing its data center solutions and green technology at Dell Technologies World 2022 (3)

Solidigm promoting its industry-leading QLC portfolio at Dell Technologies World 2022 (1)

Solidigm promoting its industry-leading QLC portfolio at Dell Technologies World 2022 (2)

Jin Lim, Vice President at SK hynix presenting at Dell Technologies World 2022

May your Christmas be merry and bright with SK hynix

Let’s Hit the Road: How Autonomous Vehicles are Making “10 and 2” Driving Obsolete

A Day in the Life: Semiconductor Technology’s Impact on E-commerce

[SK hynix brand SSD] THE DAY HAS COME

A look back on the past 10 years of SK hynix

Noh-Jung Kwak, President and Chief Safety, Product & Production Officer

Kevin (Jongwon) Noh, President and Chief Marketing Officer (CMO)

Park Jung-ho, Vice Chairman and CEO of SK Square and SK hynix

SK Telecom, SK Square and SK hynix Launch 'SK ICT Alliance' for Synergies

16TB E1.L eSSD, a standard form factor for next-generation data centers

Solution products based on 128-layer 1Tb 4D NAND (Clockwise from top left) 16TB E1.L eSSD, 2TB cSSD, 1TB UFS 3.1

World’s first 128-layer 1Tb 4D NAND Flash by SK hynix

[SK hynix Brand Film] Always with Our Lives

We are looking for a person who has a "Tenacity Syndrome."

AI Chip Market Outlook

Initial seed-wafer and epitaxial layer

Digital to Analog Converter

Yearly comparison of density increase trends between DRAM and NAND

Lowering cost per chip by increasing number of chips per wafer @ number of chips and price set arbitrarily

DRAM Products with TSV Technology Applied

Fan in and Fan out Wafer Level Package

Concept of aspect ratio and changes in aspect ratio

Graph Visualizing Avalanche Multiplication and the Structure of SPAD

Trend of technological development of deposition and etching

Strengths and weaknesses of wet etching and dry etching

SASB Standards

Correlation of insulating and conductive functions of semiconductors

Internal structure of TR and resistivity

Comparison between hemetic method and molding method

Global Green Bond Issuance Status and Portion by ESg Bond Type

Process of wire bonding and flip chip bonding

Comparison_between_die_bonding_and_flip_chip_bonding

Attachment and dettachment of film during blade dicing

Existing blading dicing method and dicing before grinding method

Comparasion of conventional laser dicing method and laser stealth dicing method

Comparison of circut structure of MRAM STT-MRAM and SOT-MRAM

Operation of the Emissions Trading System

SK hynix_Structure comparison of conventional sensor and stack sensor

Footsteps of SK hynix’s Data Science Organization “Rooting AI Technologies in the Field”

Data Science Organization Operated with Internal and External Talents

“Performing Field Analysis and Technological Innovation Tasks”

process that changes the form of wafer and semiconductor

Tape lamination and wafer structure from the front side

SK hynix_Comparison of 2D-NAND and 3D-NAND

SK hynix_Concept diagram representing the evolution from 2D to 4D-NAND

Internal and external structure of semiconductor package

Diagram of package internal connection type, external connection type and mounting method

Comparison of wire bonding type and flip chip type

Types of external package type and mounting methods

SK hynix Estimated density and storage type of NAND Flash memory

SK Mobility Technology

Share of demand by major industries

Revolutionary Path and Evolutionary Path

Specifications of High Bandwidth Memory

The working Mechanisms of CIS and Human Eyes

SK hynix_FAB Constant Temperature Technology (1)

SK hynix_FAB Constant Temperature Technology (2)

On-Offline Courses

Obtained Zero Waste to Landfill Validation

SK hynix Evolution of CIS Pixel Technology

HBM Technology Roadmap

DBL, Double Bottom Line

4D NAND Flash